摘要:
In accordance with at least one embodiment, a method and apparatus for improving the ability to correct errors in memory devices is described. At least one embodiment provides a way to salvage the part even it has double-bit or multi-bit error from the same ECC section, thus improving product reliability and extending the product lifetime. During a normal read, if a double-bit or multiple-bit error happens, which ECC can detect but cannot fix, the error is corrected by adjusting the read voltage level and reading again to determine the proper read level (and, therefore, the correct value being read). This dynamic read scheme can apply to extrinsic bits from either erase state or program state. It can be also used in a single bit scenario to minimize ECC occurrence and save ECC capacity.
摘要:
A technique for detecting a leaky bit of a non-volatile memory includes erasing cells of a non-volatile memory. A bias stress is applied to the cells subsequent to the erasing. An erase verify operation is performed on the cells subsequent to the applying a bias stress to the cells. Finally, it is determined whether the cells pass or fail the erase verify operation based on whether respective threshold voltages of the cells are below an erase verify level.
摘要:
Methods and systems are disclosed for adaptive erase recovery of non-volatile memory (NVM) cells within NVM systems. The adaptive erase recovery embodiments adaptively adjust the erase recovery discharge rate and/or discharge time based upon the size of NVM block(s) being erased and operating temperature. In one example embodiment, the erase recovery discharge rate is adjusted by adjusting the number of discharge transistors enabled within the discharge circuitry, thereby adjusting the discharge current for erase recovery. A lookup table is used to store erase recovery discharge rates and/or discharge times associated with NVM block sizes to be recovered and/or operating temperature. By adaptively controlling erase recovery discharge rates and/or times, the disclosed embodiments improve overall erase performance for a wide range of NVM block sizes while avoiding possible damage to high voltage circuitry within the NVM system.
摘要:
Methods and systems are disclosed for making temperature-based adjustments to bias conditions for non-volatile memory (NVM) cells to improve performance and product lifetime of NVM systems. System embodiments include integrated NVM systems having an NVM controller, a bias voltage generator, and an NVM cell array. Further, the NVM systems can store temperature-based bias condition information in storage circuitry. The disclosed embodiments select and apply bias conditions for the NVM cells based upon temperature measurements.
摘要:
Methods and systems are disclosed for making temperature-based adjustments to bias conditions for non-volatile memory (NVM) cells to improve performance and product lifetime of NVM systems. System embodiments include integrated NVM systems having an NVM controller, a bias voltage generator, and an NVM cell array. Further, the NVM systems can store temperature-based bias condition information in storage circuitry. The disclosed embodiments select and apply bias conditions for the NVM cells based upon temperature measurements.
摘要:
A set of reference cells is used for sensing the data values stored at bit cells of a memory device. In response to an event, the reference cell providing the highest output of the set is selected as the reference cell to be used for subsequent memory access operations. The remaining reference cells are disabled so that they can recover back to or near their original non-degraded states. At each successive event, the set of reference cells can be reassessed to identify the reference cell that provides the highest output at that time and the memory device can be reconfigured to utilize the reference cell so identified. By utilizing the reference cell having the highest output to provide the read reference and disabling the remaining reference cells, the likelihood of the read reference falling below a minimum threshold can be reduced.
摘要:
A sense amplifier is configured to sense a current from a selected bit cell of a non-volatile memory array and compare the sensed current to a reference current to determine a logic state stored in the bit cell. A controller is configured to perform a program/erase operation on at least a portion of the memory array to change a logic state of at least one bit cell of the portion of the memory array; determine a number of program/erase pulses applied to the at least one bit cell during the program/erase operation to achieve the change in logic state; and when the number of program/erase pulses exceeds a pulse count threshold, adjust the reference current of the sense amplifier for a subsequent program/erase operation.
摘要:
A semiconductor memory device comprises a memory controller, and an array of memory cells coupled to communicate with the memory controller. The memory controller is configured to perform a first soft program operation using first soft program voltages and a first soft program verify level, and determine whether a first charge trapping threshold has been reached. When the first charge trapping threshold has been reached, a second soft program operation is performed using second soft program voltages and a second soft program verify level.
摘要:
A technique for detecting a leaky bit of a non-volatile memory includes erasing cells of a non-volatile memory. A bias stress is applied to the cells subsequent to the erasing. An erase verify operation is performed on the cells subsequent to the applying a bias stress to the cells. Finally, it is determined whether the cells pass or fail the erase verify operation based on whether respective threshold voltages of the cells are below an erase verify level.
摘要:
Methods and systems are disclosed for dynamic healing of non-volatile memory (NVM) cells within NVM systems. The dynamic healing embodiments described herein relax damage within tunnel dielectric layers for NVM cells that occurs over time from charges (e.g., holes and/or electrons) becoming trapped within these tunnel dielectric layers. NVM operations with respect to which dynamic healing processes can be applied include, for example, erase operations, program operations, and read operations. For example, dynamic healing can be applied where performance for the NVM system degrades beyond a selected performance level for an NVM operation, such as elevated erase/program pulse counts for erase/program operations and bit errors for read operations. A variety of healing techniques can be applied, such as drain stress processes, gate stress processes, and/or other desired healing techniques.