公开(公告)号：US20010054637A1

公开(公告)日：2001-12-27

申请号：US09832894

申请日：2001-04-12

Applicant: Fine Device Co., Ltd.

Inventor： Jun Hayakawa

IPC: B23K001/00 ,  B23Q015/00 ,  B23K026/02

CPC classification number: H01R43/0256 ,  B23K1/0056 ,  B23K26/032 ,  B23K37/0258 ,  B25J9/1697 ,  G05B2219/37555 ,  G05B2219/37563 ,  G05B2219/37572 ,  G05B2219/40611 ,  G05B2219/45165 ,  H01R43/0263 ,  H05K3/3447 ,  H05K3/3494

Abstract: An image pickup camera is mounted on a soldering head for projecting a laser beam in such a manner that its optical axis coincides with that of the laser beam. An image of the object to be soldered, which is taken by the camera, is displayed on a monitor screen, and a projection spot, which is positioned on an optical axis of the laser beam, is displayed on the screen. While the positional relationship between the object to be soldered and the projection spot is observed on the monitor screen, the soldering head and the object to be soldered are moved relative to each other and the projection spot is positioned. Subsequently, the laser beam is projected from the soldering head, thus, performing soldering.

Abstract translation: 摄像摄像机安装在焊接头上，用于以使其光轴与激光束的光轴重合的方式投射激光束。 由摄像机拍摄的被焊接物体的图像被显示在监视器屏幕上，并且位于激光束的光轴上的投影点被显示在屏幕上。 虽然在监视器屏幕上观察到要焊接的物体与投影点之间的位置关系，但是焊接头和待焊接的物体相对于彼此移动并且投影点被定位。 随后，激光束从焊接头突出，从而进行焊接。