-
1.发明授权Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles 有权抛光垫可用于在含有磨料颗粒的浆料存在下对基材进行化学机械抛光公开(公告)号：US06890244B2
公开(公告)日：2005-05-10
申请号：US10664735
申请日：2003-09-18
IPC分类号： B24B37/22 , B24B37/24 , B24D13/14 , H01L21/304 , B24B7/19
摘要： A polishing pad for polishing semiconductors and other planar substrates in the presence of a slurry comprising abrasive particles and a dispersive agent is disclosed. The polishing pad includes a soluble component within a polymer matrix component. The soluble component includes particles soluble in the slurry sufficiently to provide a void structure in the polishing surface of the pad. The void structure enhances the polishing rate and uniformity by increasing the mobility of the abrasive particles while reducing scratching of the polished surface. Additives that further enhance polishing and/or assist in the removal of residues generated during polishing, such as surfactants and removers, are optionally incorporated in the soluble particles or topographically coated on the soluble particles.
摘要翻译： 公开了一种用于在包含磨料颗粒和分散剂的浆料存在下研磨半导体和其它平面基板的抛光垫。 抛光垫包括聚合物基质组分内的可溶组分。 可溶性组分包括可溶于浆料中的颗粒，足以在垫的抛光表面中提供空隙结构。 空隙结构通过增加研磨颗粒的迁移率同时减少抛光表面的划伤来提高抛光速率和均匀性。 进一步增强抛光和/或有助于去除在抛光过程中产生的残留物（如表面活性剂和去除剂）的添加剂任选地并入可溶性颗粒中或地形上涂覆在可溶性颗粒上。
-
2.发明授权Polishing pads with polymer filled fibrous web, and methods for fabricating and using same 失效具有聚合物填充的纤维网的抛光垫，以及其制造和使用方法公开(公告)号：US06989117B2
公开(公告)日：2006-01-24
申请号：US10782922
申请日：2004-02-23
申请人： Shyng-Tsong Chen , Kenneth P. Rodbell , Oscar Kai Chi Hsu , Jean Vangsness , David S. Gilbride , Scott Clayton Billings , Kenneth Davis
发明人： Shyng-Tsong Chen , Kenneth P. Rodbell , Oscar Kai Chi Hsu , Jean Vangsness , David S. Gilbride , Scott Clayton Billings , Kenneth Davis
IPC分类号： B29C39/42
CPC分类号： B24B37/26 , B24D3/28 , B24D11/008 , B24D18/00
摘要： A method of making a polishing pad having a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors. The fibers define interstices, and the precursors fill these interstices substantially completely before completion of the reaction. The method comprising placing the fibers and the precursors in a cavity of a mold for shaping the polishing pad; applying a differential pressure across a mold cavity, where the differential pressure and the amount of precursors are sufficient to cause the precursors to fill the interstices substantially completely before completion of the reaction; and applying sufficient heat to the mold to at least partially cure the polishing pad by causing the precursors to react.
摘要翻译： 一种制造抛光垫的方法，该抛光垫具有包含嵌入在通过聚合物前体的反应形成的基体聚合物中的纤维的主体。 纤维定义空隙，并且前体在反应完成之前基本上完全填充这些间隙。 该方法包括将纤维和前体放置在用于成形抛光垫的模具的空腔中; 在模具腔内施加压差，其中压差和前体的量足以使得前体在反应完成之前基本上完全填充空隙; 并且通过使前体反应来向模具施加足够的热量以至少部分地固化抛光垫。
-
3.发明授权Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles 有权抛光垫可用于在含有磨料颗粒的浆料存在下对基材进行化学机械抛光公开(公告)号：US06656018B1
公开(公告)日：2003-12-02
申请号：US09545982
申请日：2000-04-10
IPC分类号： B24B100
摘要： A polishing pad for polishing semiconductors and other planar substrates in the presence of a slurry comprising abrasive particles and a dispersive agent is disclosed. The polishing pad includes a soluble component, preferably fibrous, within a polymer matrix component. The fibrous component includes fibers soluble in the slurry sufficiently to provide a void structure in the polishing surface of the pad. The void structure enhances the polishing rate and uniformity by increasing the mobility of the abrasive particles while reducing scratching of the polished surface. Additives that further enhance polishing and/or assist in the removal of residues generated during polishing, such as surfactants and removers, are optionally incorporated in the fibrous substance or topographically coated on the fibrous substance.
摘要翻译： 公开了一种用于在包含磨料颗粒和分散剂的浆料存在下研磨半导体和其它平面基板的抛光垫。 抛光垫在聚合物基质组分内包括可溶组分，优选纤维状。 纤维组分包括可溶于浆料的纤维，足以在垫的抛光表面中提供空隙结构。 空隙结构通过增加研磨颗粒的迁移率同时减少抛光表面的划伤来提高抛光速率和均匀性。 进一步增强抛光和/或辅助去除在抛光过程中产生的残留物（如表面活性剂和去除剂）的添加剂任选地并入纤维状物质中，或者以地形方式包被在纤维状物质上。
-
4.发明授权公开(公告)号：US06712681B1
公开(公告)日：2004-03-30
申请号：US09715184
申请日：2000-11-20
申请人： Shyng-Tsong Chen , Kenneth P. Rodbell , Oscar Kai Chi Hsu , Jean Vangsness , David S. Gilbride , Scott Clayton Billings , Kenneth Davis
发明人： Shyng-Tsong Chen , Kenneth P. Rodbell , Oscar Kai Chi Hsu , Jean Vangsness , David S. Gilbride , Scott Clayton Billings , Kenneth Davis
IPC分类号： B24D1100
CPC分类号： B24B37/26 , B24D3/28 , B24D11/008 , B24D18/00
摘要： A polishing pad having a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors. The fibers define interstices, and the precursors fill these interstices substantially completely before completion of the reaction. The pad may include a thin layer of free fibers at its polishing surface. A segment of at least a portion of the free fibers are embedded in the adjacent body of the polymer and fibers. The fibers may be separate, or in the form of a woven or non-woven web.
-
-
-
搜索结果
4 条记录 (耗时 0.008 秒)
