公开(公告)号：US6081028A

公开(公告)日：2000-06-27

申请号：US514390

申请日：1995-08-11

申请人： Ehsan Ettehadieh ,  Sunil Kaul ,  Dev Malladi

发明人： Ehsan Ettehadieh ,  Sunil Kaul ,  Dev Malladi

IPC分类号： H01L23/42

CPC分类号： H01L23/42 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/85399 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195

摘要： A thermal conducting material for providing lateral thermal conduction across a surface of an integrated circuit and for enhancing thermal dissipation from the integrated circuit. The integrated circuit is incorporated within a semiconductor device having a cavity package. A layer of the thermal conducting material, preferably electrically non-conductive, is disposed on a surface of an integrated circuit in the form of a die to provide lateral heat conduction to reduce the number of hot spots within the integrated circuit. Alternatively, the thermal conducting, electrically non-conductive material may be used to fill a cavity within the cavity package so that the cavity package dissipates heat in a more effective manner.

摘要翻译： 一种用于在集成电路的表面上提供横向热传导并用于增强集成电路的散热的导热材料。 集成电路结合在具有空腔封装的半导体器件中。 导热材料层优选不导电地设置在芯片形式的集成电路的表面上，以提供横向热传导以减少集成电路内的热点数量。 或者，导热的非导电材料可以用于填充空腔封装内的空腔，使得空腔封装以更有效的方式散热。