摘要:
A memory structure has a wordline coupled to at least one memory cell and a wordline driver coupled to the wordline. Further, the memory structure has a wordline chopper coupled to the wordline and configured to discharge the wordline, wherein the memory cell is coupled to the wordline between the wordline driver and the wordline chopper.
摘要:
As pad of a memory array, a circuit is provided for altering the drive applied to an access transistor that regulates electrical communication within the memory array. In one embodiment, the circuit is used to alter the drive applied to a sense amp's voltage-pulling transistor, thereby allowing modification of the voltage-pulling rate for components of the sense amp. A sample of test data is written to the memory array and read several times at varying drive rates in order to determine the sense amp's ability to accommodate external circuitry. In another embodiment, the circuit is used to alter the drive applied to a bleeder device that regulates communication between the digit lines of the memory array and its cell plate. Slowing said communication allows defects within the memory array to have a more pronounced effect and hence increases the chances of finding such defects during testing. The circuit is configured to accept and apply a plurality of voltages, either through a contact pad or from a series of discrete voltage sources coupled to the circuit.
摘要:
Method and apparatus are disclosed for checking the resistance of antifuse elements in an integrated circuit. A voltage based on the resistance of an antifuse element is compared to a voltage based on a known resistance, and an output signal is generated whose binary value indicates whether the resistance of the antifuse element is higher or lower than the known value of resistance. The method and apparatus are useful in verifying the programming of antifuse elements.
摘要:
A processor comprises a chip, a temperature sensing device, a processor core, and a controller. The temperature sensing device, the processor core, and the controller are integrated on the chip. The controller is configured to set, based on the temperature sensing device, the processor core to a plurality of specified operating points to enable testing of the specified operating points. Each of the operating points is defined by a different temperature and frequency combination, and the processor core is configured to run a set of test codes at each of the operating points.