公开(公告)号：US06662812B1

公开(公告)日：2003-12-16

申请号：US09621249

申请日：2000-07-21

申请人： Allen David Hertz ,  Eric L. Hertz ,  Dennis D. Epp

发明人： Allen David Hertz ,  Eric L. Hertz ,  Dennis D. Epp

IPC分类号： B08B310

CPC分类号： H05K3/227 ,  B08B7/028 ,  B41F35/005 ,  B41P2235/14 ,  F26B5/02 ,  F26B5/12 ,  H05K3/1216 ,  H05K3/26

摘要： A method and apparatus are disclosed for improving drying of a module, tooling, and solder stencils via the introduction of acoustic pressure waves and/or vibrational energy to the module, tooling, or solder stencils. The acoustic pressure waves may be created by a transducer where the waves are transferred to the module through air or a vibrational interface medium. The acoustic pressure waves impinge on the water droplets to atomize the droplets on the surface of the module and in the cracks, crevices and hard to reach areas of connectors and other components, without undesirable heat. The acoustic energy may further be used to assist in cleaning solder stencils within an automated screen printer.

摘要翻译： 公开了一种用于通过将声压波和/或振动能引入到模块，模具或焊料模板来改进模块，模具和焊料模板的干燥的方法和装置。 声压波可以由换能器产生，其中波通过空气或振动界面介质传递到模块。 声压波冲击水滴以雾化模块表面上的液滴，并且在裂缝，缝隙中难以到达连接器和其他部件的区域，而不会有不希望的热量。 还可以使用声能来帮助清洁自动丝网印刷机内的焊锡模板。

公开(公告)号：US06471111B1

公开(公告)日：2002-10-29

申请号：US09234328

申请日：1999-01-20

申请人： Allen D. Hertz ,  Dennis D. Epp ,  Eric L. Hertz

发明人： Allen D. Hertz ,  Dennis D. Epp ,  Eric L. Hertz

IPC分类号： B23K106

CPC分类号： H05K3/3468 ,  B23K1/085 ,  B23K2101/40 ,  H05K3/3415 ,  H05K2203/0285

摘要： A method and apparatus are disclosed for improving the release of molten solder from a module via the introduction of acoustic pressure waves to the module and/or molten solder wave. The acoustic pressure waves may be created by a transducer where the waves are transferred to the module and/or solder wave through the air or reduced oxygen atmosphere. The acoustic pressure waves impinge on the molten solder and the module to reduce solder skips, bridges and icicles. The acoustic pressure waves are directed at the module/molten solder boundary to apply pressure to the boundary causing a shearing action. The shearing action causes the excess molten solder to fall, with the aid of gravity, into the molten solder bath.

摘要翻译： 公开了一种用于通过将声压波引入模块和/或熔融焊波来改善熔融焊料从模块的释放的方法和装置。 声压波可以由换能器产生，其中波被传送到模块和/或通过空气或减少的氧气气氛的焊波。 声压波撞击熔融焊料和模块，以减少焊料跳跃，桥梁和冰柱。 声压波被引导到模块/熔融焊料边界，以对施加剪切作用的边界施加压力。 剪切作用导致多余的熔融焊料在重力的作用下下降到熔融焊料槽中。

公开(公告)号：US07293567B2

公开(公告)日：2007-11-13

申请号：US10737240

申请日：2003-12-16

申请人： Allen David Hertz ,  Eric Lee Hertz ,  Dennis D. Epp

发明人： Allen David Hertz ,  Eric Lee Hertz ,  Dennis D. Epp

IPC分类号： B08B3/10

CPC分类号： H05K3/227 ,  B08B7/028 ,  B41F35/005 ,  B41P2235/14 ,  F26B5/02 ,  F26B5/12 ,  H05K3/1216 ,  H05K3/26

摘要： A method and apparatus are disclosed for improving a screen printing process by applying vibrational energy to assist in the print release, cleaning, and drying processes. The vibrational energy or acoustic pressure waves may be created by a transducer where the waves are transferred to the stencil or printable material through air or a vibrational interface medium. The vibrational energy in turn assists with separating the printable material from the side walls of the apertures of the stencil. The vibrational energy can further assist in the process of cleaning the stencil. The acoustic pressure can also be used in the drying process by having the waves impinge on the water droplets to atomize the droplets on the surface of the stencil. The technology can be used for the assembly of Printed Circuit Assemblies, Ball Grid Array IC Packages, Flip Chip, etc. The same technology may be applied to other cleaning processes for cleaning Printed Circuit Assemblies, tooling, and the like, whereby the cleaning processes can assist in cleaning within the cracks, crevices and hard to reach areas of connectors and other components, without undesirable heat.

摘要翻译： 公开了一种用于通过施加振动能来帮助打印释放，清洁和干燥过程来改进丝网印刷过程的方法和装置。 振动能或声压波可以由换能器产生，其中波通过空气或振动界面介质转移到模板或可印刷材料。 振动能量又有助于将可印刷材料与模板孔的侧壁分开。 振动能量可进一步帮助清洗模板的过程。 声压还可用于干燥过程中，使波浪撞击在水滴上以雾化模板表面上的液滴。 该技术可用于印刷电路组件，球栅阵列IC封装，倒装芯片等的组装。相同的技术可以应用于清洁印刷电路组件，工具等的其它清洁工艺，由此清洁过程 可以帮助清洁裂缝，缝隙，难以到达连接器和其他部件的区域，而不会有不必要的热量。

公开(公告)号：US06138562A

公开(公告)日：2000-10-31

申请号：US208959

申请日：1998-12-10

申请人： Allen D. Hertz ,  Eric L. Hertz ,  Dennis D. Epp

发明人： Allen D. Hertz ,  Eric L. Hertz ,  Dennis D. Epp

IPC分类号： B23K1/08 ,  B41F15/12 ,  B41M1/12 ,  H05K3/12 ,  H05K3/34

CPC分类号： B23K1/085 ,  B41F15/12 ,  B41M1/125 ,  H05K3/1233 ,  B23K2201/40 ,  B41P2215/13 ,  H05K2203/0264 ,  H05K2203/0285 ,  H05K3/3415

摘要： Solder Paste, adhesives and other materials are screen printed onto Printed Circuit Boards (PCB's) during the assembly process for electronic circuit assemblies. Pressure forces may be applied to the material to aid in separating the material from the apertures within the stencil. The pressure forces are created from sound pressure waves generated from a vibrational energy source located some distance from the stencil. Examples of non-contacting vibrational energy sources include Ultrasonic transducers, horns, speakers, and tuning forks. Additional assistance to separate the material from the apertures may be applied by a vibrational source by contacting to the stencil. Examples of the contacting vibrational energy sources may be off-balanced motors, piezo-electric transducers, and mass-resonant vibrators.

摘要翻译： 在电子电路组件的组装过程中，焊膏，粘合剂和其他材料被丝网印刷到印刷电路板（PCB）上。 可以将压力施加到材料上以帮助将材料与模板中的孔分离。 压力由距离模板一定距离的振动能源产生的声压波产生。 非接触振动能源的实例包括超声波换能器，喇叭，扬声器和调音叉。 可以通过与模板接触的振动源来应用从孔中分离材料的附加帮助。 接触振动能源的示例可以是不平衡的电动机，压电换能器和质量共振振动器。