公开(公告)号：US20180244194A1

公开(公告)日：2018-08-30

申请号：US15968441

申请日：2018-05-01

申请人： Putco, Inc.

发明人： JAMES P. ELWELL ,  TRENT QUICK

IPC分类号： B60Q1/24 ,  F21V5/00 ,  F21S4/28 ,  F21S45/50 ,  H05K3/28 ,  H05K1/18 ,  F21V19/00 ,  F21V29/89 ,  F21S45/47 ,  B60Q1/20 ,  F21Y115/10

CPC分类号： B60Q1/24 ,  B60Q1/0035 ,  B60Q1/20 ,  B60Q1/2696 ,  B60Q2900/10 ,  F21S4/28 ,  F21S43/14 ,  F21S43/15 ,  F21S43/19 ,  F21S45/47 ,  F21S45/50 ,  F21V5/007 ,  F21V19/003 ,  F21V29/89 ,  F21Y2115/10 ,  H05K1/181 ,  H05K3/284 ,  H05K3/288 ,  H05K2201/10106

摘要： A lighted accessory for a motor vehicle includes a machined aluminum body. The body includes a front wall that has a plurality of openings through it and a cavity behind it. A plurality of lenses are potted in place within the openings. LED lights are installed on the aluminum body in alignment with the lenses. Additional potting compound is applied to cover the LEDs and substantially fill the cavity. A faulty LED board may be replaced by removing a portion of the potting compound and the faulty LED board, replacing the faulty LED board with an operable one, and refilling the removed portion of the potting compound with additional potting compound.

公开(公告)号：US09814166B2

公开(公告)日：2017-11-07

申请号：US13955149

申请日：2013-07-31

申请人： UNIVERSAL SCIENTIFIC INDUSTRIAL ( SHANGHAI) CO., LTD.

发明人： Jen-Chun Chen ,  Tsung-Jung Cheng ,  Chia-Cheng Liu

IPC分类号： H01L21/56 ,  H05K9/00 ,  H01L23/00 ,  H01L23/31 ,  H01L23/552 ,  H01L27/146 ,  H05K3/28 ,  H05K1/02

CPC分类号： H05K9/0024 ,  H01L21/56 ,  H01L23/3114 ,  H01L23/552 ,  H01L24/02 ,  H01L27/14618 ,  H01L2924/0002 ,  H05K1/0224 ,  H05K3/288 ,  H05K2201/0707 ,  H05K2201/1056 ,  H05K2203/0191 ,  H05K2203/107 ,  H05K2203/1105 ,  H01L2924/00

摘要： A method of manufacturing electronic package module is provided. The method provides selective molding by attaching tapes on the circuit substrate on which electric components are mounted thereon, forming molding compound to cover the circuit substrate, and removing tapes along with the molding compound thereon.

公开(公告)号：US09786136B2

公开(公告)日：2017-10-10

申请号：US14940708

申请日：2015-11-13

申请人： ALSON TECHNOLOGY LIMITED

发明人： Han-Hung Cheng ,  Chi-Fen Kuo

IPC分类号： G09G3/14 ,  G08B5/36

CPC分类号： G08B5/36 ,  G11C5/00 ,  G11C5/04 ,  H01L23/00 ,  H01L25/167 ,  H01L27/00 ,  H05K1/0269 ,  H05K3/288 ,  H05K2201/0989 ,  H05K2201/09936

摘要： A dynamic random access memory includes a main body which has a substrate portion and a light-emitting portion and a transmission port, the substrate portion includes a board and a first coating layer, the board has a light-transmittable portion and a first face, the first coating layer is coated on the first face and has an emergent light-transmittable portion corresponding to the light-transmittable portion, and the substrate portion has a memory module. The transmission port is disposed on the substrate portion and electrically connected with the memory module. The electronic device includes the dynamic random access memory and further includes a shell portion. The shell portion is covered on two opposite lateral faces of the dynamic random access memory and at least shields the light-emitting portion, and the shell portion further has a second light-transmittable portion corresponding to the emergent light-transmittable portion.

公开(公告)号：US20170223839A1

公开(公告)日：2017-08-03

申请号：US15009532

申请日：2016-01-28

申请人： Avago Technologies General IP (Singapore) Pte. Ltd

发明人： Padam Jain ,  Sarah Haney ,  Ashish Alawani

IPC分类号： H05K3/18 ,  H05K3/28 ,  H05K3/30 ,  H05K3/00

CPC分类号： H05K3/181 ,  H01L23/13 ,  H01L23/5383 ,  H01L23/552 ,  H01L24/16 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2924/15153 ,  H01L2924/15313 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/183 ,  H05K3/002 ,  H05K3/0023 ,  H05K3/0026 ,  H05K3/188 ,  H05K3/288 ,  H05K3/306 ,  H05K3/4697 ,  H05K2201/09981 ,  H05K2201/10674 ,  H05K2203/054 ,  H05K2203/308

摘要： A method is provided for fabricating an electromagnetic shield for an electronic component on a PCB. The method includes providing a patterned metal layer; laminating the patterned metal layer with a second dielectric layer; forming a cavity in the second dielectric layer; applying a dry film resist over the second dielectric layer and the cavity; stripping the dry film resist from the second dielectric layer and portions of the cavity adjacent the cavity side walls; depositing a seed layer and metal over the second dielectric layer and the dry film resist; etching the preplating layer and the seed layer from top surfaces of a remainder of the dry film resist and the second dielectric layer; and stripping the remainder of the dry film resist, thereby exposing the preplating layer on the side walls of the cavity to provide the electromagnetic shield.

公开(公告)号：US20170164482A1

公开(公告)日：2017-06-08

申请号：US15351234

申请日：2016-11-14

申请人： The Board of Trustees of the University of Illinois

发明人： John A. ROGERS ,  Seung-Kyun KANG ,  SukWon HWANG ,  Jianjun CHENG ,  Yanfeng ZHANG ,  Hanze YING

IPC分类号： H05K1/18 ,  H05K3/28 ,  H05K1/03 ,  H01L25/065 ,  A61B5/00 ,  H01L23/29 ,  H01L23/498 ,  H01L21/56 ,  H01L21/02 ,  H01L21/311 ,  G06K19/077 ,  H01L23/31

CPC分类号： H05K1/185 ,  A61B5/686 ,  A61B2562/125 ,  A61M5/44 ,  G06K19/0775 ,  H01L21/02164 ,  H01L21/0217 ,  H01L21/02274 ,  H01L21/0228 ,  H01L21/31111 ,  H01L21/31133 ,  H01L21/56 ,  H01L23/291 ,  H01L23/3121 ,  H01L23/3192 ,  H01L23/49894 ,  H01L25/0655 ,  H01L2924/0002 ,  H05K1/0275 ,  H05K1/0286 ,  H05K1/0306 ,  H05K3/22 ,  H05K3/285 ,  H05K3/287 ,  H05K3/288 ,  H05K5/069 ,  H05K13/00 ,  H05K2201/10151 ,  H05K2201/10196 ,  H05K2201/10212 ,  H05K2203/0271 ,  H05K2203/0292 ,  H05K2203/0769 ,  H05K2203/0776 ,  H05K2203/0786 ,  H05K2203/17 ,  H05K2203/175 ,  H05K2203/178 ,  Y10T29/49124 ,  Y10T137/0318 ,  Y10T428/239 ,  H01L2924/00

摘要： The invention provides transient devices, including active and passive devices that physically, chemically and/or electrically transform upon application of at least one internal and/or external stimulus. Incorporation of degradable device components, degradable substrates and/or degradable encapsulating materials each having a programmable, controllable and/or selectable degradation rate provides a means of transforming the device. In some embodiments, for example, transient devices of the invention combine degradable high performance single crystalline inorganic materials with selectively removable substrates and/or encapsulants.

公开(公告)号：US20160262261A1

公开(公告)日：2016-09-08

申请号：US15056291

申请日：2016-02-29

申请人： Apple Inc.

发明人： Ferdinand S. Toting ,  Arpit K. Akkinepalli ,  Goran S. Diminich ,  Xiaoyi Zhou

IPC分类号： H05K1/02 ,  H05K3/00 ,  H05K3/30 ,  H05K3/28 ,  H05K1/18 ,  H05K1/11

CPC分类号： H05K3/288 ,  H05K3/0026 ,  H05K3/284 ,  H05K3/285 ,  H05K2201/015 ,  H05K2201/0162 ,  H05K2203/107

摘要： Electrical components may be mounted on a printed circuit or other substrate. The electrical components may be covered with a conformal coating containing a wavelength-tuned-light-absorption-enhancement additive. The additive may be a dye or other additive that creates a light absorption peak at a given wavelength. To form openings in the conformal coating in alignment with the electrical components without damaging the components, a laser ablation tool may apply laser light at the given wavelength to the conformal coating. Openings may also be formed by placing tape over the components before the con form at coating is applied. The tape may have a color with a light absorption peak at the given wavelength to facilitate the formation of openings without damaging sensitive components.

摘要翻译： 电气部件可以安装在印刷电路或其它基板上。 电气部件可以用包含波长调谐光吸收增强添加剂的保形涂层覆盖。 添加剂可以是在给定波长处产生光吸收峰的染料或其它添加剂。 为了在保形涂层中形成与电气部件对准的开口而不损坏部件，激光烧蚀工具可以将给定波长的激光施加到保形涂层。 开口也可以通过在施加涂层之前将带放置在构件上而形成。 带可以具有在给定波长处具有光吸收峰的颜色，以便于形成开口而不损坏敏感组件。

公开(公告)号：US09171644B2

公开(公告)日：2015-10-27

申请号：US14705971

申请日：2015-05-07

申请人： Samsung Electronics Co., Ltd.

发明人： Sang-Guk Han ,  Seok-Joon Moon ,  Beom-jun Jin

IPC分类号： G01R31/00 ,  G11C29/12 ,  G11C5/02 ,  H01L25/18 ,  H01L25/065 ,  H01L23/498 ,  G01R31/28

CPC分类号： H01L25/0657 ,  G01R31/2808 ,  G01R31/2818 ,  G11C5/02 ,  G11C5/025 ,  G11C5/06 ,  G11C29/04 ,  G11C29/12 ,  G11C29/56 ,  G11C29/56016 ,  G11C2029/5602 ,  H01L22/30 ,  H01L22/32 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/538 ,  H01L24/09 ,  H01L24/48 ,  H01L24/49 ,  H01L24/80 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/0912 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4912 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/181 ,  H05K1/0268 ,  H05K1/111 ,  H05K1/117 ,  H05K1/181 ,  H05K3/002 ,  H05K3/245 ,  H05K3/28 ,  H05K3/288 ,  H05K3/323 ,  H05K2201/0187 ,  H05K2201/035 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/099 ,  H05K2201/10159 ,  H05K2203/162 ,  Y10T29/49117 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.

公开(公告)号：US09069036B2

公开(公告)日：2015-06-30

申请号：US14104315

申请日：2013-12-12

申请人： Samsung Electronics Co., Ltd.

发明人： Sang-Guk Han ,  Seok-Joon Moon ,  Beom-jun Jin

IPC分类号： G01R31/00 ,  G01R31/28 ,  H01L23/538 ,  H05K1/02 ,  H01L21/66 ,  H01L25/065 ,  H01L25/18 ,  H05K1/11 ,  H05K3/28 ,  H05K3/32 ,  H01L23/00

CPC分类号： H01L25/0657 ,  G01R31/2808 ,  G01R31/2818 ,  G11C5/02 ,  G11C5/025 ,  G11C5/06 ,  G11C29/04 ,  G11C29/12 ,  G11C29/56 ,  G11C29/56016 ,  G11C2029/5602 ,  H01L22/30 ,  H01L22/32 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/538 ,  H01L24/09 ,  H01L24/48 ,  H01L24/49 ,  H01L24/80 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/0912 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4912 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/181 ,  H05K1/0268 ,  H05K1/111 ,  H05K1/117 ,  H05K1/181 ,  H05K3/002 ,  H05K3/245 ,  H05K3/28 ,  H05K3/288 ,  H05K3/323 ,  H05K2201/0187 ,  H05K2201/035 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/099 ,  H05K2201/10159 ,  H05K2203/162 ,  Y10T29/49117 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.

摘要翻译： 提供具有印刷电路板的电子设备。 在一个实施例中，印刷电路板包括要与外部装置耦合的多个外部焊盘和用于测试电路的多个旁路焊盘。 外部焊盘被暴露，并且多个旁路焊盘中的至少一个不暴露于PCB的外表面。 还提供了使用电子设备的系统和测试电子设备的方法。

公开(公告)号：US20140198266A1

公开(公告)日：2014-07-17

申请号：US14154979

申请日：2014-01-14

申请人： Samsung Display Co., Ltd.

发明人： Hee-Woong Park ,  Byeong-Kye Jeon

IPC分类号： G02F1/1333 ,  H05K3/30 ,  H01L27/32

CPC分类号： G02F1/13338 ,  B82Y15/00 ,  G06F3/044 ,  G06F2203/04102 ,  G06F2203/04103 ,  G06F2203/04112 ,  H01L27/323 ,  H05K1/0289 ,  H05K1/097 ,  H05K3/22 ,  H05K3/288 ,  H05K3/4685 ,  H05K2201/026 ,  H05K2201/0329 ,  H05K2201/0391 ,  H05K2201/10053 ,  H05K2201/10128 ,  H05K2203/173 ,  Y10T29/49016

摘要： In an aspect, a touch screen panel including a sensing region and a peripheral region, a plurality of first sensing patterns located in the sensing region, a plurality of second sensing patterns arranged in an intersected direction with the first sensing patterns connected to each other by a connection part, an insulating layer formed on the first sensing pattern, the second sensing pattern, and the connection part, and patterned to expose both side of the first sensing pattern, at least one bridge located to intersect with the connection part on the insulating layer; and a plurality of wires located on a peripheral region and connected to the first sensing pattern and the second sensing pattern are provided.

摘要翻译： 一方面，一种包括感测区域和周边区域的触摸屏面板，位于感测区域中的多个第一感测图案，以与第一感测图案相交的方向布置的多个第二感测图案，第一感测图案通过 连接部分，形成在第一感测图案上的绝缘层，第二感测图案和连接部分，并且被图案化以暴露第一感测图案的两侧，至少一个位于与绝缘层上的连接部分相交的桥 层; 并且设置有位于周边区域并连接到第一感测图案和第二感测图案的多个电线。

公开(公告)号：US20140190931A1

公开(公告)日：2014-07-10

申请号：US14157743

申请日：2014-01-17

申请人： HzO, Inc.

发明人： David James Astle ,  Tyler Christensen Child ,  Vimal Kumar Kasagani ,  Cameron LaMar Loose ,  Blake LeRoy Stevens ,  Max Ernest Sorenson

IPC分类号： H05K13/00

CPC分类号： B23K26/362 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/361 ,  B23K26/402 ,  B23K2103/50 ,  C23C14/042 ,  C23C16/042 ,  H01L21/561 ,  H01L23/3121 ,  H01L2924/0002 ,  H05K3/285 ,  H05K3/288 ,  H05K2203/025 ,  H05K2203/092 ,  H05K2203/095 ,  H05K2203/107 ,  H05K2203/1105 ,  H05K2203/163 ,  H01L2924/00

摘要： A method for selectively removing portions of a protective coating from a substrate, such as an electronic device, includes removing portions of the protective coating from the substrate. The removal process may include cutting the protective coating at specific locations, then removing desired portions of the protective coating from the substrate, or it may include ablating the portions of the protective coating that are to be removed. Coating and removal systems are also disclosed.

摘要翻译： 用于从诸如电子设备的基板选择性地去除保护涂层的部分的方法包括从基板去除保护涂层的部分。 去除过程可以包括在特定位置切割保护涂层，然后从衬底去除保护涂层的期望部分，或者可以包括烧蚀待除去的保护涂层的部分。 还公开了涂层和清除系统。