摘要:
A method for detecting a degraded light source is provided. An exposure time associated with the light source is monitored. The exposure time is compared to at least one control limit. A degraded condition is identified based on the exposure time violating the control limit. A processing tool includes a stepper and an automatic process controller. The stepper has a light source and is adapted to illuminate a wafer for an exposure time. The automatic process controller is adapted to monitor the exposure time, compare the exposure time to at least one control limit, and identify a degraded condition based on the exposure time violating the control limit.
摘要:
A panel for constructing patio rooms, and the like, has a reinforcing offset I-beam extending along a first edge of the insulative board. A second lateral edge of the board has a reduced thickness portion which fits into the open side of the I-beam and forms two pockets which accommodate the engagement of two sets of spring fingers which positionally locate and secure adjacent panels together.
摘要:
This invention provides a vapor-tight luminaire with a housing that defines a continuous and unbroken sealed tubular lens extending in a longitudinal direction. The housing includes a pair of end cap structures removably and sealably mounted on each of opposing respective housing ends. The housing removably supports a lamp assembly that can include various reflector arrangements. The lamp assembly can include fluorescent tubular lamps and can include electronics, such as a ballast circuit. Illustratively, a supporting rail suspended from each of the opposing housing ends by respective posts slidably supports the lamp assembly. In this manner each of the housing and the lamp assembly are constructed and arranged to allow the lamp assembly to be passed into and out of the housing along the supporting rail when at least one of the end cap structures is removed from the respective one of the housing ends.
摘要:
A multipurpose tool assembly to perform a divot repair operation, a coring operation and/or a green surface smoothing operation on a golf green. There is an elongate operating section having on one end a divot repair tool portion and on the other end a coring tool portion. The operating section can be connected to the handle in either of two configurations to perform either the divot repair operation or the coring operation.
摘要:
An alignment mark protection structure (95) is disclosed which is used to ensure an integrity of an alignment scheme for a substrate (50) which is to be subjected to lithographic processing. The alignment mark protection structure (95) comprises the substrate (50) and an alignment mark (52) associated with the substrate (50). The alignment mark (52) reflects an alignment light (208) which is then used to determine an optimum alignment between the substrate (50) and a lithographic mask (214). A cap (100) overlies the alignment mark (52) and is substantially transparent with respect to the alignment light (208). The cap (100) protects the underlying alignment mark (52) from lithographic process-induced damage during processing and thus reduces alignment light noise, thereby improving the alignment between a mask (214) and the substrate (50) and minimizing the registration error associated with overlying layers formed on the substrate (50).
摘要:
A golf green repair tool with a depth limiting feature that has an earth engagement surface that has a forward slant to reposition the raised portion around a crater to the center region of the crater. A prong portion is adapted to be thrusted toward the center region of the crater and the repair tool is adapted to do minimal damage to the turf mat and provides a desirable method to repair craters left by impacting golf balls by properly repositioning of the displaced portions.
摘要:
A golf green repair tool with a depth limiting feature that has an earth engagement surface that has a forward slant to reposition the raised portion around a crater to the center region of the crater. A prong portion is adapted to be thrusted toward the center region of the crater and the repair tool is adapted to do minimal damage to the turf mat and provides a desirable method to repair craters left by impacting golf balls by properly repositioning of the displaced portions.
摘要:
A method and an apparatus for selectively applying correction to a process control. Manufacturing data relating to the processing of a workpiece is acquired. The manufacturing data includes metrology data relating to the processed workpiece. An adjustment for at least a first or a second control input parameter is determined based upon the manufacturing data. The first and second control input parameters are organized to isolate the first control input parameter from the second control input parameter for adjusting at least one of the first and the second control input parameters, using a controller.
摘要:
The present invention provides for a method and apparatus for correction of overlay control errors. Semiconductor devices are processed based upon control input parameters. The processed semiconductor devices are examined in a review station. The control input parameters are modified in response to the examination of the processed semiconductor devices. New control input parameters are implemented for a subsequent run of the semiconductor device processing step based upon the modification of the control input parameters.
摘要:
A method for processing a semiconductor substrate is presented wherein an alignment mark is formed in an alignment mark area of the semiconductor substrate. The alignment mark area is contained within a window area of the semiconductor substrate. The upper surface of the semiconductor substrate within the window area is recessed below the upper surface of the semiconductor substrate outside of the window area, preferably by exposing the upper surface of the semiconductor substrate within the window area to an etchant. Such recession forms an alignment mark trench within the window area. Being substantially recessed below the original surface of the semiconductor substrate, an alignment mark formed in such a manner may be substantially protected from chemical-mechanical polishing damage during subsequent processing steps.