公开(公告)号：US20070164424A1

公开(公告)日：2007-07-19

申请号：US10551305

申请日：2004-03-31

申请人： Nancy Dean ,  Richard Townsend ,  Paula Knoll ,  Colin Edie ,  My Nguyen ,  Dan Curran ,  Ignatius Rasiah

发明人： Nancy Dean ,  Richard Townsend ,  Paula Knoll ,  Colin Edie ,  My Nguyen ,  Dan Curran ,  Ignatius Rasiah

IPC分类号： H01L23/34

CPC分类号： H01L23/4275 ,  H01L21/563 ,  H01L23/10 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/427 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/163 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/0401

摘要： Components and materials, including thermal transfer materials, contemplated herein comprise at least one heat spreader component, at least one thermal interface material and in some contemplated embodiments at least one adhesive material. The heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material. The thermal interface material is directly deposited onto at least part of the bottom surface of the heat spreader component. Methods of forming layered thermal interface materials and thermal transfer materials include: a) providing a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material; b) providing at least one thermal interface material, wherein the thermal interface material is directly deposited onto the bottom surface of the heat spreader component; and c) depositing the at least one thermal interface material onto the bottom surface of the heat spreader component. Methods of forming a thermal solution/package and/or IC package includes: a) providing the thermal transfer material described herein; b) providing at least one adhesive component; c) providing at least one surface or substrate; d) coupling the at least one thermal transfer material and/or material with the at least one adhesive component to form an adhesive unit; e) coupling the adhesive unit to the at least one surface or substrate to form a thermal package; f) optionally coupling an additional layer or component to the thermal package.

摘要翻译： 包括热转印材料的组件和材料包括至少一个散热器部件，至少一个热界面材料，并且在一些预期的实施例中包括至少一种粘合剂材料。 散热器部件包括顶表面，底表面和至少一个散热器材料。 热界面材料直接沉积在散热器部件的底表面的至少一部分上。 形成层状热界面材料和热转印材料的方法包括：a）提供散热器部件，其中散热器部件包括顶表面，底表面和至少一个散热器材料; b）提供至少一种热界面材料，其中所述热界面材料直接沉积到所述散热器部件的底表面上; 以及c）将所述至少一种热界面材料沉积到所述散热器部件的底表面上。 形成热溶液/包装和/或IC封装的方法包括：a）提供本文所述的热转印材料; b）提供至少一种粘合剂组分; c）提供至少一个表面或基底; d）将所述至少一种热转印材料和/或材料与所述至少一种粘合剂组分结合以形成粘合剂单元; e）将所述粘合单元耦合到所述至少一个表面或基底以形成热封装; f）可选地将附加层或组件耦合到热封装。

公开(公告)号：US20060040112A1

公开(公告)日：2006-02-23

申请号：US10519337

申请日：2003-07-15

申请人： Nancy Dean ,  Richard Townsend ,  Paula Knoll ,  Colin Edie ,  My Nguyen ,  Dan Curran

发明人： Nancy Dean ,  Richard Townsend ,  Paula Knoll ,  Colin Edie ,  My Nguyen ,  Dan Curran

IPC分类号： B32B9/04 ,  B32B15/04

CPC分类号： H01L23/3735 ,  H01L23/3737 ,  H01L23/4275 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K7/20481 ,  Y10T428/31663 ,  Y10T428/31678 ,  H01L2924/00

摘要： Layered thermal components described herein include at least one thermal interface component and at least one heat spreader component coupled to the thermal interface component. A method of forming layered thermal components disclosed herein comprises: a) providing at least one thermal interface component; b) providing at least one heat spreader component; and c) physically coupling the at least one thermal interface component and the at least one heat spreader component. At least one additional layer, including a substrate layer, can be coupled to the layered thermal component. A method for forming the thermal interface components disclosed herein comprises a) providing at least one saturated rubber compound, b) providing at least one amine resin, c) crosslinking the at least one saturated rubber compound and the at least one amine resin to form a crosslinked rubber-resin mixture, d) adding at least one thermally conductive filler to the crosslinked rubber-resin mixture, and e) adding a wetting agent to the crosslinked rubber-resin mixture. This method can also further comprise adding at least one phase change material to the thermal interface component A suitable interface material can also be produced that comprises at least one solder material. Additionally, a suitable interface material can be produced that comprises at least one solder material and at least one resin component.

摘要翻译： 本文描述的层状热组件包括至少一个热界面部件和耦合到热界面部件的至少一个散热器部件。 本文公开的形成层状热成分的方法包括：a）提供至少一个热界面组分; b）提供至少一个散热器部件; 以及c）物理地联接所述至少一个热界面部件和所述至少一个散热器部件。 包括基底层的至少一个附加层可以耦合到层状热分量。 形成本文公开的热界面组分的方法包括a）提供至少一种饱和橡胶化合物，b）提供至少一种胺树脂，c）使至少一种饱和橡胶化合物和至少一种胺树脂交联以形成 交联的橡胶 - 树脂混合物，d）在交联的橡胶 - 树脂混合物中加入至少一种导热填料，和e）在交联的橡胶 - 树脂混合物中加入润湿剂。 该方法还可以进一步包括向热界面组分A添加至少一种相变材料。也可以生产包含至少一种焊料材料的合适界面材料。 另外，可以生产包括至少一种焊料材料和至少一种树脂组分的合适的界面材料。