公开(公告)号：US20070164424A1

公开(公告)日：2007-07-19

申请号：US10551305

申请日：2004-03-31

申请人： Nancy Dean ,  Richard Townsend ,  Paula Knoll ,  Colin Edie ,  My Nguyen ,  Dan Curran ,  Ignatius Rasiah

发明人： Nancy Dean ,  Richard Townsend ,  Paula Knoll ,  Colin Edie ,  My Nguyen ,  Dan Curran ,  Ignatius Rasiah

IPC分类号： H01L23/34

CPC分类号： H01L23/4275 ,  H01L21/563 ,  H01L23/10 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/427 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/163 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/0401

摘要： Components and materials, including thermal transfer materials, contemplated herein comprise at least one heat spreader component, at least one thermal interface material and in some contemplated embodiments at least one adhesive material. The heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material. The thermal interface material is directly deposited onto at least part of the bottom surface of the heat spreader component. Methods of forming layered thermal interface materials and thermal transfer materials include: a) providing a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material; b) providing at least one thermal interface material, wherein the thermal interface material is directly deposited onto the bottom surface of the heat spreader component; and c) depositing the at least one thermal interface material onto the bottom surface of the heat spreader component. Methods of forming a thermal solution/package and/or IC package includes: a) providing the thermal transfer material described herein; b) providing at least one adhesive component; c) providing at least one surface or substrate; d) coupling the at least one thermal transfer material and/or material with the at least one adhesive component to form an adhesive unit; e) coupling the adhesive unit to the at least one surface or substrate to form a thermal package; f) optionally coupling an additional layer or component to the thermal package.

摘要翻译： 包括热转印材料的组件和材料包括至少一个散热器部件，至少一个热界面材料，并且在一些预期的实施例中包括至少一种粘合剂材料。 散热器部件包括顶表面，底表面和至少一个散热器材料。 热界面材料直接沉积在散热器部件的底表面的至少一部分上。 形成层状热界面材料和热转印材料的方法包括：a）提供散热器部件，其中散热器部件包括顶表面，底表面和至少一个散热器材料; b）提供至少一种热界面材料，其中所述热界面材料直接沉积到所述散热器部件的底表面上; 以及c）将所述至少一种热界面材料沉积到所述散热器部件的底表面上。 形成热溶液/包装和/或IC封装的方法包括：a）提供本文所述的热转印材料; b）提供至少一种粘合剂组分; c）提供至少一个表面或基底; d）将所述至少一种热转印材料和/或材料与所述至少一种粘合剂组分结合以形成粘合剂单元; e）将所述粘合单元耦合到所述至少一个表面或基底以形成热封装; f）可选地将附加层或组件耦合到热封装。