公开(公告)号：US09129978B1

公开(公告)日：2015-09-08

申请号：US14313521

申请日：2014-06-24

申请人： Jaepil Kim ,  Seokhyun Kim ,  Daeup Bae ,  Jaewon Kim ,  Jaekang Yoo ,  Sungpil Hur

发明人： Jaepil Kim ,  Seokhyun Kim ,  Daeup Bae ,  Jaewon Kim ,  Jaekang Yoo ,  Sungpil Hur

IPC分类号： H01L23/48 ,  H01L23/28 ,  H01L21/44 ,  H01L21/56

CPC分类号： H01L21/565 ,  H01L23/3121 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2924/181 ,  H01L2924/00012

摘要： An integrated circuit packaging system, and a method of manufacture of an integrated circuit packaging system thereof, includes: a singulation substrate having an air vent portion having longitudinal grooves in the air vent portion, the longitudinal grooves all parallel to each other; an integrated circuit die attached to the singulation substrate; and a molding compound on the singulation substrate, on the air vent portion, in a portion of the longitudinal grooves, and on the integrated circuit die.

摘要翻译： 一种集成电路封装系统及其集成电路封装系统的制造方法，其特征在于，包括：排气基板，其具有在所述排气部中具有纵向槽的排气部，所述纵向槽全部平行; 附接到单片基板的集成电路芯片; 在分离基板上，排气部分，纵向槽的一部分和集成电路管芯上的模塑料。

公开(公告)号：US07863761B2

公开(公告)日：2011-01-04

申请号：US11833646

申请日：2007-08-03

申请人： Dal Jae Lee ,  Nam Ju Cho ,  Soo-San Park ,  Jaepil Kim ,  Sungpil Hur ,  Hyeong Kug Jin ,  JongMin Han ,  SungJae Lim ,  HyoungChul Kwon

发明人： Dal Jae Lee ,  Nam Ju Cho ,  Soo-San Park ,  Jaepil Kim ,  Sungpil Hur ,  Hyeong Kug Jin ,  JongMin Han ,  SungJae Lim ,  HyoungChul Kwon

IPC分类号： H01L23/28 ,  H01L21/44

CPC分类号： H01L23/3128 ,  H01L21/561 ,  H01L21/565 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/48997 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48455 ,  H01L2224/45099 ,  H01L2224/05599

摘要： An integrated circuit package system comprising: providing a substrate; attaching an integrated circuit die over the substrate; attaching a connector to the integrated circuit die and the substrate; and forming an encapsulant over the substrate, the integrated circuit die, and the connector and minimizing ambient gas deformation of the substrate to keep the connector from touching another connector.

摘要翻译： 一种集成电路封装系统，包括：提供衬底; 在衬底上附着集成电路管芯; 将连接器附接到集成电路管芯和衬底; 以及在衬底，集成电路管芯和连接器上形成密封剂，并且最小化衬底的环境气体变形以保持连接器不会接触另一个连接器。

公开(公告)号：US20080029873A1

公开(公告)日：2008-02-07

申请号：US11833646

申请日：2007-08-03

申请人： Dal Jae Lee ,  Nam Ju Cho ,  Soo-San Park ,  Jaepil Kim ,  Sungpil Hur ,  Hyeong Kug Jin ,  JongMin Han ,  SungJae Lim ,  HyoungChul Kwon

发明人： Dal Jae Lee ,  Nam Ju Cho ,  Soo-San Park ,  Jaepil Kim ,  Sungpil Hur ,  Hyeong Kug Jin ,  JongMin Han ,  SungJae Lim ,  HyoungChul Kwon

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L23/3128 ,  H01L21/561 ,  H01L21/565 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/48997 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48455 ,  H01L2224/45099 ,  H01L2224/05599

摘要： An integrated circuit package system comprising: providing a substrate; attaching an integrated circuit die over the substrate; attaching a connector to the integrated circuit die and the substrate; and forming an encapsulant over the substrate, the integrated circuit die, and the connector and minimizing ambient gas deformation of the substrate to keep the connector from touching another connector.

摘要翻译： 一种集成电路封装系统，包括：提供衬底; 在衬底上附着集成电路管芯; 将连接器附接到集成电路管芯和衬底; 以及在衬底，集成电路管芯和连接器上形成密封剂，并且最小化衬底的环境气体变形以保持连接器不接触另一个连接器。