Physical Vapor Deposition System
    1.
    发明申请
    Physical Vapor Deposition System 有权
    物理气相沉积系统

    公开(公告)号:US20080257723A1

    公开(公告)日:2008-10-23

    申请号:US11577305

    申请日:2005-10-14

    IPC分类号: C23C14/34

    CPC分类号: C23C14/228 C23C14/22

    摘要: A physical vapor deposition system for making microparticles generated by using a non-transfer type plasma torch not generating an outgas even in an ultra-high vacuum environment accelerate by a supersonic gas flow and depositing microparticles on a substrate to form a coating film is provided. Provision is made of an evaporation chamber (10, 20) having a plasma torch (16, 26) and an evaporation source (15, 25) inside it and a film formation chamber 30 having a supersonic nozzle 35 and a substrate for film formation 33. Each plasma torch has a substantially cylindrical electrically conductive anode 40, a polymer-based or non-polymer-based insulation pipe 50 inserted to the inner side of that and generating less outgas than a Bakelite, and a rod shaped cathode 60 inserted to the inner side of an insulation pipe 50. Microparticles are generated from an evaporation source (15, 25) by a plasma obtained by applying voltages to the anode 40 and the cathode 60, ejected from a supersonic nozzle 35, made to ride on a supersonic gas flow, and deposited by physical vapor deposition onto a substrate for film formation 33.

    摘要翻译: 提供了一种用于制造通过使用非转移型等离子体焰炬而产生的微粒的物理气相沉积系统,即使在超高真空环境中也不产生逸出气体,并通过超音速气流加速并将微粒沉积在基底上以形成涂膜。 具有在其内部具有等离子体焰炬(16,26)和蒸发源(15,25)的蒸发室(10,20)和具有超音速喷嘴35和成膜基片33的成膜室30 。 每个等离子体焰炬具有基本上圆柱形的导电阳极40,插入其内侧的基于聚合物或非聚合物的绝缘管50,并产生比电木炭少的排气,以及插入内部的棒状阴极60 绝缘管50的一侧。 通过将电压施加到阳极40和阴极60获得的等离子体从蒸发源(15,25)产生微粒,其由超声波喷嘴35喷射,使其骑在超音速气流上,并通过物理气相沉积 到用于成膜的基材33上。

    Physical vapor deposition apparatus and physical vapor deposition method
    2.
    发明授权
    Physical vapor deposition apparatus and physical vapor deposition method 有权
    物理气相沉积装置和物理气相沉积法

    公开(公告)号:US08889223B2

    公开(公告)日:2014-11-18

    申请号:US13056385

    申请日:2008-07-28

    摘要: A physical vapor deposition apparatus and a physical vapor deposition method for forming a film of a substance which is hard to be made fine particles even when it is heated by plasma, arc discharge, or the like are provided. It has an evaporation chamber 10 provided inside it with an evaporation source material 15 and a heating part 16 for heating the evaporation source material 15, a powder supply source 20 provided inside it with a powder, and a film forming chamber 30, wherein the evaporation source material 15 is heated by the heating part 16 to produce fine particles (nanoparticles), the fine particles and powder are sprayed out of a supersonic nozzle 35, are placed on a supersonic gas stream, and are deposited on a substrate for film formation 33 by physical vapor deposition.

    摘要翻译: 提供了用于形成即使通过等离子体,电弧放电等加热也难以制成微粒的物质的膜的物理气相沉积装置和物理气相沉积方法。 在其内部设置有蒸发源材料15和用于加热蒸发源材料15的加热部分16,在其内部设置有粉末的粉末供应源20和成膜室30,其中蒸发源 源材料15被加热部分16加热以产生细颗粒(纳米颗粒),将细颗粒和粉末从超音速喷嘴35喷出,放置在超音速气流上,并沉积在用于成膜的基板33上 通过物理气相沉积。

    Physical vapor deposition system
    3.
    发明授权
    Physical vapor deposition system 有权
    物理气相沉积系统

    公开(公告)号:US08136480B2

    公开(公告)日:2012-03-20

    申请号:US11577305

    申请日:2005-10-14

    IPC分类号: C23C16/00 C23C16/50

    CPC分类号: C23C14/228 C23C14/22

    摘要: A physical vapor deposition system for making microparticles generated by using a non-transfer type plasma torch not generating an outgas even in an ultra-high vacuum environment accelerate by a supersonic gas flow and depositing microparticles on a substrate to form a coating film is provided. Provision is made of an evaporation chamber (10, 20) having a plasma torch (16, 26) and an evaporation source (15, 25) inside it and a film formation chamber 30 having a supersonic nozzle 35 and a substrate for film formation 33. Each plasma torch has a substantially cylindrical electrically conductive anode 40, a polymer-based or non-polymer-based insulation pipe 50 inserted to the inner side of that and generating less outgas than a phenol resin, and a rod shaped cathode 60 inserted to the inner side of an insulation pipe 50. Microparticles are generated from an evaporation source (15, 25) by a plasma obtained by applying voltages to the anode 40 and the cathode 60, ejected from a supersonic nozzle 35, made to ride on a supersonic gas flow, and deposited by physical vapor deposition onto a substrate for film formation 33.

    摘要翻译: 提供了一种用于制造通过使用非转移型等离子体焰炬而产生的微粒的物理气相沉积系统,即使在超高真空环境中也不产生逸出气体,并通过超音速气流加速并将微粒沉积在基底上以形成涂膜。 具有在其内部具有等离子体焰炬(16,26)和蒸发源(15,25)的蒸发室(10,20)和具有超音速喷嘴35和成膜基片33的成膜室30 每个等离子体焰炬具有基本上圆柱形的导电阳极40,插入其内侧的基于聚合物或非聚合物的绝缘管50,并且产生比酚醛树脂少的排气,以及插入到 绝缘管50的内侧。通过对从阳极40和阴极60施加电压而获得的等离子体从蒸发源(15,25)产生微粒,从超音速喷嘴35喷射,制成骑在超音速 气流,并通过物理气相沉积沉积到用于成膜的基底上33。

    PHYSICAL VAPOR DEPOSITION APPARATUS AND PHYSICAL VAPOR DEPOSITION METHOD
    4.
    发明申请
    PHYSICAL VAPOR DEPOSITION APPARATUS AND PHYSICAL VAPOR DEPOSITION METHOD 有权
    物理蒸气沉积装置和物理蒸气沉积方法

    公开(公告)号:US20110189390A1

    公开(公告)日:2011-08-04

    申请号:US13056385

    申请日:2008-07-28

    IPC分类号: B05D1/12

    摘要: A physical vapor deposition apparatus and a physical vapor deposition method for forming a film of a substance which is hard to be made fine particles even when it is heated by plasma, arc discharge, or the like are provided. It has an evaporation chamber 10 provided inside it with an evaporation source material 15 and a heating part 16 for heating the evaporation source material 15, a powder supply source 20 provided inside it with a powder, and a film forming chamber 30, wherein the evaporation source material 15 is heated by the heating part 16 to produce fine particles (nanoparticles), the fine particles and powder are sprayed out of a supersonic nozzle 35, are placed on a supersonic gas stream, and are deposited on a substrate for film formation 33 by physical vapor deposition.

    摘要翻译: 提供了用于形成即使通过等离子体,电弧放电等加热也难以制成微粒的物质的膜的物理气相沉积装置和物理气相沉积方法。 在其内部设置有蒸发源材料15和用于加热蒸发源材料15的加热部分16,在其内部设置有粉末的粉末供应源20和成膜室30,其中蒸发源 源材料15被加热部分16加热以产生细颗粒(纳米颗粒),将细颗粒和粉末从超音速喷嘴35喷出,放置在超音速气流上,并沉积在用于成膜的基板33上 通过物理气相沉积。