公开(公告)号：US20080252300A1

公开(公告)日：2008-10-16

申请号：US11979989

申请日：2007-11-13

Applicant: Heng-Lung Su ,  Wen-Shian Huang ,  Sheng-Feng Tseng ,  Feng-Chen Cheng ,  Chang-Shuo Lee

Inventor： Heng-Lung Su ,  Wen-Shian Huang ,  Sheng-Feng Tseng ,  Feng-Chen Cheng ,  Chang-Shuo Lee

IPC: G01R31/04

CPC classification number: G01R1/0483

Abstract: A detecting device for detecting the electrical connection between several first pads and second pads of a package substrate is provided. The first and the second pads are disposed on two opposite sides of the package substrate. The detecting device includes a socket unit, several first detecting components and several second detecting components. The socket unit is disposed on and coupled to the first pads. The first detecting components are disposed on and coupled to the socket unit. The second detecting components are disposed under and coupled to the second pads. The socket unit and the second detecting components are disposed on two opposite sides of the package substrate. While detecting, the first detecting components, the socket unit, the first pads, the second pads and the second detecting components are electrically connected sequentially, so as to determine whether the first pads are respectively and electrically connected to the second pads.

Abstract translation: 提供一种用于检测封装衬底的几个第一焊盘和第二焊盘之间的电连接的检测装置。 第一和第二焊盘设置在封装衬底的两个相对侧上。 检测装置包括插座单元，多个第一检测部件和若干第二检测部件。 插座单元设置在第一焊盘上并耦合到第一焊盘。 第一检测部件设置在插座单元上并耦合到插座单元。 第二检测部件设置在第二焊盘的下面并且耦合到第二焊盘。 插座单元和第二检测部件设置在封装基板的两个相对侧上。 在检测时，第一检测部件，插座单元，第一焊盘，第二焊盘和第二检测部件依次电连接，以便确定第一焊盘是否分别电连接到第二焊盘。

公开(公告)号：US20100322158A1

公开(公告)日：2010-12-23

申请号：US12488917

申请日：2009-06-22

Applicant: JUNG A. LEE ,  FENG-CHEN CHENG

Inventor： JUNG A. LEE ,  FENG-CHEN CHENG

IPC: H04W4/00

CPC classification number: H04L1/0072 ,  H04L1/0046 ,  H04L5/001 ,  H04L5/0053 ,  H04L5/0092 ,  H04L5/0094

Abstract: The present invention provides a method involving an access network and user equipment that supports communication over an air interface using a plurality of component carriers. The method includes transmitting information indicating that a first component carrier is an anchor carrier for the user equipment. The information is transmitted from the access network in a first field of the first component carrier, which selected from the plurality of component carriers. The method also includes transmitting information indicating that one or more second component carriers is allocated as a non-anchor carrier for the user equipment.

Abstract translation: 本发明提供一种涉及使用多个分量载波在空中接口上支持通信的接入网络和用户设备的方法。 该方法包括发送指示第一分量载波是用户设备的锚定载波的信息。 从第一分量载波的第一场中从接入网发送信息，其从多个分量载波中选择。 该方法还包括发送指示一个或多个第二分量载波被分配为用于用户设备的非锚定载波的信息。

公开(公告)号：US20090046436A1

公开(公告)日：2009-02-19

申请号：US12126043

申请日：2008-05-23

Applicant: Hsueh An YANG ,  Meng Jen WANG ,  Wei Chung WANG ,  Ming Chiang LEE ,  Wei Pin HUANG ,  Feng Chen CHENG

Inventor： Hsueh An YANG ,  Meng Jen WANG ,  Wei Chung WANG ,  Ming Chiang LEE ,  Wei Pin HUANG ,  Feng Chen CHENG

IPC: H05K1/00 ,  H05K3/10

CPC classification number: B81C1/0023 ,  B81B2201/0257 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/1461 ,  H01L2924/3025 ,  Y10T29/49162 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A MEMS package includes a first board, a second board and a laminate material. The first board includes a lower metallic trace, a metallic diaphragm and a through opening. The lower metallic trace is located on the lower surface of the first board, and the metallic diaphragm is disposed on the lower metallic trace. The second board includes an upper metallic trace and a metallic electrode. The upper metallic trace is located on the upper surface of the second board, the metallic electrode is disposed on the upper metallic trace, and the metallic electrode is corresponding to the metallic diaphragm. The laminate material is disposed between the lower and upper metallic traces, and includes a hollow portion for accommodating the metallic electrode and metallic diaphragm, wherein a sensing unit is formed by the metallic electrode, the hollow portion and the metallic diaphragm, and is corresponding to the through opening.

Abstract translation: MEMS封装包括第一板，第二板和层压材料。 第一板包括下金属痕迹，金属隔膜和通孔。 下部金属轨迹位于第一板的下表面上，并且金属隔膜设置在下部金属轨迹上。 第二板包括上金属痕迹和金属电极。 上金属轨迹位于第二板的上表面上，金属电极设置在上金属轨迹上，金属电极对应于金属隔膜。 层压材料设置在下金属轨迹和上金属迹线之间，并且包括用于容纳金属电极和金属隔膜的中空部分，其中感测单元由金属电极，中空部分和金属隔膜形成，并且对应于 通过开口。

公开(公告)号：US07839150B2

公开(公告)日：2010-11-23

申请号：US11979989

申请日：2007-11-13

Applicant: Heng-Lung Su ,  Wen-Shian Huang ,  Sheng-Feng Tseng ,  Feng-Chen Cheng ,  Chang-Shuo Lee

Inventor： Heng-Lung Su ,  Wen-Shian Huang ,  Sheng-Feng Tseng ,  Feng-Chen Cheng ,  Chang-Shuo Lee

IPC: G01R31/02

CPC classification number: G01R1/0483

Abstract: A detecting device for detecting the electrical connection between several first pads and second pads of a package substrate is provided. The first and the second pads are disposed on two opposite sides of the package substrate. The detecting device includes a socket unit, several first detecting components and several second detecting components. The socket unit is disposed on and coupled to the first pads. The first detecting components are disposed on and coupled to the socket unit. The second detecting components are disposed under and coupled to the second pads. The socket unit and the second detecting components are disposed on two opposite sides of the package substrate. While detecting, the first detecting components, the socket unit, the first pads, the second pads and the second detecting components are electrically connected sequentially, so as to determine whether the first pads are respectively and electrically connected to the second pads.

Abstract translation: 提供一种用于检测封装衬底的几个第一焊盘和第二焊盘之间的电连接的检测装置。 第一和第二焊盘设置在封装衬底的两个相对侧上。 检测装置包括插座单元，多个第一检测部件和若干第二检测部件。 插座单元设置在第一焊盘上并耦合到第一焊盘。 第一检测部件设置在插座单元上并耦合到插座单元。 第二检测部件设置在第二焊盘的下面并且耦合到第二焊盘。 插座单元和第二检测部件设置在封装基板的两个相对侧上。 在检测时，第一检测部件，插座单元，第一焊盘，第二焊盘和第二检测部件依次电连接，以便确定第一焊盘是否分别电连接到第二焊盘。

公开(公告)号：US07706149B2

公开(公告)日：2010-04-27

申请号：US12126043

申请日：2008-05-23

Applicant: Hsueh An Yang ,  Meng Jen Wang ,  Wei Chung Wang ,  Ming Chiang Lee ,  Wei Pin Huang ,  Feng Chen Cheng

Inventor： Hsueh An Yang ,  Meng Jen Wang ,  Wei Chung Wang ,  Ming Chiang Lee ,  Wei Pin Huang ,  Feng Chen Cheng

IPC: H05K1/11

CPC classification number: B81C1/0023 ,  B81B2201/0257 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/1461 ,  H01L2924/3025 ,  Y10T29/49162 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A MEMS package includes a first board, a second board and a laminate material. The first board includes a lower metallic trace, a metallic diaphragm and a through opening. The lower metallic trace is located on the lower surface of the first board, and the metallic diaphragm is disposed on the lower metallic trace. The second board includes an upper metallic trace and a metallic electrode. The upper metallic trace is located on the upper surface of the second board, the metallic electrode is disposed on the upper metallic trace, and the metallic electrode is corresponding to the metallic diaphragm. The laminate material is disposed between the lower and upper metallic traces, and includes a hollow portion for accommodating the metallic electrode and metallic diaphragm, wherein a sensing unit is formed by the metallic electrode, the hollow portion and the metallic diaphragm, and is corresponding to the through opening.

Abstract translation: MEMS封装包括第一板，第二板和层压材料。 第一板包括下金属痕迹，金属隔膜和通孔。 下部金属轨迹位于第一板的下表面上，并且金属隔膜设置在下部金属轨迹上。 第二板包括上金属痕迹和金属电极。 上金属轨迹位于第二板的上表面上，金属电极设置在上金属轨迹上，金属电极对应于金属隔膜。 层压材料设置在下金属轨迹和上金属迹线之间，并且包括用于容纳金属电极和金属隔膜的中空部分，其中感测单元由金属电极，中空部分和金属隔膜形成，并且对应于 通过开口。