公开(公告)号：US07097541B2

公开(公告)日：2006-08-29

申请号：US10376172

申请日：2003-02-27

申请人： Francesco DeRege Thesauro ,  Vlasta Brusic ,  Benjamin P. Bayer

发明人： Francesco DeRege Thesauro ,  Vlasta Brusic ,  Benjamin P. Bayer

IPC分类号： B24B1/00

CPC分类号： B24B37/044 ,  C09G1/02 ,  C09K3/1463 ,  C23F3/04 ,  C23F3/06 ,  H01L21/3212 ,  H01L28/65

摘要： The invention provides a method of polishing a substrate comprising a noble metal comprising (i) contacting the substrate with a CMP system and (ii) abrading at least a portion of the substrate to polish the substrate. The CMP system comprises an abrasive and/or polishing pad, a liquid carrier, and a sulfonic acid compound.