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公开(公告)号：US5234865A
公开(公告)日：1993-08-10
申请号：US842236
申请日：1992-02-26
申请人： Herbert Goebel , Franz Riedinger , Vesna Biallas
发明人： Herbert Goebel , Franz Riedinger , Vesna Biallas
CPC分类号： H01L24/83 , B23K1/20 , H01L24/01 , H01L24/29 , H01L24/33 , B23K2201/36 , H01L2224/29101 , H01L2224/83101 , H01L2224/8319 , H01L2224/83801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01068 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253
摘要： The invention relates to a method for soldering together a first, in particular electrical, component with a second, in particular electrical, component, where a solder preform is disposed between the components and is fixed by pressing it against edges of at least one depression in one of the components to prevent lateral dislocation and where subsequently the soldering process takes place, preferably in a soldering furnace. A special feature is that the depression is formed as grooves (10) extending in a closed loop (11), in particular in the shape of a circle.
摘要翻译： 本发明涉及一种用于将第一，特别是电气部件与第二特别是电气部件焊接在一起的方法，其中焊料预成型件设置在部件之间，并且通过将其压在至少一个凹部的边缘上来固定 防止横向位错的部件之一，并且随后进行焊接工艺，优选在焊接炉中。 特别的特征是凹陷形成为在闭环（11）中延伸的凹槽（10），特别是圆形。
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公开(公告)号：US5254209A
公开(公告)日：1993-10-19
申请号：US960817
申请日：1992-10-08
CPC分类号： C30B29/06 , B81C1/00626 , C30B33/00 , G03F9/7003 , G03F9/7084
摘要： A method of making micromechanical structures from silicon involves cutting a monocrystalline silicon wafer. The orientation of the crystal structure relative to the flat of the wafer is first determined, and this information is taken into account in the subsequent structuring steps.
摘要翻译： 从硅制造微机械结构的方法涉及切割单晶硅晶片。 首先确定晶体结构相对于晶片的平面的取向，并且在随后的结构化步骤中考虑该信息。
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