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公开(公告)号：US09000388B2
公开(公告)日：2015-04-07
申请号：US13640395
申请日：2011-01-27
CPC分类号： G01T1/2018 , H01L27/14623 , H01L27/14634 , H01L27/14661 , H01L27/14663 , H05K1/0218 , H05K1/0242 , H05K1/025 , H05K1/113 , H05K2201/09727 , H05K2201/10545 , H05K2201/10674
摘要： A connection substrate 13 includes a base material 130 formed by stacking a plurality of dielectric layers 130a to 130f and a plurality of through conductors 20 provided penetrating through the dielectric layers 130c to 130f adjacent to each other. A plurality of radiation shielding films 21a to 23a formed integrally with each of the plurality of through conductors 20 and separated from each other are provided at two or more interlayer parts in the dielectric layers 130c to 130f. A region PR1 of the radiation shielding film 21a (21b) formed integrally with one through conductor 20 in one interlayer part projected onto a virtual plane normal to a predetermined direction and a region of the radiation shielding film 22b or 22c (22c) formed integrally with another through conductor 20 in another interlayer part projected onto the virtual plane do not overlap each other. Accordingly, the readout circuits of an integrated circuit device can be protected from radiation, and an increase in parasitic capacitance can be suppressed.
摘要翻译： 连接基板13包括通过堆叠多个电介质层130a至130f而形成的基底材料130和穿过彼此相邻的电介质层130c至130f设置的多个贯穿导体20。 在电介质层130c〜130f的两个以上的层间部分设置有与多个贯通导体20中的每一个一体地形成并彼此分离的多个辐射屏蔽膜21a至23a。 辐射屏蔽膜21a（21b）的区域PR1与一个中间部分中的一个贯通导体20一体地形成，该层间部分投射到垂直于预定方向的虚拟平面上，并且辐射屏蔽膜22b或22c（22c）的区域与 投影到虚拟平面上的另一层间部分中的另一贯穿导体20彼此不重叠。 因此，集成电路器件的读出电路可以被保护免受辐射，并且可以抑制寄生电容的增加。
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公开(公告)号：US20130026376A1
公开(公告)日：2013-01-31
申请号：US13640406
申请日：2011-01-27
IPC分类号： G01T1/208
CPC分类号： G01T1/2018 , H01L27/14634 , H01L27/14661 , H01L27/14663
摘要： A radiation detector module 10A includes a scintillator for converting radiation made incident from a predetermined direction to light, a two-dimensional PD array 12 for receiving light from the scintillator, a connection substrate 13 formed by stacking dielectric layers 130a to 130f, and mounted with the two-dimensional PD array 12 on one substrate surface thereof, and an integrated circuit device 14 mounted on the other substrate surface of the connection substrate 13, and for reading out electrical signals output from the two-dimensional PD array 12. The integrated circuit device 14 has a plurality of unit circuit regions 14b separated from each other. The connection substrate 13 has a plurality of through conductors 20 and a plurality of radiation shielding films 21a to 23a formed integrally with each of the plurality of through conductors 20 and separated from each other. Accordingly, the readout circuits of the integrated circuit device can be protected from radiation with a simple configuration.
摘要翻译： 辐射检测器模块10A包括用于将从预定方向入射的辐射的光转换成用于从闪烁体接收光的二维PD阵列12，通过堆叠电介质层130a至130f形成的连接基板13，并安装有 其一个基板表面上的二维PD阵列12，以及安装在连接基板13的另一个基板表面上并用于读出从二维PD阵列12输出的电信号的集成电路装置14。 装置14具有彼此分离的多个单位电路区域14b。 连接基板13具有多个贯通导体20和与多个贯通导体20中的每一个一体地形成并彼此分离的多个辐射屏蔽膜21a至23a。 因此，能够以简单的结构保护集成电路器件的读出电路免受辐射。
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公开(公告)号：US20130032389A1
公开(公告)日：2013-02-07
申请号：US13640395
申请日：2011-01-27
IPC分类号： H05K1/11
CPC分类号： G01T1/2018 , H01L27/14623 , H01L27/14634 , H01L27/14661 , H01L27/14663 , H05K1/0218 , H05K1/0242 , H05K1/025 , H05K1/113 , H05K2201/09727 , H05K2201/10545 , H05K2201/10674
摘要： A connection substrate 13 includes a base material 130 formed by stacking a plurality of dielectric layers 130a to 130f and a plurality of through conductors 20 provided penetrating through the dielectric layers 130c to 130f adjacent to each other. A plurality of radiation shielding films 21 a to 23 a formed integrally with each of the plurality of through conductors 20 and separated from each other are provided at two or more interlayer parts in the dielectric layers 130c to 130f. A region PR1 of the radiation shielding film 21a (21b) formed integrally with one through conductor 20 in one interlayer part projected onto a virtual plane normal to a predetermined direction and a region of the radiation shielding film 22b or 22c (22c) formed integrally with another through conductor 20 in another interlayer part projected onto the virtual plane do not overlap each other. Accordingly, the readout circuits of an integrated circuit device can be protected from radiation, and an increase in parasitic capacitance can be suppressed.
摘要翻译： 连接基板13包括通过堆叠多个电介质层130a至130f而形成的基底材料130和穿过彼此相邻的电介质层130c至130f设置的多个贯穿导体20。 在电介质层130c〜130f的两个以上的层间部分设置有与多个贯通导体20中的每一个一体地形成并彼此分离的多个辐射屏蔽膜21a至23a。 辐射屏蔽膜21a（21b）的区域PR1与一个中间部分中的一个贯通导体20一体地形成，该层间部分投射到垂直于预定方向的虚拟平面上，并且辐射屏蔽膜22b或22c（22c）的区域与 投影到虚拟平面上的另一层间部分中的另一贯穿导体20彼此不重叠。 因此，集成电路器件的读出电路可以被保护免受辐射，并且可以抑制寄生电容的增加。
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公开(公告)号：US08859975B2
公开(公告)日：2014-10-14
申请号：US13640406
申请日：2011-01-27
IPC分类号： G01T1/20 , H01L27/146
CPC分类号： G01T1/2018 , H01L27/14634 , H01L27/14661 , H01L27/14663
摘要： A radiation detector module 10A includes a scintillator for converting radiation made incident from a predetermined direction to light, a two-dimensional PD array 12 for receiving light from the scintillator, a connection substrate 13 formed by stacking dielectric layers 130a to 130f, and mounted with the two-dimensional PD array 12 on one substrate surface thereof, and an integrated circuit device 14 mounted on the other substrate surface of the connection substrate 13, and for reading out electrical signals output from the two-dimensional PD array 12. The integrated circuit device 14 has a plurality of unit circuit regions 14b separated from each other. The connection substrate 13 has a plurality of through conductors 20 and a plurality of radiation shielding films 21a to 23a formed integrally with each of the plurality of through conductors 20 and separated from each other. Accordingly, the readout circuits of the integrated circuit device can be protected from radiation with a simple configuration.
摘要翻译： 辐射检测器模块10A包括用于将从预定方向入射的辐射的光转换成用于从闪烁体接收光的二维PD阵列12，通过堆叠电介质层130a至130f形成的连接基板13，并安装有 其一个基板表面上的二维PD阵列12，以及安装在连接基板13的另一个基板表面上并用于读出从二维PD阵列12输出的电信号的集成电路装置14。 装置14具有彼此分离的多个单位电路区域14b。 连接基板13具有多个贯通导体20和与多个贯通导体20中的每一个一体地形成并彼此分离的多个辐射屏蔽膜21a至23a。 因此，能够以简单的结构保护集成电路器件的读出电路免受辐射。
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