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公开(公告)号：US4640719A
公开(公告)日：1987-02-03
申请号：US750198
申请日：1985-07-01
IPC分类号： G01N21/88 , B23K1/00 , C09D9/00 , C11D7/50 , C23G1/00 , C23G1/24 , C23G5/024 , G01N21/956 , H05K3/26 , H05K3/28 , H05K3/34
CPC分类号： C23G5/024 , C09D9/00 , H05K3/26 , H05K3/288 , H05K2203/0769 , H05K2203/0783 , H05K2203/162 , H05K3/28 , H05K3/3452
摘要： Methods and compositions are provided for the removal of rosin soldering flux and adhesive tape residues from printed circuit and/or wiring boards, and for testing the quality of curing of U.V.-cured soldermask on such boards. The compositions of the invention contain terpene compounds, preferably in combination with terpene emulsifying surfactants to facilitate removal by rinsing in water.
摘要翻译： 提供了方法和组合物，用于从印刷电路板和/或布线板上去除松香焊剂和粘合带残留物，以及用于测试这种板上的紫外线固化的焊接材料的固化质量。 本发明的组合物包含萜烯化合物，优选与萜烯乳化表面活性剂组合以便于通过在水中漂洗来除去。
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2.发明授权Method for printed circuit board and/or printed wiring board soldermask testing 失效印刷电路板和/或印刷线路板焊接掩模测试方法
公开(公告)号：US4740247A
公开(公告)日：1988-04-26
申请号：US877930
申请日：1986-06-24
IPC分类号： G01N21/88 , B23K1/00 , C09D9/00 , C11D7/50 , C23G1/00 , C23G1/24 , C23G5/024 , G01N21/956 , H05K3/26 , H05K3/28 , H05K3/34 , B08B7/00 , B08B7/04
CPC分类号： C23G5/024 , C09D9/00 , H05K3/26 , H05K3/288 , H05K2203/0769 , H05K2203/0783 , H05K2203/162 , H05K3/28 , H05K3/3452
摘要： Methods and compositions are provided for the removal of rosin soldering flux and adhesive tape residues from printed circuit and/or wiring boards, and for testing the quality of curing of U.V.-cured soldermask on such boards. The compositions of the invention contain terpene compounds, preferably in combination with terpene emulsifying surfactants to facilitate removal by rinsing in water.
摘要翻译： 提供了方法和组合物，用于从印刷电路板和/或布线板上去除松香焊剂和粘合带残留物，以及用于测试这种板上的紫外线固化的焊接材料的固化质量。 本发明的组合物包含萜烯化合物，优选与萜烯乳化表面活性剂组合以便于通过在水中漂洗来除去。
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