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公开(公告)号:US20050228100A1
公开(公告)日:2005-10-13
申请号:US10823381
申请日:2004-04-13
申请人: Mir Ali , Johnny Jaggers , Stuart Dorsky , David Barnum , Yvonne Vold , James Bal
发明人: Mir Ali , Johnny Jaggers , Stuart Dorsky , David Barnum , Yvonne Vold , James Bal
摘要: The present invention provides a new and improved polymer blend that displays a high metallic effect and is capable of being utilized in elevated temperature applications comprising from about 3% to about 12% by weight metal particles component, from about 30% to about 60% by weight talc and from about 35% to about 70% by weight olefinic polymer. The metal particles component comprises aluminum particles having an undefined configuration and an average particle size of from about 200 μm to about 400 μm.
摘要翻译: 本发明提供了一种新的和改进的聚合物共混物,其显示高的金属效应并且能够在高温应用中使用,其包含约3%至约12%重量的金属颗粒组分,约30%至约60% 重量的滑石和约35%至约70%的烯烃聚合物。 金属颗粒组分包括具有未定义构型的铝颗粒,平均粒度为约200μm至约400μm。
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公开(公告)号:US06419526B1
公开(公告)日:2002-07-16
申请号:US09169627
申请日:1998-10-09
申请人: Mervin Fair , Jeffrey Fleming , Ronald Locati , David Barnum , James Smith , Patrick Hulbert , Richard Marowsky
发明人: Mervin Fair , Jeffrey Fleming , Ronald Locati , David Barnum , James Smith , Patrick Hulbert , Richard Marowsky
IPC分类号: H01R2400
CPC分类号: H01R13/6467 , H01R12/725 , H01R24/64 , H01R2201/04 , Y10S439/941 , Y10S439/954
摘要: A multi-port modular jack including an outer housing part, inner housing parts arranged in the outer housing part to define plug-receiving receptacles receivable of mating plugs, and an optional shield surrounding the jack. The outer housing part having a top wall, a bottom wall and a front face having a mid-portion arranged substantially parallel to and between the top and bottom walls. The front face defines a first row of apertures between the mid-portion and the top wall and a second row of apertures between the mid-portion and the bottom wall. Each aperture in the first row has a plane of symmetry offset in relation to a plane of symmetry of each aperture in the second row such that only a portion of each aperture in the first row is directly opposite the opposed apertures in the second row. Vents are formed in the outer housing part to allow for the passage of air through the jack. The inner housing parts are arranged in the outer housing part to define the plug-receiving receptacles in alignment with a respective aperture in the front face of the outer housing part. Each inner housing part includes contact/terminal members for engaging contacts of a plug insertable into a respective plug-receiving receptacle. The contact/terminal members forming one or more wire pairs may be provided with a double cross over to reduce near-end crosstalk.
摘要翻译: 一种多端口模块插座,包括外部壳体部分,布置在外部壳体部分中的内部壳体部件,以限定可接受配合插头的插头接收容器以及围绕插座的可选屏蔽。 外部壳体部分具有顶壁,底壁和前表面,其具有基本上平行于顶壁和底壁之间并且在顶壁和底壁之间布置的中间部分。 前表面在中间部分和顶壁之间限定了第一排孔,并且在中间部分和底壁之间限定了第二排孔。 第一排中的每个孔具有相对于第二排中的每个孔的对称平面偏移的对称平面,使得仅第一排中的每个孔的仅一部分与第二排中的相对的孔直接相对。 通风口形成在外壳体部分中以允许空气通过千斤顶。 内部壳体部分布置在外部壳体部分中以限定与外部壳体部分的前表面中的相应孔对准的插头接收容器。 每个内部壳体部分包括接触/端子构件,用于接合可插入到相应的插头接收容座中的插头的触点。 形成一个或多个线对的接触/端子构件可以设置有双交叉以减少近端串扰。
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3.
公开(公告)号:US20050101167A1
公开(公告)日:2005-05-12
申请号:US10621739
申请日:2003-07-17
申请人: Roger Weiss , David Barnum
发明人: Roger Weiss , David Barnum
CPC分类号: H01R13/2414 , H01R4/26 , H01R43/007 , H01R2201/20
摘要: A separable electrical connector for separably, electrically interconnecting the conductors of one multi-conductor cable to the conductors of a second electrical device that may be an electrical device such as a chip, or a second multi-conductor cable, or a flexible or rigid printed circuit board. The connector includes a layer of anisotropic conductive elastomer (ACE) in electrical contact with the conductors of the cable and the conductors of the second electrical device. A clamp or another type of mechanical device compresses the ACE, to provide electrical signal paths between the conductors of the cable and the second electrical device, through the ACE.
摘要翻译: 一种可分离的电连接器,用于将一根多导体电缆的导体与第二电气装置的导体电连接,这些第二电气装置可以是诸如芯片或第二多导体电缆的电气装置,或柔性或刚性印刷 电路板。 连接器包括与电缆的导体和第二电气设备的导体电接触的各向异性导电弹性体(ACE)层。 夹具或其他类型的机械装置压缩ACE,通过ACE提供电缆和第二电气设备的导体之间的电信号路径。
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