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公开(公告)号:US11254826B2
公开(公告)日:2022-02-22
申请号:US16749220
申请日:2020-01-22
发明人: Wei-Chen Chang , Tsung-Huan Sheng
IPC分类号: C09D5/24 , C09D7/40 , C09D7/61 , C09D7/65 , C09D7/20 , C09D101/26 , C09D161/06 , C09D163/00 , C09D11/52 , C09D11/037 , C09D11/033 , C09D11/14 , C09D11/103 , C09D11/102 , C09D11/322 , C09D11/36 , H01B1/16 , H01B1/22 , H01L31/0224 , H05K1/09
摘要: The present invention discloses an oxidation-resistant conductive copper past, a manufacturing method and a use thereof. The oxidation-resistant conductive copper paste comprises 70 wt % to 90 wt % of copper particles, a binder, a thixotropic agent and a solvent. The manufacturing method comprises the steps of mixing the binder, the thixotropic agent and ethanol thoroughly to obtain a first mixture; mixing the solvent with the first mixture thoroughly to obtain a second mixture; mixing the copper particles with the second mixture to obtain a conductive copper paste precursor; and removing the ethanol from the conductive copper paste precursor to obtain the oxidation-resistant conductive copper paste. The oxidation-resistant conductive copper paste can be used for manufacturing a conductive film of a circuit board or an electrode of a solar battery by a printing process.