摘要:
A process for forming a dielectric isolation structure on a silicon substrate includes forming at least one trench in the substrate, performing a high-temperature treatment in an oxidizing environment to form a first liner layer of silicon dioxide on the walls and the bottom of the trench, and performing a silicon dioxide deposition treatment to form a second liner layer on the first liner layer. A silicon nitride deposition treatment is also performed to form a third liner layer on the second liner layer. The trench is filled with isolating material.
摘要:
A process for forming a dielectric isolation structure on a silicon substrate includes forming at least one trench in the substrate, performing a high-temperature treatment in an oxidizing environment to form a first liner layer of silicon dioxide on the walls and the bottom of the trench, and performing a silicon dioxide deposition treatment to form a second liner layer on the first liner layer. A silicon nitride deposition treatment is also performed to form a third liner layer on the second liner layer. The trench is filled with isolating material.
摘要:
A method for manufacturing a glass preform includes supplying a first gaseous or vapor phase composition to a reaction chamber; supplying water as a second gaseous or vapor phase composition to the reaction chamber; reacting the water and the first gaseous or vapor phase composition to form an aerosol of glass particles; directing the aerosol along the reaction chamber, out of the reaction chamber, and toward a target; and depositing glass particles of the aerosol onto the target. The first gaseous or vapor phase composition is disposed to provide a hydrolyzable glass precursor. Walls of the reaction chamber have a temperature gradient in which a temperature of the walls increases in a direction of flow of the aerosol along the reaction chamber. Alternatively, a flow of the aerosol along the reaction chamber has a temperature gradient in which a temperature of the aerosol increases in the direction of flow.