公开(公告)号：US06471328B1

公开(公告)日：2002-10-29

申请号：US08888866

申请日：1997-07-07

申请人： Ronald Joseph Becker ,  Gerald Andrew Kiballa ,  Wayne David Klossner

发明人： Ronald Joseph Becker ,  Gerald Andrew Kiballa ,  Wayne David Klossner

IPC分类号： B41J2165

CPC分类号： B41J2/16552

摘要： A system for cleaning clogged orifices of a fluid head includes both apparatus and method by which reverse flow of a cleaning solution is combined with providing the vibrational energy of an ultrasonic frequency generator to the fluid head. A liquid pump and a filter interconnect between the input terminal of a fluid head to be cleaned and the input to the cleaning chamber of the apparatus so that a liquid cleaning solution reverse flushes the clogged fluid head, while the ultrasonic frequency generator is providing vibrational energy to break loose stubborn clogs.

摘要翻译： 用于清洁流体头部堵塞的孔的系统包括将清洗溶液的反向流动与提供超声波发生器的振动能量提供给流体头的装置和方法。 在待清洁的流体头的输入端和设备的清洁室的输入端之间的液体泵和过滤器互连，使得液体清洁溶液反向冲洗堵塞的流体头，同时超声波发生器提供振动能量 打破松散的顽固木。。

公开(公告)号：US5759427A

公开(公告)日：1998-06-02

申请号：US704193

申请日：1996-08-28

申请人： Edward Cibulsky ,  Gerald Andrew Kiballa ,  Voya Rista Markovich ,  Gary Leigh Newman ,  John Francis Prikazsky ,  Michael Wozniak

发明人： Edward Cibulsky ,  Gerald Andrew Kiballa ,  Voya Rista Markovich ,  Gary Leigh Newman ,  John Francis Prikazsky ,  Michael Wozniak

IPC分类号： B24B7/06 ,  B24B37/04 ,  B24B41/047 ,  C23F1/08 ,  H05K3/06 ,  H05K3/26 ,  C23F1/02 ,  C23F1/44

CPC分类号： B24B37/04 ,  B24B41/047 ,  B24B7/06 ,  C23F1/08 ,  H05K3/068 ,  H05K3/26 ,  H05K2203/025 ,  H05K2203/0346 ,  H05K2203/0353 ,  H05K2203/1509

摘要： A technique for chemically planarizing an exposed surface of metal on a substrate to a pre-determined thickness is provided. The substrate has an exposed metal surface such as copper circuitry on a dielectric substrate which is to be planarized. Typically, this will be circuitization extending above a photoresist layer. A planarizing head is rotated against the substrate, with the planarizing head in contact with the metal surface on the substrate. A chemical etchant, essentially free of abrasive material, is continuously supplied to the interface between the metal surface and the planarizing head. The planarizing continues until a predetermined thickness of the metal has been reached. In circuit board manufacturing, this will form a surface co-planar with the photoresist. In some instances where significant height reduction is required, thus requiring significant metal removal, several passes of the substrate may be required or a device with multiple heads may be used. On all but the last pass or last head, the planarizing head may include a film of polyester impregnated with very fine grit, such as 15.mu. or less silicon carbide (SiC). However, on the final pass or head, a relatively hard surface roll, e.g., rubber, free of added grit, is used to ensure a planar surface free of gouges.

摘要翻译： 提供了一种用于将基板上的金属的暴露表面化学平坦化至预定厚度的技术。 衬底具有暴露的金属表面，例如待平坦化的电介质衬底上的铜电路。 通常，这将是在光致抗蚀剂层之上延伸的电路。 平面化头相对于衬底旋转，平坦化头与衬底上的金属表面接触。 基本上不含研磨材料的化学蚀刻剂被连续供应到金属表面和平坦化头部之间的界面。 平面化继续，直到达到预定厚度的金属。 在电路板制造中，这将形成与光致抗蚀剂共面的表面。 在需要显着降低高度的一些情况下，因此需要显着的金属去除，可能需要多次通过基底，或者可以使用具有多个头部的装置。 除了最后一次或最后一个头部之外，平坦化头可以包括浸渍有非常细的砂砾的聚酯薄膜，例如15微米或更少的碳化硅（SiC）。 然而，在最后的通行或头部，使用相对硬的表面辊，例如没有添加砂砾的橡胶，以确保没有气刨的平面。