公开(公告)号：US09129978B1

公开(公告)日：2015-09-08

申请号：US14313521

申请日：2014-06-24

Applicant: Jaepil Kim ,  Seokhyun Kim ,  Daeup Bae ,  Jaewon Kim ,  Jaekang Yoo ,  Sungpil Hur

Inventor： Jaepil Kim ,  Seokhyun Kim ,  Daeup Bae ,  Jaewon Kim ,  Jaekang Yoo ,  Sungpil Hur

IPC: H01L23/48 ,  H01L23/28 ,  H01L21/44 ,  H01L21/56

CPC classification number: H01L21/565 ,  H01L23/3121 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2924/181 ,  H01L2924/00012

Abstract: An integrated circuit packaging system, and a method of manufacture of an integrated circuit packaging system thereof, includes: a singulation substrate having an air vent portion having longitudinal grooves in the air vent portion, the longitudinal grooves all parallel to each other; an integrated circuit die attached to the singulation substrate; and a molding compound on the singulation substrate, on the air vent portion, in a portion of the longitudinal grooves, and on the integrated circuit die.

Abstract translation: 一种集成电路封装系统及其集成电路封装系统的制造方法，其特征在于，包括：排气基板，其具有在所述排气部中具有纵向槽的排气部，所述纵向槽全部平行; 附接到单片基板的集成电路芯片; 在分离基板上，排气部分，纵向槽的一部分和集成电路管芯上的模塑料。