公开(公告)号：US20060103758A1

公开(公告)日：2006-05-18

申请号：US11108226

申请日：2005-04-18

Applicant: Dong-hyeon Yoon ,  Ha-cheon Jeong ,  San-deok Hwang ,  Sam-gi Park

Inventor： Dong-hyeon Yoon ,  Ha-cheon Jeong ,  San-deok Hwang ,  Sam-gi Park

IPC: H04N5/225

CPC classification number: H04N5/2253 ,  H04N5/2254 ,  H04N5/2257

Abstract: Provided is a camera module that includes: an image sensing device; a first signal transmitting element on which there are formed a device coupling portion that is coupled to the image sensing device, and an external coupling portion that extends from one end of the device coupling portion to protrude from the image sensing device and is coupled to an external substrate; an auto-focus (AF) module including: an AF device, and a second signal transmitting element coupled to the first signal transmitting element to electrically connect the AF device and the external substrate; a lens module including a plurality of lens which focuses light onto the image sensing device; and a coupling element that couples the first and second signal transmitting elements so that they are electrically connected.

Abstract translation: 提供一种照相机模块，其包括：图像感测装置; 第一信号发射元件，其上形成有耦合到图像感测装置的器件耦合部分，以及外部耦合部分，其从器件耦合部分的一端延伸到从图像感测器件突出并耦合到 外部基板; 自动对焦（AF）模块，包括：AF设备和耦合到第一信号传输元件的第二信号传输元件以电连接AF设备和外部基板; 透镜模块，包括将光聚焦到所述图像感测装置上的多个透镜; 以及连接第一和第二信号传输元件以使它们电连接的耦合元件。

公开(公告)号：US20050184352A1

公开(公告)日：2005-08-25

申请号：US10945469

申请日：2004-09-20

Applicant: Ha-cheon Jeong ,  Jung-kang Lyu ,  Dong-hyeon Yoon ,  San-deok Hwang

Inventor： Ha-cheon Jeong ,  Jung-kang Lyu ,  Dong-hyeon Yoon ,  San-deok Hwang

IPC: H01L27/14 ,  H01L23/00 ,  H01L27/146 ,  H01L31/0232 ,  H01L31/10 ,  H04N5/225

CPC classification number: H04N5/2254 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/3025 ,  H04N5/2252 ,  H01L2924/00

Abstract: A camera module package includes an image sensor module that can be formed as a chip scale package (CSP) with a wire bonding structure. The image sensor module includes an image sensing device unit having an image sensing device, a pixel area part formed on a surface of the image sensing device, and a device connecting pad formed on a surface of the image sensing device for electrically connecting to external devices; a circuit board to which the image sensing device unit is attached on one surface, to which a board connecting pad that is electrically connected to the image sensing device unit is formed on the other surface, and that contains holes corresponding to locations of the pixel area part and the device connecting pad; and a connecting unit for connecting the device connecting pad and the board connecting pad.

Abstract translation: 相机模块封装包括可以形成为具有引线键合结构的芯片级封装（CSP）的图像传感器模块。 图像传感器模块包括具有图像感测装置，形成在图像感测装置的表面上的像素区域部分的图像感测装置单元和形成在图像感测装置的表面上的用于电连接到外部装置的装置连接焊盘 ; 其中在一个表面上安装有图像感测装置单元的电路板，在另一个表面上形成电连接到图像感测装置单元的板连接垫，并且包含与像素区域的位置对应的孔 部件和设备连接垫; 以及用于连接装置连接垫和板连接垫的连接单元。

公开(公告)号：US20110293581A1

公开(公告)日：2011-12-01

申请号：US13126720

申请日：2009-02-02

Applicant: Jun Lee ,  Dong-Hyeon Yoon ,  Dong-Hyeon Hwang

Inventor： Jun Lee ,  Dong-Hyeon Yoon ,  Dong-Hyeon Hwang

IPC: A61K35/12 ,  A61K38/19 ,  A61K38/48 ,  B29C33/42 ,  A61K33/14 ,  A61K38/17 ,  A61P19/00 ,  C07K14/52 ,  A61K38/27

CPC classification number: A61L27/54 ,  A61L2300/252 ,  A61L2300/412 ,  A61L2430/02

Abstract: The present invention relates to a bone-regenerating composition containing angiogenin and to a bone-generating scaffold comprising the composition. Angiogenin has a superior ability to induce initial angiogenesis and bone regeneration as compared to the platelet rich plasma (PRP) which is used as a conventional element for stimulating bone regeneration, thus improving the speed of bone regeneration

Abstract translation: 本发明涉及包含血管生成素的骨再生组合物和包含该组合物的骨产生支架。 与富血小板血浆（PRP）相比，血管生成素具有优异的诱导初始血管生成和骨再生的能力，其用作刺激骨再生的常规元件，从而提高骨再生速度

公开(公告)号：US07456901B2

公开(公告)日：2008-11-25

申请号：US10945469

申请日：2004-09-20

Applicant: Ha-cheon Jeong ,  Jung-kang Lyu ,  Dong-hyeon Yoon ,  San-deok Hwang

Inventor： Ha-cheon Jeong ,  Jung-kang Lyu ,  Dong-hyeon Yoon ,  San-deok Hwang

IPC: H04N5/225 ,  H01L31/0203

CPC classification number: H04N5/2254 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/3025 ,  H04N5/2252 ,  H01L2924/00

Abstract: A camera module package includes an image sensor module that can be formed as a chip scale package (CSP) with a wire bonding structure. The image sensor module includes an image sensing device unit having an image sensing device, a pixel area part formed on a surface of the image sensing device, and a device connecting pad formed on a surface of the image sensing device for electrically connecting to external devices; a circuit board to which the image sensing device unit is attached on one surface, to which a board connecting pad that is electrically connected to the image sensing device unit is formed on the other surface, and that contains holes corresponding to locations of the pixel area part and the device connecting pad; and a connecting unit for connecting the device connecting pad and the board connecting pad.

Abstract translation: 相机模块封装包括可以形成为具有引线键合结构的芯片级封装（CSP）的图像传感器模块。 图像传感器模块包括具有图像感测装置，形成在图像感测装置的表面上的像素区域部分的图像感测装置单元和形成在图像感测装置的表面上的用于电连接到外部装置的装置连接焊盘 ; 其中在一个表面上安装有图像感测装置单元的电路板，在另一个表面上形成电连接到图像感测装置单元的板连接垫，并且包含与像素区域的位置对应的孔 部件和设备连接垫; 以及用于连接装置连接垫和板连接垫的连接单元。

公开(公告)号：US07864245B2

公开(公告)日：2011-01-04

申请号：US11108226

申请日：2005-04-18

Applicant: Dong-hyeon Yoon ,  Ha-cheon Jeong ,  San-deok Hwang ,  Sam-gi Park

Inventor： Dong-hyeon Yoon ,  Ha-cheon Jeong ,  San-deok Hwang ,  Sam-gi Park

IPC: H04N5/225

CPC classification number: H04N5/2253 ,  H04N5/2254 ,  H04N5/2257

Abstract: Provided is a camera module that includes: an image sensing device; a first signal transmitting element on which there are formed a device coupling portion that is coupled to the image sensing device, and an external coupling portion that extends from one end of the device coupling portion to protrude from the image sensing device and is coupled to an external substrate; an auto-focus (AF) module including: an AF device, and a second signal transmitting element coupled to the first signal transmitting element to electrically connect the AF device and the external substrate; a lens module including a plurality of lens which focuses light onto the image sensing device; and a coupling element that couples the first and second signal transmitting elements so that they are electrically connected.

Abstract translation: 提供一种照相机模块，其包括：图像感测装置; 第一信号传输元件，其上形成有耦合到图像感测装置的器件耦合部分，以及外部耦合部分，其从器件耦合部分的一端延伸到从图像感测器件突出并耦合到 外部基板; 自动对焦（AF）模块，包括：AF设备和耦合到第一信号传输元件的第二信号传输元件以电连接AF设备和外部基板; 透镜模块，包括将光聚焦到所述图像感测装置上的多个透镜; 以及连接第一和第二信号传输元件以使它们电连接的耦合元件。