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公开(公告)号：US07034301B2
公开(公告)日：2006-04-25
申请号：US10761769
申请日：2004-01-20
IPC分类号： G01J5/00
摘要： Systems and methods for microbolometer focal plane arrays are disclosed. For example, in accordance with an embodiment of the present invention, microbolometer focal plane array circuitry is disclosed for a microbolometer array having shared contacts between adjacent microbolometers. Various techniques may be applied to compensate for non-uniformities, such as for example, to allow operation over a calibrated temperature range.
摘要翻译： 公开了用于微测光计焦平面阵列的系统和方法。 例如，根据本发明的实施例，公开了一种具有在相邻的微测热计之间具有共享触点的微热辐射计阵列的微测热计焦平面阵列电路。 可以应用各种技术来补偿不均匀性，例如允许在校准的温度范围上进行操作。
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公开(公告)号：US09143703B2
公开(公告)日：2015-09-22
申请号：US13491428
申请日：2012-06-07
CPC分类号： H04N5/33 , G01J5/00 , G01J5/02 , G01J5/20 , G01J5/522 , H04N5/2257 , H04N5/2351 , H04N5/2354 , H04N5/332 , H04N7/18
摘要： Various techniques are disclosed for testing and/or calibrating infrared imaging modules. For example, a method of calibrating an infrared imaging module may include providing a plurality of temperature controlled environments. The method may also include transporting the infrared imaging module through the environments. The method may also include performing a measurement in each environment using an infrared sensor assembly of the infrared imaging module and determining a plurality of calibration values for the infrared imaging module based on the measurements.
摘要翻译： 公开了用于测试和/或校准红外成像模块的各种技术。 例如，校准红外成像模块的方法可以包括提供多个受温度控制的环境。 该方法还可以包括通过环境传输红外成像模块。 该方法还可以包括使用红外成像模块的红外传感器组件在每个环境中执行测量，并且基于测量来确定红外成像模块的多个校准值。
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公开(公告)号：US20120312976A1
公开(公告)日：2012-12-13
申请号：US13491428
申请日：2012-06-07
IPC分类号： H01L27/146
CPC分类号： H04N5/33 , G01J5/00 , G01J5/02 , G01J5/20 , G01J5/522 , H04N5/2257 , H04N5/2351 , H04N5/2354 , H04N5/332 , H04N7/18
摘要： Various techniques are disclosed for testing and/or calibrating infrared imaging modules. For example, a method of calibrating an infrared imaging module may include providing a plurality of temperature controlled environments. The method may also include transporting the infrared imaging module through the environments. The method may also include performing a measurement in each environment using an infrared sensor assembly of the infrared imaging module and determining a plurality of calibration values for the infrared imaging module based on the measurements.
摘要翻译： 公开了用于测试和/或校准红外成像模块的各种技术。 例如，校准红外成像模块的方法可以包括提供多个受温度控制的环境。 该方法还可以包括通过环境传输红外成像模块。 该方法还可以包括使用红外成像模块的红外传感器组件在每个环境中执行测量，并且基于测量来确定红外成像模块的多个校准值。
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公开(公告)号：US08729474B1
公开(公告)日：2014-05-20
申请号：US12576971
申请日：2009-10-09
申请人： Eric A. Kurth , Patrick Franklin
发明人： Eric A. Kurth , Patrick Franklin
IPC分类号： H01L31/02
CPC分类号： H01L27/14636 , G01J5/023 , G01J5/024 , G01J5/20 , H01L27/14607 , H01L27/1462 , H01L27/14669 , H01L27/14683
摘要： Systems and methods are directed to contacts for an infrared detector. For example, an infrared imaging device includes a substrate having a first metal layer and an infrared detector array coupled to the substrate via a plurality of contacts. Each contact includes for an embodiment a second metal layer formed on the first metal layer; a third metal layer formed on the second metal layer, wherein the third metal layer at least partially fills an inner portion of the contact; and a first passivation layer formed on the third metal layer.
摘要翻译： 系统和方法针对红外探测器的触点。 例如，红外成像装置包括具有第一金属层的基板和经由多个触点耦合到基板的红外检测器阵列。 每个触点包括形成在第一金属层上的第二金属层的实施例; 形成在所述第二金属层上的第三金属层，其中所述第三金属层至少部分地填充所述接触件的内部; 以及形成在所述第三金属层上的第一钝化层。
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公开(公告)号：US07749690B2
公开(公告)日：2010-07-06
申请号：US10883316
申请日：2004-06-30
IPC分类号： G03C5/00
CPC分类号： H01L23/544 , G03F9/7076 , H01L2223/54433 , H01L2223/5448 , H01L2924/0002 , H01L2924/00
摘要： Systems and methods are disclosed herein to provide die identification. For example, in accordance with an embodiment of the present invention, a wafer patterning technique is disclosed that provides multiple-exposure patterning to provide a unique identifying mark for each die on a wafer.
摘要翻译： 本文公开了系统和方法以提供管芯识别。 例如，根据本发明的实施例，公开了提供多次曝光图案化以为晶片上的每个管芯提供唯一的识别标记的晶片图案化技术。
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