公开(公告)号：US20120205689A1

公开(公告)日：2012-08-16

申请号：US13336540

申请日：2011-12-23

申请人： Erin R.F. Welch ,  Christopher P. Hussell ,  Jesse Colin Reiherzer ,  Joseph Clark

发明人： Erin R.F. Welch ,  Christopher P. Hussell ,  Jesse Colin Reiherzer ,  Joseph Clark

IPC分类号： H01L33/60

CPC分类号： H01L33/60 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Light emitting devices and methods are disclosed. In one embodiment a light emitting device can include a submount and a plurality of light emitting diodes (LEDs) disposed over the submount. At least a portion of the submount can include a reflective layer at least partially disposed below a solder mask. One or more layers within the submount may include one or more holes, a rough surface texture, or combinations thereof to improve adhesion within the device. The device can further include a retention material dispensed about the plurality of LEDs. Devices and methods are disclosed for improved solder mask adhesion.

摘要翻译： 公开了发光器件和方法。 在一个实施例中，发光器件可以包括设置在所述底座上的基座和多个发光二极管（LED）。 底座的至少一部分可以包括至少部分地布置在焊接掩模下方的反射层。 底座内的一个或多个层可以包括一个或多个孔，粗糙的表面纹理或其组合以改善装置内的粘附。 该装置还可以包括分配在多个LED周围的保留材料。 公开了用于改善焊接掩模附着力的装置和方法。