利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

9 条记录 (耗时 0.018 秒)

    Gauge assembly for a master processing apparatus
    3.
    发明授权
    Gauge assembly for a master processing apparatus 有权
    主处理设备的量规组件

    公开(公告)号：US06672354B2

    公开(公告)日：2004-01-06

    申请号：US10163341

    申请日：2002-06-07

    申请人： Paul J. Lemens ,  Joseph E. Velasquez ,  Daniel G. Reed

    发明人： Paul J. Lemens ,  Joseph E. Velasquez ,  Daniel G. Reed

    IPC分类号： B32B3100

    CPC分类号： B32B37/226 ,  B32B2037/0061 ,  B65H26/08 ,  B65H2511/142 ,  B65H2551/20 ,  Y10T156/1741 ,  B65H2220/01

    摘要： A master processing apparatus for use with a pair of removable feed rolls comprises a frame, a master processing assembly, and a gauge assembly. The removable feed rolls carry a supply of stock material to be unwound, at least one of the stock materials having a layer of adhesive provided thereon. The frame removably mounts the feed rolls. The master processing assembly performs a master processing operation wherein the master processing assembly causes adhesive bonding between a master and the stock materials. The gauge assembly has (a) a supply roll monitor operable to continuously monitor an amount of stock material remaining on the feed rolls and (b) a user readable supply level indicator operatively connected to the supply roll monitor. The supply level indicator is operable to continuously indicate to the user the amount of stock material remaining on the feed rolls as the stock materials are being unwound.

    摘要翻译： 用于与一对可移动进给辊一起使用的主处理装置包括框架，主处理组件和量规组件。 可移除的进料辊携带待退绕的原料的供应，至少一个原料具有设置在其上的粘合剂层。 框架可拆卸地安装进给辊。 主处理组件执行主处理操作，其中主处理组件引起主机和原材料之间的粘合。 仪表组件具有（a）供应辊监视器，其可操作以连续地监视进料辊上残留的原料的量，和（b）可操作地连接到供应辊监视器的用户可读供应水平指示器。 供应水平指示器可操作以在原料正在展开时向用户持续指示饲料辊上残留的原料的量。

    Cutter assembly for a master processing apparatus
    4.
    发明授权
    Cutter assembly for a master processing apparatus 有权
    用于主处理设备的切割机组件

    公开(公告)号：US06742428B2

    公开(公告)日：2004-06-01

    申请号：US10193192

    申请日：2002-07-12

    申请人： Paul J. Lemens ,  Joseph E. Velasquez ,  Daniel G. Reed

    发明人： Paul J. Lemens ,  Joseph E. Velasquez ,  Daniel G. Reed

    IPC分类号： B26D520

    CPC分类号： B32B37/226 ,  B26D1/045 ,  B26D7/00 ,  B32B38/0004 ,  Y10T83/49 ,  Y10T83/8822 ,  Y10T156/1741

    摘要： A master processing apparatus for use with a pair of removable feed rolls includes a frame, a master processing assembly, and a cutter assembly. The processing assembly performs a master processing operation wherein adhesive bonding is caused between a master and stock materials of the feed rolls. The cutter assembly is removably mounted to the frame on the discharge side of processing assembly. The cutter assembly has a blade movable to perform a severing operation wherein the blade cuts through the stock materials discharged from the processing assembly in a direction generally transverse to the feeding direction to sever a final product including the processed master and stock materials from a remainder of the supply of stock materials. The cutter assembly is removable from the frame for placement on a support surface to perform other cutting operations including a trimming operation wherein the blade is moved in the feeding direction.

    摘要翻译： 用于与一对可移动进料辊一起使用的主处理设备包括框架，主处理组件和切割器组件。 处理组件执行主处理操作，其中在进给辊的母料和原料之间引起粘合剂粘合。 切割器组件可拆卸地安装到处理组件的排放侧的框架上。 切割器组件具有可移动以执行切割操作的刀片，其中刀片沿着大致横向于进给方向的方向切割从处理组件排出的原料，以从包含加工的母料和原料的剩余部分切断包括加工的母料和原料的最终产品 供应原料。 切割器组件可从框架移除以放置在支撑表面上以执行其他切割操作，包括修剪操作，其中叶片沿进给方向移动。

    Substrate processing apparatus
    6.
    发明授权
    Substrate processing apparatus 有权
    基板加工装置

    公开(公告)号：US06868889B2

    公开(公告)日：2005-03-22

    申请号：US10197856

    申请日：2002-07-19

    申请人： Nathaniel J. Kvamme ,  Ronald J. Hoffman ,  Cory W. Worth ,  Daniel G. Reed

    发明人： Nathaniel J. Kvamme ,  Ronald J. Hoffman ,  Cory W. Worth ,  Daniel G. Reed

    IPC分类号： B05C1/02 ,  B32B37/22 ,  B32B3/20 ,  B30B15/00 ,  B32B7/10 ,  B32B33/00

    CPC分类号： B32B37/226 ,  B32B37/10 ,  Y10S428/914 ,  Y10T156/12 ,  Y10T156/171 ,  Y10T156/18 ,  Y10T428/14 ,  Y10T428/24802 ,  Y10T428/28

    摘要： A substrate processing apparatus includes a frame, first and second supply rolls and a substrate processing assembly including a resiliently deformable structure configured to apply pressure to the first and second supply rolls to perform a substrate processing operation. A method for processing a substrate includes providing first and second supply rolls rotatably mounted to the substrate processing apparatus, wherein at least one of the first and second supply rolls has pressure-sensitive adhesive provided thereon. The selected substrate is enabled to be fed in a substrate receiving opening with the first and the second substrates positioned on opposing sides thereof. The first and second substrates are advanced through the substrate receiving opening. A resiliently deformable structure deforms to apply pressure to the selected substrate and the first and second substrates as they are advanced through the substrate receiving opening, thereby bonding the adhesive to the selected substrate.

    摘要翻译： 基板处理装置包括框架，第一和第二供给辊以及包括可弹性变形的结构的基板处理组件，该可弹性变形的结构构造成对第一和第二供给辊施加压力以执行基板处理操作。 一种处理衬底的方法包括提供可旋转地安装到衬底处理设备的第一和第二供应辊，其中第一和第二供应辊中的至少一个具有设置在其上的压敏粘合剂。 所选择的基板能够被馈送到基板接收开口中，其中第一和第二基板位于相对的两侧。 第一和第二基板通过基板接收开口前进。 可弹性变形的结构变形以在被选择的基底和第一和第二基底施加压力，因为它们前进通过基底接收开口，从而将粘合剂粘合到所选择的基底上。