公开(公告)号：US20080172867A1

公开(公告)日：2008-07-24

申请号：US11845544

申请日：2007-08-27

申请人： Koji Tsurusaki ,  Fumitaka Aizawa ,  Osamu Nakao

发明人： Koji Tsurusaki ,  Fumitaka Aizawa ,  Osamu Nakao

IPC分类号： H05K3/36

CPC分类号： H05K3/381 ,  H05K1/0393 ,  H05K3/386 ,  H05K3/4611 ,  H05K3/4635 ,  H05K3/4652 ,  H05K2201/09536 ,  H05K2203/0793 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128

摘要： Provided is a method of manufacturing a multi-layered flexible print circuit board (FPC), which is capable of preventing an adhesive member of the multi-layered FPC from being peeled from FPCs. The invention provides a method of manufacturing a multi-layered flexible printed circuit board (multi-layered FPC) including laminating at least two flexible printed circuit boards laminated,wherein a side comprising a conductor circuit in which a conductor circuit of at least one of the at least two flexible printed circuit boards before being laminated is present is subject to an alkaline solution with a concentration of 0.2 to 6.0 wt % and a temperature of 20 to 45° C. under a treatment time of 20 to 100 seconds before the laminating.

摘要翻译： 提供一种制造多层柔性印刷电路板（FPC）的方法，其能够防止多层FPC的粘合构件从FPC剥离。 本发明提供了一种制造多层柔性印刷电路板（多层FPC）的方法，包括层压至少两层柔性印刷电路板，其中包括导体电路的一侧，其中至少一个 存在层压之前的至少两个柔性印刷电路板在层压之前的20至100秒的处理时间内接受浓度为0.2至6.0重量％和温度为20至45℃的碱性溶液。

公开(公告)号：US20080047134A1

公开(公告)日：2008-02-28

申请号：US11830597

申请日：2007-07-30

申请人： Koji TSURUSAKI ,  Osamu NAKAO ,  Fumitaka AIZAWA

发明人： Koji TSURUSAKI ,  Osamu NAKAO ,  Fumitaka AIZAWA

IPC分类号： H05K3/00

CPC分类号： H05K3/382 ,  H05K1/0393 ,  H05K3/28 ,  H05K3/281 ,  H05K2203/0793 ,  Y10T29/49124

摘要： Provided are methods of manufacturing a flexible printed circuit board having a surface layer portion where a copper foil circuit is disposed and consisting single-side board, double-side board and multi-layer board. A first manufacturing method in a case when a single-sided CCL is used includes at least a step in which the surface layer portion is subjected to alkaline treatment, and a step to dispose a resist onto the alkaline-treated surface layer portion.

摘要翻译： 提供了制造具有布置有铜箔电路的表面层部分的柔性印刷电路板的方法，并且包括单面板，双面板和多层板。 在使用单面CCL的情况下的第一制造方法至少包括表面层部分进行碱处理的步骤，以及将抗蚀剂设置在碱处理表面层部分上的步骤。