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1.发明授权公开(公告)号：US07757538B2
公开(公告)日：2010-07-20
申请号：US11213384
申请日：2005-08-26
CPC分类号： B42D25/425 , B42D25/00 , B42D25/23 , B42D25/24 , B42D25/324 , B42D25/328 , B42D2035/26 , B44B5/026 , B44C1/225 , B44C1/227 , B44C1/228 , Y10S72/70
摘要： The invention concerns an embossing plate for a hot-cold-laminating press with a three-dimensional structure based on an essentially flawless metal plate with a hardened surface of appropriate thickness and dimensions and a suitable surface, specifically a highly polished surface, into which or onto which the three-dimensional structure is incorporated by a process with at least two steps.An embossing plate produced by this process is used for the production of documents, specifically security documents, such as personal identity cards, passports, identification cards, credit cards, customer cards, driving licenses and similar sheet and/or card and/or book-like documents by means of hot-cold-lamination and/or embossing and/or item-by-item embossing.
摘要翻译： 本发明涉及一种具有三维结构的热 - 冷层压压机的压花板，其基于具有适当厚度和尺寸的硬化表面的基本上无瑕疵的金属板，以及合适的表面，特别是高度抛光的表面， 通过具有至少两个步骤的方法将三维结构并入到其上。 通过该方法生产的压纹板用于生产文件，特别是安全文件，例如个人身份证，护照，身份证，信用卡，客户卡，驾驶执照和类似的表格和/或卡和/或书籍， 通过热冷层压和/或压花和/或逐项压印来形成类似的文件。
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公开(公告)号：US20100295286A1
公开(公告)日：2010-11-25
申请号：US12800474
申请日：2010-05-13
CPC分类号： G06K19/07749 , B42D3/12
摘要： An electronic cover for a passport, booklet or the like includes an electronic device and a layer of cover material that are bonded together by a fill-up adhesive layer, the electronic device preferably being in the form of an RFID inlay that includes a substrate, an antenna coupled to the substrate and an integrated circuit (IC) chip module conductively coupled to the antenna. During manufacture of the cover, the fill-up adhesive layer is applied to at least one of the electronic device and the layer of cover material. Immediately thereafter, the electronic device and the layer of cover material are held spaced apart from one another a predefined distance so as to define a void therebetween. Through a suitable trigger, the fill-up adhesive layer expands to fill in the entire void and subsequently cures to bond the electronic device to the layer of cover material.
摘要翻译： 用于护照，小册子等的电子盖包括通过填充粘合剂层结合在一起的电子装置和覆盖材料层，电子装置优选地为包括基板的RFID嵌体的形式， 耦合到衬底的天线以及与天线导电耦合的集成电路（IC）芯片模块。 在盖的制造期间，将填充粘合剂层施加到电子装置和覆盖材料层中的至少一个。 此后，电子设备和覆盖材料层彼此间隔开预定距离，以便在它们之间形成空隙。 通过合适的触发器，填充粘合剂层膨胀以填充整个空隙，随后固化以将电子装置粘合到覆盖材料层。
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3.发明申请公开(公告)号：US20060191861A1
公开(公告)日：2006-08-31
申请号：US11213384
申请日：2005-08-26
IPC分类号： C23F1/00
CPC分类号： B42D25/425 , B42D25/00 , B42D25/23 , B42D25/24 , B42D25/324 , B42D25/328 , B42D2035/26 , B44B5/026 , B44C1/225 , B44C1/227 , B44C1/228 , Y10S72/70
摘要： The invention concerns an embossing plate for a hot-cold-laminating press with a three-dimensional structure based on an essentially flawless metal plate with a hardened surface of appropriate thickness and dimensions and a suitable surface, specifically a highly polished surface, into which or onto which the three-dimensional structure is incorporated by a process with at least two steps. An embossing plate produced by this process is used for the production of documents, specifically security documents, such as personal identity cards, passports, identification cards, credit cards, customer cards, driving licenses and similar sheet and/or card and/or book-like documents by means of hot-cold-lamination and/or embossing and/or item-by-item embossing.
摘要翻译： 本发明涉及一种具有三维结构的热 - 冷层压压机的压花板，其基于具有适当厚度和尺寸的硬化表面的基本上无瑕疵的金属板，以及合适的表面，特别是高度抛光的表面， 通过具有至少两个步骤的方法将三维结构并入到其上。 通过该方法生产的压纹板用于生产文件，特别是安全文件，例如个人身份证，护照，身份证，信用卡，客户卡，驾驶执照和类似的表格和/或卡和/或书籍， 通过热冷层压和/或压花和/或逐项压印来形成类似的文件。
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