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    Polishing pads with polymer filled fibrous web, and methods for fabricating and using same
    2.
    发明授权
    Polishing pads with polymer filled fibrous web, and methods for fabricating and using same 失效
    具有聚合物填充的纤维网的抛光垫，以及其制造和使用方法

    公开(公告)号：US06989117B2

    公开(公告)日：2006-01-24

    申请号：US10782922

    申请日：2004-02-23

    申请人： Shyng-Tsong Chen ,  Kenneth P. Rodbell ,  Oscar Kai Chi Hsu ,  Jean Vangsness ,  David S. Gilbride ,  Scott Clayton Billings ,  Kenneth Davis

    发明人： Shyng-Tsong Chen ,  Kenneth P. Rodbell ,  Oscar Kai Chi Hsu ,  Jean Vangsness ,  David S. Gilbride ,  Scott Clayton Billings ,  Kenneth Davis

    IPC分类号： B29C39/42

    CPC分类号： B24B37/26 ,  B24D3/28 ,  B24D11/008 ,  B24D18/00

    摘要： A method of making a polishing pad having a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors. The fibers define interstices, and the precursors fill these interstices substantially completely before completion of the reaction. The method comprising placing the fibers and the precursors in a cavity of a mold for shaping the polishing pad; applying a differential pressure across a mold cavity, where the differential pressure and the amount of precursors are sufficient to cause the precursors to fill the interstices substantially completely before completion of the reaction; and applying sufficient heat to the mold to at least partially cure the polishing pad by causing the precursors to react.

    摘要翻译： 一种制造抛光垫的方法，该抛光垫具有包含嵌入在通过聚合物前体的反应形成的基体聚合物中的纤维的主体。 纤维定义空隙，并且前体在反应完成之前基本上完全填充这些间隙。 该方法包括将纤维和前体放置在用于成形抛光垫的模具的空腔中; 在模具腔内施加压差，其中压差和前体的量足以使得前体在反应完成之前基本上完全填充空隙; 并且通过使前体反应来向模具施加足够的热量以至少部分地固化抛光垫。

    Polishing pad grooving method and apparatus
    6.
    发明授权
    Polishing pad grooving method and apparatus 失效
    抛光槽切槽方法及装置

    公开(公告)号：US06340325B1

    公开(公告)日：2002-01-22

    申请号：US09605869

    申请日：2000-06-29

    申请人： Shyng-Tsong Chen ,  Alex Siu Keung Chung ,  Kenneth M. Davis ,  Oscar Kai Chi Hsu ,  Kenneth P. Rodbell

    发明人： Shyng-Tsong Chen ,  Alex Siu Keung Chung ,  Kenneth M. Davis ,  Oscar Kai Chi Hsu ,  Kenneth P. Rodbell

    IPC分类号： B24B100

    CPC分类号： B24B37/26 ,  Y10T409/303808 ,  Y10T409/306608 ,  Y10T409/308624

    摘要： Grooves are formed in a COD pad by positioning the pad on a supporting surface with a working surface of the pad in spaced relation opposite to a router bit and at least one projecting stop member adjacent to the router bit, an outer end portion of the bit projecting beyond the stop. When the bit is rotated, relative axial movement between the bit and the pad causes the outer end portion of the bit to cut an initial recess in the pad. Relative lateral movement between the rotating bit and the pad then forms a groove which extends laterally away from the recess and has a depth substantially the same as that of the recess. The depths of the initial recess and the groove are limited by applying a vacuum to the working surface of the pad to keep it in contact with the stop member(s). Different lateral movements between the bit and the pad are used to form a variety of groove patterns, the depths of which are precisely controlled by the stop member(s).

    摘要翻译： 通过将焊盘定位在支撑表面上，通过将焊盘的工作表面与路由器钻头相对隔开的关系形成凹槽并形成至少一个与路由器钻头相邻的突出挡块，钻头的外端部分 突出超出停止。 当钻头旋转时，钻头和钻头之间的相对轴向运动使钻头的外端部分切割焊盘中的初始凹陷。 旋转钻头和垫之间的相对横向运动形成一个横向延伸离开凹槽并具有与凹槽基本相同的深度的凹槽。 通过将真空施加到垫的工作表面以使其与止动构件接触来限制初始凹部和凹槽的深度。 钻头和垫之间的不同横向运动用于形成各种凹槽图案，其深度由止动件精确地控制。

    Polishing pad
    7.
    发明授权
    Polishing pad 有权
    抛光垫

    公开(公告)号：US07534163B2

    公开(公告)日：2009-05-19

    申请号：US12039056

    申请日：2008-02-28

    申请人： Jean Vangsness ,  Oscar Kai Chi Hsu ,  Alaka Potnis

    发明人： Jean Vangsness ,  Oscar Kai Chi Hsu ,  Alaka Potnis

    IPC分类号： B24B7/19

    CPC分类号： B24B37/24 ,  B24B37/205 ,  B24D11/02 ,  C09K3/1463

    摘要： An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.

    摘要翻译： 公开了一种用于在存在可选地含有磨料颗粒的浆料的情况下抛光半导体和其它平面基板的改进的抛光垫。 抛光垫包括非织造纤维组分，任选地包含双组分纤维的部分，任选地嵌入聚合物基质组分中。

    Polishing Pad
    9.
    发明申请
    Polishing Pad 有权
    抛光垫

    公开(公告)号：US20080146131A1

    公开(公告)日：2008-06-19

    申请号：US12039056

    申请日：2008-02-28

    申请人： Jean Vangsness ,  Oscar Kai Chi Hsu ,  Alaka Potnis

    发明人： Jean Vangsness ,  Oscar Kai Chi Hsu ,  Alaka Potnis

    IPC分类号： B24D11/00 ,  B24B7/00 ,  C09K3/14

    CPC分类号： B24B37/24 ,  B24B37/205 ,  B24D11/02 ,  C09K3/1463

    摘要： An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.

    摘要翻译： 公开了一种用于在存在可选地含有磨料颗粒的浆料的情况下抛光半导体和其它平面基板的改进的抛光垫。 抛光垫包括非织造纤维组分，任选地包含双组分纤维的部分，任选地嵌入聚合物基质组分中。

    Polishing pad
    10.
    发明授权
    Polishing pad 有权
    抛光垫

    公开(公告)号：US07357704B2

    公开(公告)日：2008-04-15

    申请号：US11424466

    申请日：2006-06-15

    申请人： Jean Vangsness ,  Oscar Kai Chi Hsu ,  Alaka Potnis

    发明人： Jean Vangsness ,  Oscar Kai Chi Hsu ,  Alaka Potnis

    IPC分类号： B24D11/00

    CPC分类号： B24B37/24 ,  B24B37/205 ,  B24D11/02 ,  C09K3/1463

    摘要： An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.

    摘要翻译： 公开了一种用于在存在可选地含有磨料颗粒的浆料的情况下抛光半导体和其它平面基板的改进的抛光垫。 抛光垫包括非织造纤维组分，任选地包含双组分纤维的部分，任选地嵌入聚合物基质组分中。