公开(公告)号：US5759427A

公开(公告)日：1998-06-02

申请号：US704193

申请日：1996-08-28

申请人： Edward Cibulsky ,  Gerald Andrew Kiballa ,  Voya Rista Markovich ,  Gary Leigh Newman ,  John Francis Prikazsky ,  Michael Wozniak

发明人： Edward Cibulsky ,  Gerald Andrew Kiballa ,  Voya Rista Markovich ,  Gary Leigh Newman ,  John Francis Prikazsky ,  Michael Wozniak

IPC分类号： B24B7/06 ,  B24B37/04 ,  B24B41/047 ,  C23F1/08 ,  H05K3/06 ,  H05K3/26 ,  C23F1/02 ,  C23F1/44

CPC分类号： B24B37/04 ,  B24B41/047 ,  B24B7/06 ,  C23F1/08 ,  H05K3/068 ,  H05K3/26 ,  H05K2203/025 ,  H05K2203/0346 ,  H05K2203/0353 ,  H05K2203/1509

摘要： A technique for chemically planarizing an exposed surface of metal on a substrate to a pre-determined thickness is provided. The substrate has an exposed metal surface such as copper circuitry on a dielectric substrate which is to be planarized. Typically, this will be circuitization extending above a photoresist layer. A planarizing head is rotated against the substrate, with the planarizing head in contact with the metal surface on the substrate. A chemical etchant, essentially free of abrasive material, is continuously supplied to the interface between the metal surface and the planarizing head. The planarizing continues until a predetermined thickness of the metal has been reached. In circuit board manufacturing, this will form a surface co-planar with the photoresist. In some instances where significant height reduction is required, thus requiring significant metal removal, several passes of the substrate may be required or a device with multiple heads may be used. On all but the last pass or last head, the planarizing head may include a film of polyester impregnated with very fine grit, such as 15.mu. or less silicon carbide (SiC). However, on the final pass or head, a relatively hard surface roll, e.g., rubber, free of added grit, is used to ensure a planar surface free of gouges.

摘要翻译： 提供了一种用于将基板上的金属的暴露表面化学平坦化至预定厚度的技术。 衬底具有暴露的金属表面，例如待平坦化的电介质衬底上的铜电路。 通常，这将是在光致抗蚀剂层之上延伸的电路。 平面化头相对于衬底旋转，平坦化头与衬底上的金属表面接触。 基本上不含研磨材料的化学蚀刻剂被连续供应到金属表面和平坦化头部之间的界面。 平面化继续，直到达到预定厚度的金属。 在电路板制造中，这将形成与光致抗蚀剂共面的表面。 在需要显着降低高度的一些情况下，因此需要显着的金属去除，可能需要多次通过基底，或者可以使用具有多个头部的装置。 除了最后一次或最后一个头部之外，平坦化头可以包括浸渍有非常细的砂砾的聚酯薄膜，例如15微米或更少的碳化硅（SiC）。 然而，在最后的通行或头部，使用相对硬的表面辊，例如没有添加砂砾的橡胶，以确保没有气刨的平面。