公开(公告)号：US07720559B1

公开(公告)日：2010-05-18

申请号：US10133073

申请日：2002-04-26

申请人： Edward C. Stewart

发明人： Edward C. Stewart

IPC分类号： G06F19/00

CPC分类号： G05B19/4187 ,  Y02P90/205

摘要： A method and an apparatus for routing a semiconductor wafer to at least one of a plurality of processing tools based upon tool performance. Data relating to a performance of a first processing tool and a performance of a second processing tool is acquired. A semiconductor wafer is routed to one of the first processing tool or the second processing tool based upon a comparison between the performance of the first processing tool and the performance of the second processing tool using a controller.

摘要翻译： 一种用于基于工具性能将半导体晶片布线到多个处理工具中的至少一个的方法和装置。 获取与第一处理工具的性能和第二处理工具的性能有关的数据。 基于使用控制器的第一处理工具的性能和第二处理工具的性能之间的比较，半导体晶片被路由到第一处理工具或第二处理工具中的一个。

公开(公告)号：US06850811B1

公开(公告)日：2005-02-01

申请号：US10085829

申请日：2002-02-28

申请人： Edward C. Stewart

发明人： Edward C. Stewart

IPC分类号： G05B19/418 ,  G05B23/02 ,  G06F19/00

CPC分类号： G05B19/41875 ,  G05B23/0275 ,  G05B2219/32196 ,  G05B2219/32222 ,  Y02P90/22

摘要： A method and system are provided for analyzing error signals based on fault detection. The method comprises detecting a fault associated with a processing of a workpiece in a manufacturing system having a plurality of processing tools, identifying at least one of the processing tools that processes the workpiece, and providing an error signal to the at least one of the identified processing tools to perform diagnostics based on the detected fault.

摘要翻译： 提供了一种基于故障检测来分析误差信号的方法和系统。 该方法包括检测在具有多个处理工具的制造系统中与工件的处理相关联的故障，识别处理工件的处理工具中的至少一个，以及向所识别的至少一个处理工具提供误差信号 处理工具可根据检测到的故障进行诊断。

公开(公告)号：US06266132B1

公开(公告)日：2001-07-24

申请号：US09401586

申请日：1999-09-22

申请人： Edward C. Stewart ,  Curtis W. Doss ,  Richard D. Edwards

发明人： Edward C. Stewart ,  Curtis W. Doss ,  Richard D. Edwards

IPC分类号： G03B2772

CPC分类号： G03F7/70008 ,  G03F7/70525

摘要： A method for detecting a degraded light source is provided. An exposure time associated with the light source is monitored. The exposure time is compared to at least one control limit. A degraded condition is identified based on the exposure time violating the control limit. A processing tool includes a stepper and an automatic process controller. The stepper has a light source and is adapted to illuminate a wafer for an exposure time. The automatic process controller is adapted to monitor the exposure time, compare the exposure time to at least one control limit, and identify a degraded condition based on the exposure time violating the control limit.

摘要翻译： 提供了一种用于检测劣化光源的方法。 监测与光源相关的曝光时间。 将曝光时间与至少一个控制限制进行比较。 根据违反控制限制的曝光时间确定退化状态。 一种加工工具包括步进机和自动过程控制器。 步进器具有光源并适于照射晶片以获得曝光时间。 自动过程控制器适于监视曝光时间，将曝光时间与至少一个控制限制进行比较，并根据违反控制限制的曝光时间识别劣化状态。

公开(公告)号：US6027190A

公开(公告)日：2000-02-22

申请号：US012270

申请日：1998-01-23

申请人： Edward C. Stewart ,  C. Allen Stewart

发明人： Edward C. Stewart ,  C. Allen Stewart

IPC分类号： A47B53/00

CPC分类号： A47B53/00

摘要： A high density linear storage system comprising at least one storage unit mounted to a base frame assembly. The at least one storage unit may include a plurality of shelves or storage compartments for storing files, books, computer printouts and the like. A handle is mounted on an end of the at least one storage unit to facilitate the extension and retraction of the unit. The base frame assembly includes a stationary base frame and a movable carriage. The carriage further comprises a primary frame and an intermediate frame, which telescopically nest within the base frame when in a fully retracted position. Rollers are attached to the frame members of the intermediate frame and are configured to slidably engage channel members of the base frame and the primary frame. Retaining clips are provided to prevent extension of the primary and intermediate frames beyond a predetermined distance. A locking mechanism prevents the extension of more than one storage unit at a time. A drive system may be provided to assist in the extension and retraction of storage units.

摘要翻译： 一种高密度线性存储系统，包括安装到基架组件的至少一个存储单元。 至少一个存储单元可以包括用于存储文件，书籍，计算机打印输出等的多个搁架或存储隔间。 手柄安装在所述至少一个存储单元的端部上以便于所述单元的伸缩。 基架组件包括固定基架和可移动滑架。 托架还包括主框架和中间框架，当处于完全缩回位置时，该框架和中间框架可伸缩地嵌入基座框架内。 辊子附接到中间框架的框架构件并且构造成可滑动地接合基架和主框架的通道构件。 提供保持夹以防止主框架和中间框架延伸超过预定距离。 锁定机构一次可防止多个存储单元的延伸。 可以提供驱动系统以帮助存储单元的伸缩。

公开(公告)号：US07620470B1

公开(公告)日：2009-11-17

申请号：US11241023

申请日：2005-09-30

申请人： Susan Hickey ,  Edward C. Stewart ,  Jason A. Grover ,  Cabe W. Nicksic

发明人： Susan Hickey ,  Edward C. Stewart ,  Jason A. Grover ,  Cabe W. Nicksic

IPC分类号： G06F19/00

CPC分类号： G05B19/41865 ,  G05B19/4184 ,  G05B2219/31455 ,  G05B2219/32243 ,  G05B2219/32297 ,  G05B2219/37224 ,  Y02P90/14 ,  Y02P90/20

摘要： A method, apparatus and a system, for provided for performing an automated process flow adjustment. A semiconductor wafer is processed based upon a routing plan and a predetermined schedule. A fault detection relating to the processing of the semiconductor wafer is performed. Dynamically modifying the predetermined routing plan or the predetermined schedule based upon the fault detection. A predetermined process material delivery plan is dynamically modified based upon the modifying of the routing plan or modifying of the predetermined schedule.

摘要翻译： 一种用于执行自动化处理流程调整的方法，装置和系统。 基于路由规划和预定时间表处理半导体晶片。 执行与半导体晶片的处理有关的故障检测。 基于故障检测动态地修改预定的路由计划或预定的时间表。 基于修改路由规划或修改预定时间表来动态地修改预定的处理材料传送计划。

公开(公告)号：US06766258B1

公开(公告)日：2004-07-20

申请号：US10160933

申请日：2002-05-31

申请人： Edward C. Stewart ,  Susan Hickey

发明人： Edward C. Stewart ,  Susan Hickey

IPC分类号： G01B528

CPC分类号： H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method includes identifying a degraded condition associated with the processing of a workpiece. At least one process tool associated with the degraded condition is identified. Trace data collection is enabled for the identified process tool. A system includes a processing system configured to process a workpiece and a tool monitor. The tool monitor is configured to identify a degraded condition associated with the processing of the workpiece, identify at least one process tool from the processing system associated with the degraded condition, and enable trace data collection for the identified process tool.

摘要翻译： 一种方法包括识别与工件的处理相关联的退化状态。 识别与劣化状况相关联的至少一个处理工具。 为识别的过程工具启用跟踪数据收集。 系统包括被配置为处理工件和工具监视器的处理系统。 工具监视器被配置为识别与工件的处理相关联的劣化状况，从与劣化状态相关联的处理系统识别至少一个处理工具，并且为所识别的过程工具启用跟踪数据收集。

公开(公告)号：US06563300B1

公开(公告)日：2003-05-13

申请号：US09832781

申请日：2001-04-11

申请人： Timothy L. Jackson ,  Richard J. Markle ,  Edward C. Stewart

发明人： Timothy L. Jackson ,  Richard J. Markle ,  Edward C. Stewart

IPC分类号： G01R3100

CPC分类号： G01R31/2894 ,  Y10S707/99945 ,  Y10S707/99948

摘要： A method for detecting faults in a manufacturing line includes processing a plurality of workpieces in a plurality of tools; generating a first error signal associated with the workpieces based on the processing performed in a first tool of the plurality of tools; generating a second error signal associated with the workpieces based on the processing performed in a second tool of the plurality of tools; combining the first and second error signals to generate a composite error signal; and identifying a fault condition with the workpieces based on the composite error signal. A manufacturing system includes a plurality of tools adapted to process workpieces, and a fault monitor. The fault monitor is adapted to receive a first error signal associated with the workpieces based on the processing performed in a first tool of the plurality of tools, receive a second error signal associated with the workpieces based on the processing performed in a second tool of the plurality of tools, combine the first and second error signals to generate a composite error signal, and identify a fault condition with the workpieces based on the composite error signal.

摘要翻译： 一种用于检测生产线中的故障的方法，包括在多个工具中处理多个工件; 基于在所述多个工具的第一工具中执行的处理来生成与所述工件相关联的第一错误信号; 基于在所述多个工具的第二工具中执行的处理，生成与所述工件相关联的第二误差信号; 组合第一和第二误差信号以产生复合误差信号; 并根据复合误差信号识别工件的故障状况。 制造系统包括适于处理工件的多个工具和故障监视器。 故障监视器适于基于在多个工具的第一工具中执行的处理来接收与工件相关联的第一错误信号，基于在工件的第二工具中执行的处理来接收与工件相关联的第二错误信号 多个工具，组合第一和第二误差信号以产生复合误差信号，并且基于复合误差信号识别与工件的故障状况。

公开(公告)号：US20110313818A1

公开(公告)日：2011-12-22

申请号：US13161873

申请日：2011-06-16

申请人： Darice M. Lulinski Grzybowski ,  Edward C. Stewart

发明人： Darice M. Lulinski Grzybowski ,  Edward C. Stewart

IPC分类号： G06Q10/00

CPC分类号： G06Q50/22 ,  G06Q10/06393

摘要： A web-based data analysis and tracking system and method for a medium to large organization. Metrics can be determined by asking pre-defined and special questions designed and modified by the facility or organization. The totality of answers to these questions represent a set of metrics that can be weighted and analyzed to produce comparisons with standard or chosen thresholds and/or industry standards. Compliance with best practices can be evaluated, and variances from best practices can be flagged and made visible. The present invention first assures that the organization has reliable data. Next, it analyzes this data to form comparisons and usable output. Finally, it presents the output in various graphical formats that can be used to base management decisions upon such as dashboards, graphs and textual output.

摘要翻译： 一种基于网络的数据分析和跟踪系统和方法，用于中大型组织。 指标可以通过询问设施或组织设计和修改的预定义和特殊问题来确定。 这些问题的答案总数代表一组可以加权和分析的指标，以便与标准或选定的阈值和/或行业标准进行比较。 可以评估遵守最佳做法的情况，并将最佳做法的差异标记并显示。 本发明首先确保组织具有可靠的数据。 接下来，它分析这些数据以形成比较和可用的输出。 最后，它提供了各种图形格式的输出，可用于基于诸如仪表板，图形和文本输出之间的管理决策。

公开(公告)号：US06890773B1

公开(公告)日：2005-05-10

申请号：US10126860

申请日：2002-04-19

申请人： Edward C. Stewart

发明人： Edward C. Stewart

IPC分类号： H01L21/66 ,  G06F19/00 ,  H01L23/58

CPC分类号： H01L22/20

摘要： A method and an apparatus for sorting between actual and perceived errors related to processing of semiconductor wafers. A plurality of semiconductor wafers are processed. Fault data relating to the processed semiconductor wafers is acquired. A trend associated with the fault data is determined. A determination is made whether the fault data relates to an actual fault associated with the semiconductor wafers or to a calibration error, based upon the trend. A component is notified of the calibration error in response to the determination that the fault data relates to the calibration error.

摘要翻译： 用于在与半导体晶片的处理相关的实际和感知到的错误之间进行排序的方法和装置。 处理多个半导体晶片。 获取与经处理的半导体晶片相关的故障数据。 确定与故障数据相关的趋势。 基于趋势，确定故障数据是否与与半导体晶片相关联的实际故障或校准误差相关。 响应于故障数据与校准误差有关的确定，向组件通知校准误差。

公开(公告)号：US06754593B1

公开(公告)日：2004-06-22

申请号：US10163566

申请日：2002-06-06

申请人： Edward C. Stewart ,  Jason A. Grover

发明人： Edward C. Stewart ,  Jason A. Grover

IPC分类号： G06K900

CPC分类号： H01L22/20 ,  G01N21/9501

摘要： A method for measuring defects includes receiving a defect characteristic measurement for each measurement site in a first subset of a plurality of measurement sites on a workpiece. A second subset of the plurality of measurement sites is defined. The size of the second subset is based on the defect characteristic measurements of the first subset of the plurality of measurement sites. A metrology tool is directed to measure the defect characteristic at each of the measurement site in the second subset responsive to the size of the second subset being greater than zero. A system includes a metrology tool and a controller. The metrology tool is configured to measure a defect characteristic at each of a first plurality of measurement sites on a workpiece. The controller is configured to compare the measured defect characteristics at the first plurality of measurement sites against a first predetermined threshold and direct the metrology tool to measure the defect characteristic at each of a second plurality of measurement sites on the workpiece responsive to the measured defect characteristics being greater than the first predetermined threshold.

摘要翻译： 用于测量缺陷的方法包括在工件上的多个测量点的第一子集中接收每个测量位置的缺陷特征测量。 定义多个测量点的第二子集。 第二子集的大小基于多个测量点的第一子集的缺陷特征测量。 计量工具用于测量第二子集中的每个测量部位的缺陷特征，响应于第二子集的大小大于零。 系统包括计量工具和控制器。 测量工具被配置为测量工件上的第一多个测量位置中的每一个处的缺陷特性。 控制器被配置为将第一多个测量点处的测量的缺陷特性与第一预定阈值进行比较，并且引导测量工具响应于测量的缺陷特性来测量工件上的第二多个测量位置的每一个处的缺陷特性 大于第一预定阈值。