公开(公告)号：US4017495A

公开(公告)日：1977-04-12

申请号：US625315

申请日：1975-10-23

申请人： Donald Jaffe ,  Nicholas Alec Soos

发明人： Donald Jaffe ,  Nicholas Alec Soos

IPC分类号： H01L21/56 ,  H01L23/31 ,  B29C6/00

CPC分类号： H01L21/56 ,  H01L23/3121 ,  H01L2924/0002 ,  H01L2924/19041 ,  Y10T29/49146

摘要： Disclosed is a method of encapsulating integrated circuit chips formed on an insulating substrate which permits complete filling of areas under the chip. The encapsulant employed is a dispersion of a material, such as a silicone elastomer, which cures by reaction with water vapor. Subsequent to application of the encapsulant over and under the chip, the solvent of the dispersion is evaporated during a pre-cure treatment by means of a dry ambient of less than 5% relative humidity which suppresses crosslinking. After essentially all the solvent is thus removed, the encapsulant is cured by exposure to a second ambient of higher relative humidity which enhances crosslinking.

摘要翻译： 公开了一种封装形成在绝缘基板上的集成电路芯片的方法，其允许完全填充芯片下方的区域。 使用的密封剂是通过与水蒸气反应固化的材料（例如硅氧烷弹性体）的分散体。 在将密封剂涂覆在芯片之上和之下之后，通过小于5％相对湿度的干燥环境在预固化处理期间将分散体的溶剂蒸发，这抑制了交联。 在基本上所有溶剂被除去后，通过暴露于增强交联的较高相对湿度的第二环境来固化密封剂。

公开(公告)号：US4396140A

公开(公告)日：1983-08-02

申请号：US228954

申请日：1981-01-27

申请人： Donald Jaffe ,  Richard C. Kershner ,  Nicholas T. Panousis

发明人： Donald Jaffe ,  Richard C. Kershner ,  Nicholas T. Panousis

IPC分类号： H05K3/34 ,  B23K1/20 ,  H01L21/60

CPC分类号： H05K3/3484 ,  H05K3/3426 ,  H05K2201/10166 ,  H05K2201/10984 ,  H05K2203/0338 ,  H05K2203/043 ,  Y02P70/613

摘要： Disclosed is a method of bonding electronic components (14) to metallized substrates (21) by soldering. The solder is first deposited on an unmetallized substrate (10) in a pattern of discrete pads (11, 12, 13) corresponding to the leads (28, 29, 30) of the components to be bonded. The component leads are then placed on the pads and the solder is reflowed. The solder thereby adheres to the leads so that a controlled amount of solder will remain on each lead when the component is lifted from the substrate. The components can then be soldered to an appropriate metallized substrate.

摘要翻译： 公开了通过焊接将电子部件（14）与金属化基板（21）接合的方法。 焊料首先以对应于要结合的部件的引线（28,29,30）的离散焊盘（11,12,13）的图案沉积在未金属化的基板（10）上。 然后将部件引线放置在焊盘上，并且焊料被回流。 因此焊料粘附到引线上，使得当组件从衬底提起时，受控量的焊料将保留在每个引线上。 然后将组分焊接到合适的金属化基底上。