利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

26 条记录 (耗时 0.021 秒)

    Neutral aqueous cleaning composition
    2.
    发明授权
    Neutral aqueous cleaning composition 失效
    中性水性清洁组合物

    公开(公告)号：US5705472A

    公开(公告)日：1998-01-06

    申请号：US503810

    申请日：1995-07-18

    申请人： Michael E. Hayes ,  Elizabeth A. Bivins ,  Jacquelyn B. Coleman

    发明人： Michael E. Hayes ,  Elizabeth A. Bivins ,  Jacquelyn B. Coleman

    IPC分类号： C11D1/58 ,  C11D1/66 ,  C11D1/72 ,  C11D1/835 ,  C11D3/20 ,  C11D11/00 ,  B08B3/04 ,  C11D3/43

    CPC分类号： C11D3/2068 ,  C11D1/835 ,  C11D11/0029 ,  C11D11/0035 ,  C11D1/58 ,  C11D1/667 ,  C11D1/72

    摘要： An aqueous cleaning composition having a pH of about 6 to about 8 and comprising a solution of the following ingredients: water, an organic solvent and an imidazoline-based cationic surfactant, each present in an amount effective to dissolve adherent soils from a substrate; and a nonionic surfactant in an amount sufficient to maintain said cationic surfactant in solution; and also a weak organic acid in an amount sufficient to impart to the composition said pH; wherein said composition is substantially free of any material which has an ozone-depletion factor of greater than about 0.15 and wherein said composition is substantially free of any material which would tend to form a solid with any of the ingredients comprising the composition, and its use to clean metallic and non-metallic surfaces.

    摘要翻译： 一种pH为约6至约8的水性清洁组合物，其包含以下成分的溶液：水，有机溶剂和咪唑啉类阳离子表面活性剂，其各自以有效溶解粘附的土壤的量来自底物; 和足以将所述阳离子表面活性剂保持在溶液中的量的非离子表面活性剂; 并且还具有足以赋予所述组合物所述pH的量的弱有机酸; 其中所述组合物基本上不含任何具有大于约0.15的臭氧消耗因子的材料，并且其中所述组合物基本上不含任何可能与包含所述组合物的任何成分形成固体的材料，其用途 清洁金属和非金属表面。

    Cleaning process including use of solvating and rinsing agents
    3.
    发明授权
    Cleaning process including use of solvating and rinsing agents 失效
    清洗过程包括使用溶剂和漂洗剂

    公开(公告)号：US5679175A

    公开(公告)日：1997-10-21

    申请号：US162176

    申请日：1993-12-14

    申请人： Michael E. Hayes ,  Donald P. Hosman ,  Kevin R. Hrebenar ,  Robert D. Sell

    发明人： Michael E. Hayes ,  Donald P. Hosman ,  Kevin R. Hrebenar ,  Robert D. Sell

    IPC分类号： B08B3/08 ,  B23K1/00 ,  C11D3/18 ,  C11D3/20 ,  C11D3/24 ,  C11D3/43 ,  C11D7/24 ,  C11D7/26 ,  C11D7/28 ,  C11D7/30 ,  C11D7/32 ,  C11D7/50 ,  C11D11/00 ,  C11D17/00 ,  C23G5/02 ,  C23G5/024 ,  C23G5/028 ,  C23G5/032 ,  H05K3/26 ,  B08B3/10

    CPC分类号： C11D7/261 ,  C11D11/0047 ,  C11D11/0064 ,  C11D3/43 ,  C11D7/5022 ,  C11D7/5027 ,  C23G5/02 ,  C23G5/024 ,  C23G5/02803 ,  C23G5/032 ,  H05K3/26 ,  C11D3/18 ,  C11D3/2003 ,  C11D3/24 ,  C11D3/245 ,  C11D7/24 ,  C11D7/266 ,  C11D7/28 ,  C11D7/3209 ,  C11D7/3281 ,  H05K2203/0766 ,  H05K2203/0783

    摘要： A process for removing soil from a substrate which includes the use of liquid cleaning composition including a solvating agent (for example, a monobasic ester) and a rinsing agent (for example, a perfluorocarbon), the solvating agent having: (i) a room temperature vapor pressure of no greater than about 40 mm Hg; and (ii) a solvating strength of no less than about 10; and the rinsing agent having: (iii) a room temperature vapor pressure of about 8 mm Hg to about 760 mm Hg; and (iv) an ozone depleting factor of no greater than about 0.15; wherein the ratio of the vapor pressure of the rinsing agent to the vapor pressure of the solvating agent is at least about 20 and such that, at the boiling temperature of the composition, the vapor space above the boiling composition would include the rinsing agent and be substantially free of the solvating agent, the process including immersing an article (for example, a printed circuit board having thereon solder flux) in the boiling composition, withdrawing the article from the composition and transferring it through the vapor space and into a container of relatively cool liquid rinsing agent from which it is withdrawn and transferred through vaporized rinsing agent and dried, and apparatus for carrying out the process.

    摘要翻译： PCT No.PCT / US92 / 04992 Sec。 371日期1993年12月14日第 102（e）日期1993年12月14日PCT提交1992年6月15日PCT公布。 公开号WO92 / 22678 日期1992年12月23日一种从基材除去土壤的方法，其包括使用包含溶剂化剂（例如一元酯）和漂洗剂（例如全氟化碳）的液体清洗组合物，所述溶剂化试剂具有： （i）室温蒸气压不大于约40mmHg; 和（ii）不低于约10的溶剂化强度; 和漂洗剂具有：（iii）约8mmHg至约760mm Hg的室温蒸气压; 和（iv）不大于约0.15的臭氧消耗因子; 其中所述漂洗剂的蒸气压与所述溶剂化物的蒸汽压的比率至少为约20，并且使得在所述组合物的沸点温度下，所述沸腾组合物之上的蒸汽空间将包括所述漂洗剂并且为 基本上不含溶剂化剂，该方法包括将制品（例如，其上具有助焊剂的印刷电路板）浸入沸腾组合物中，将制品从组合物中取出并将其转移通过蒸气空间并转移到相对较少的容器中 冷却液体冲洗剂，通过蒸发的漂洗剂将其从其中取出并转移并干燥，以及用于进行该方法的装置。

    Process for cleaning an oil contaminated vessel
    5.
    发明授权
    Process for cleaning an oil contaminated vessel 失效
    清洁油污染船只的过程

    公开(公告)号：US4592786A

    公开(公告)日：1986-06-03

    申请号：US649247

    申请日：1984-10-26

    申请人： Joseph L. Williams ,  John W. Sansing ,  Michael E. Hayes ,  James F. Deal

    发明人： Joseph L. Williams ,  John W. Sansing ,  Michael E. Hayes ,  James F. Deal

    IPC分类号： B63B57/02 ,  B08B3/02 ,  B08B5/02

    CPC分类号： B63B57/02

    摘要： An apparatus and process adapted to clean oil contaminated vessels which uses a closed fluidized system through which fluidized sludge is recirculated to be sprayed under pressure on interior walls of the vessel. Emulsifying agents are added to the vessel to initially form a pool of fluidized sludge in the vessel which is then conveyed to a tank and from the tank conveyed to a high pressure spray where it is sprayed onto the walls to fluidize more sludge.

    摘要翻译： 一种适用于清洁油污染容器的装置和方法，其使用封闭的流化系统，流化淤渣通过该流化系统被再循环以在压力下在容器的内壁上喷雾。 将乳化剂添加到容器中以最初在容器中形成流化淤渣池，然后将其输送到罐中，并将其从输送到高压喷雾器的罐中输送到壁上，以流化更多的污泥。

    Cleaning process
    8.
    发明授权
    Cleaning process 失效
    清洁过程

    公开(公告)号：US5849106A

    公开(公告)日：1998-12-15

    申请号：US70308

    申请日：1993-05-26

    申请人： Paul L. Bolden ,  Michael E. Hayes ,  John E. Braddy

    发明人： Paul L. Bolden ,  Michael E. Hayes ,  John E. Braddy

    IPC分类号： B08B3/08 ,  C11D3/18 ,  C11D3/20 ,  C11D3/43 ,  C11D7/24 ,  C11D7/26 ,  C11D7/50 ,  C11D11/00 ,  C23G5/024 ,  C23G5/032 ,  H05K3/26

    CPC分类号： C11D7/5027 ,  C11D11/0047 ,  C11D3/18 ,  C11D3/2093 ,  C11D3/43 ,  C23G5/024 ,  C23G5/032 ,  H05K3/26 ,  C11D7/24 ,  C11D7/263 ,  C11D7/264 ,  C11D7/266 ,  H05K2203/0783

    摘要： An industrial cleaning process in which a contaminant comprising soldering flux and/or adhesive tape residue is removed from a substrate contaminated therewith, for example, a printed circuit board contaminated with rosin flux, comprising: (A) contacting the substrate with a terpene-based cleaning composition which is substantially free of water-soluble organic material, for example, a surfactant, for a period of time sufficient to solubilize the contaminant; (B) removing the composition and solubilized contaminant from the substrate by contact with water having a temperature of about 70.degree. F. to about 140.degree. F. (but preferably lower) for a period of time of no longer than about 10 minutes to provide a substrate having a contamination rating of no greater than about 14 micrograms NaCl equivalent/square inch (MIL-P-28809A), and to thereby form a mixture comprising the composition, contaminant and water; and (C) separating the water from said mixture, the separated water being substantially free of water-soluble organic material and having a chemical oxygen demand of no greater than about 1,000 ppm. and also a cleaning process utilizing a cleaning composition comprising a major amount of a monobasic ester to clean surfaces that are contaminated with an organic residue.

    摘要翻译： 一种工业清洁方法，其中包含焊剂和/或胶带残留物的污染物从被污染的基底例如被松香助焊剂污染的印刷电路板上除去，包括：（A）使基材与萜烯基 清洁组合物，其基本上不含水溶性有机材料，例如表面活性剂，持续足以溶解污染物的时间; （B）通过与温度为约70°F至约140°F（但优选较低）的水接触不超过约10分钟的时间，从基材中除去组合物和溶解的污染物，以提供 污染等级不超过约14微克NaCl当量/平方英寸（MIL-P-28809A）的底物，从而形成包含组合物，污染物和水的混合物; 和（C）从所述混合物中分离水，所分离的水基本上不含水溶性有机材料，并且化学需氧量不大于约1,000ppm。 以及使用包含主要量的一元酯的清洁组合物以清洁被有机残余物污染的表面的清洁方法。

    Cleaning with solvating and rinsing agents
    9.
    发明授权
    Cleaning with solvating and rinsing agents 失效
    用溶剂和漂洗剂清洗

    公开(公告)号：US5716457A

    公开(公告)日：1998-02-10

    申请号：US483450

    申请日：1995-06-06

    申请人： Michael E. Hayes ,  Donald P. Hosman ,  Kevin R. Hrebenar ,  Robert D. Sell

    发明人： Michael E. Hayes ,  Donald P. Hosman ,  Kevin R. Hrebenar ,  Robert D. Sell

    IPC分类号： B08B3/08 ,  B23K1/00 ,  C11D3/18 ,  C11D3/20 ,  C11D3/24 ,  C11D3/43 ,  C11D7/24 ,  C11D7/26 ,  C11D7/28 ,  C11D7/30 ,  C11D7/32 ,  C11D7/50 ,  C11D11/00 ,  C11D17/00 ,  C23G5/02 ,  C23G5/024 ,  C23G5/028 ,  C23G5/032 ,  H05K3/26 ,  B08B3/00

    CPC分类号： C11D7/261 ,  C11D11/0047 ,  C11D11/0064 ,  C11D3/43 ,  C11D7/5022 ,  C11D7/5027 ,  C23G5/02 ,  C23G5/024 ,  C23G5/02803 ,  C23G5/032 ,  H05K3/26 ,  C11D3/18 ,  C11D3/2003 ,  C11D3/24 ,  C11D3/245 ,  C11D7/24 ,  C11D7/266 ,  C11D7/28 ,  C11D7/3209 ,  C11D7/3281 ,  H05K2203/0766 ,  H05K2203/0783

    摘要： A process for removing soil from a substrate which includes the use of a liquid cleaning composition comprising a solvating agent (for example, a monobasic ester) and a rinsing agent (for example, a perfluorocarbon), the solvating agent having: (i) a room temperature vapor pressure of no greater than about 40 mm Hg; and (ii) a solvating strength of no less than about 10; and the rinsing agent having: (iii) a room temperature vapor pressure of about 8 mm Hg to about 760 mm Hg; and (iv) an ozone depleting factor of no greater than about 0.15; wherein the ratio of the vapor pressure of said rinsing agent to the vapor pressure of said solvating agent is at least about 20 and such that, at the boiling temperature of the composition, the vapor space above the boiling composition would comprise said rinsing agent and be substantially free of said solvating agent, the preferred process including immersing an article (for example, a printed circuit board having thereon solder flux) in the boiling composition, withdrawing the article from the composition and transferring it through the vapor space and into a container of relatively cool liquid rinsing agent from which it is withdrawn and transferred through vaporized rinsing agent and dried, and apparatus for carrying out the process.

    摘要翻译： 一种用于从基材除去污垢的方法，其包括使用包含溶剂化剂（例如一元酯）和漂洗剂（例如全氟化碳）的液体清洗组合物，该溶剂化试剂具有：（i） 室温蒸气压不大于约40毫米汞柱; 和（ii）不低于约10的溶剂化强度; 和漂洗剂具有：（iii）约8mmHg至约760mm Hg的室温蒸气压; 和（iv）不大于约0.15的臭氧消耗因子; 其中所述漂洗剂的蒸气压与所述溶剂化物的蒸气压的比值至少约为20，并且在组合物的沸点温度下，沸腾组合物上方的蒸汽空间将包含所述漂洗剂，并且为 基本上不含所述溶剂化剂，优选的方法包括将制品（例如，其上具有助焊剂的印刷电路板）浸入沸腾组合物中，将制品从组合物中取出并将其通过蒸气空间转移到容器 相对冷的液体漂洗剂，通过蒸发的漂洗剂将其从其中取出并转移并干燥，以及用于进行该方法的装置。

    Process of removing soldering flux and/or adhesive tape residue from a substrate
    10.
    发明授权
    Process of removing soldering flux and/or adhesive tape residue from a substrate 失效
    从基材去除焊剂和/或胶带残留物的工艺

    公开(公告)号：US5340407A

    公开(公告)日：1994-08-23

    申请号：US896051

    申请日：1992-06-09

    申请人： Paul L. Bolden ,  Michael E. Hayes

    发明人： Paul L. Bolden ,  Michael E. Hayes

    IPC分类号： B41N3/06 ,  C11D3/18 ,  C11D3/20 ,  C11D3/43 ,  C11D7/24 ,  C11D7/26 ,  C11D7/50 ,  C11D11/00 ,  C23G5/024 ,  C23G5/032 ,  G03F7/42 ,  H05K3/26 ,  B08B3/08

    CPC分类号： H05K3/26 ,  C11D11/0047 ,  C11D3/18 ,  C11D3/2093 ,  C11D3/43 ,  C11D7/5027 ,  C23G5/024 ,  C23G5/032 ,  G03F7/422 ,  C11D7/24 ,  C11D7/263 ,  C11D7/264 ,  C11D7/266 ,  H05K2203/0783

    摘要： Disclosed is an industrial cleaning process in which a contaminant comprising soldering flux and/or adhesive tape residue is removed from a substrate contaminated therewith. The process comprises the steps of contacting the substrate with a terpene-based cleaning composition which is substantially free of water-soluble organic material; removing the composition and solubilized contaminant from the substrate by contact with water having a temperature of about 70.degree. F. to about 140.degree. F. for a period of time of no longer than about 10 minutes to provide a substrate having a contamination rating of no greater than about 14 micrograms NaCl equivalent/square inch (MIL-P-28809A), and to thereby form a mixture comprising the composition, contaminant and water. The process also comprises separating the water from said mixture, the separated water being substantially free of water-soluble organic material and having a chemical oxygen demand of no greater than about 1,000 ppm.

    摘要翻译： 公开了一种工业清洗方法，其中包含焊剂和/或粘合带残留物的污染物从被污染的基底上除去。 该方法包括以下步骤：使基材与基本上不含水溶性有机材料的基于萜烯的清洁组合物接触; 通过与温度为约70°F至140°F的水接触，不要超过约10分钟的时间，从基材中除去组合物和溶解的污染物，以提供污染等级为无 大于约14微克NaCl当量/平方英寸（MIL-P-28809A），从而形成包含组合物，污染物和水的混合物。 该方法还包括从所述混合物中分离水，所分离的水基本上不含水溶性有机材料，并且化学需氧量不大于约1,000ppm。