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公开(公告)号：US08814229B2
公开(公告)日：2014-08-26
申请号：US12771421
申请日：2010-04-30
CPC分类号： G02B6/4246 , G02B6/4261 , G02B6/4284 , G02B6/4292 , Y10T24/45262 , Y10T292/1051 , Y10T292/1052
摘要： Latching mechanisms for electronic modules. In one example embodiment, a latching mechanism for an electronic module includes a latch, a latch return spring, and a release slide. The latch is configured to rotate between a latched position and an unlatched position. The latch includes a latch arm on a first end of the latch and an engagement pin on a second end of the latch. The latch return spring is configured to bias the latch in the latched position. The release slide includes a slide ramp. The slide ramp is configured to engage the latch arm as the release slide is slid away from the engagement pin, which causes the latch to rotate from the latched position to the unlatched position.
摘要翻译： 电子模块闭锁机制。 在一个示例性实施例中，用于电子模块的闩锁机构包括闩锁，闩锁复位弹簧和释放滑块。 闩锁构造成在锁定位置和解锁位置之间旋转。 闩锁包括在闩锁的第一端上的锁定臂和闩锁的第二端上的接合销。 闩锁复位弹簧构造成将闩锁偏压在锁定位置。 释放滑块包括滑梯。 当释放滑块从接合销滑动时，滑动斜面被构造成接合闩锁臂，这使得闩锁从锁定位置旋转到解锁位置。
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公开(公告)号：US20110267742A1
公开(公告)日：2011-11-03
申请号：US12771421
申请日：2010-04-30
IPC分类号： H05K5/00
CPC分类号： G02B6/4246 , G02B6/4261 , G02B6/4284 , G02B6/4292 , Y10T24/45262 , Y10T292/1051 , Y10T292/1052
摘要： Latching mechanisms for electronic modules. In one example embodiment, a latching mechanism for an electronic module includes a latch, a latch return spring, and a release slide. The latch is configured to rotate between a latched position and an unlatched position. The latch includes a latch arm on a first end of the latch and an engagement pin on a second end of the latch. The latch return spring is configured to bias the latch in the latched position. The release slide includes a slide ramp. The slide ramp is configured to engage the latch arm as the release slide is slid away from the engagement pin, which causes the latch to rotate from the latched position to the unlatched position.
摘要翻译： 电子模块闭锁机制。 在一个示例性实施例中，用于电子模块的闩锁机构包括闩锁，闩锁复位弹簧和释放滑块。 闩锁构造成在锁定位置和解锁位置之间旋转。 闩锁包括在闩锁的第一端上的锁定臂和闩锁的第二端上的接合销。 闩锁复位弹簧构造成将闩锁偏压在锁定位置。 释放滑块包括滑梯。 当释放滑块从接合销滑动时，滑动斜面被构造成接合闩锁臂，这使得闩锁从闩锁位置旋转到解锁位置。
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公开(公告)号：US20110064365A1
公开(公告)日：2011-03-17
申请号：US12952107
申请日：2010-11-22
申请人： Chris Togami , Gary Dean Sasser , Kai F. Ng
发明人： Chris Togami , Gary Dean Sasser , Kai F. Ng
IPC分类号： G02B6/36
CPC分类号： G02B6/4292 , G02B6/4204 , G02B6/4246 , G02B6/4277 , H05K9/0058
摘要： In one example embodiment, an optoelectronic module comprises a body, a signal ground, and an OSA. The body is connected to chassis ground and defines a cavity within which one or more components are disposed. The optical subassembly is disposed in the body cavity, has one or more components connected to signal ground, and comprises a header assembly, a housing, and one or more containment structures. The header assembly houses one or more components that generate EMI emissions and includes an optical aperture. The housing includes a port and a barrel. The port defines a fiber receptacle and the barrel defines a cavity that at least partially receives the header assembly. The containment structure(s) at least partially contain the EMI emissions within the OSA.
摘要翻译： 在一个示例实施例中，光电子模块包括主体，信号接地和OSA。 主体连接到机架接地并限定一个空腔，一个或多个部件设置在该空腔内。 光学子组件设置在体腔中，具有连接到信号地面的一个或多个部件，并且包括头部组件，壳体和一个或多个容纳结构。 头部组件容纳一个或多个产生EMI发射并且包括光学孔的部件。 外壳包括一个端口和一个桶。 端口限定纤维容器，并且筒限定了至少部分地容纳头部组件的空腔。 遏制结构至少部分地包含OSA内的EMI发射。
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公开(公告)号：US07802929B2
公开(公告)日：2010-09-28
申请号：US12246092
申请日：2008-10-06
申请人： Joshua Moore , Gary Dean Sasser , Greta Light
发明人： Joshua Moore , Gary Dean Sasser , Greta Light
IPC分类号： G02B6/36
CPC分类号： G02B6/4201 , H05K9/0047 , H05K9/0049 , H05K9/0058
摘要： An optoelectronic transceiver module. The optoelectronic module is a monolithic, one-piece module shell that includes a top portion, a bottom portion, a first side portion, a second side portion, and a front portion. The top portion, bottom portion, first side portion, second side portion and the front portion define a cavity configured to enclose electro-optical circuitry. In addition, the top portion and the bottom portion are configured such that the top portion is not separable from the bottom portion. Further, the front portion defines at least one of an optical transmit port or an optical receive port.
摘要翻译： 光电收发模块。 光电子模块是一体的单件模块壳体，其包括顶部，底部，第一侧部分，第二侧部分和前部。 顶部，底部，第一侧部分，第二侧部分和前部部分限定了构造成包围电光电路的空腔。 此外，顶部和底部构造成使得顶部不能从底部分离。 此外，前部限定光发送端口或光接收端口中的至少一个。
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公开(公告)号：US06396116B1
公开(公告)日：2002-05-28
申请号：US09513797
申请日：2000-02-25
申请人： Michael G. Kelly , James-Yu Chang , Gary Dean Sasser , Andrew Arthur Hunter , Cheng-Cheng Chang
发明人： Michael G. Kelly , James-Yu Chang , Gary Dean Sasser , Andrew Arthur Hunter , Cheng-Cheng Chang
IPC分类号： H01L27148
CPC分类号： H01L31/0203 , H01L27/14618 , H01L27/14636 , H01L31/02325 , H01L2224/48091 , H01L2924/09701 , H01L2924/16195 , H01L2924/00014
摘要： An optical device packaging technique involves an optical sensor that is formed on a first substrate and flip chip bonded to a second substrate. The second substrate includes a through hole or a transparent section that is aligned with the optical sensor in order to allow light to contact the optical sensor. An embodiment of an optical device structure includes an optical sensor, a first substrate, a second substrate, and a circuit board. The optical sensor is formed on or within the first substrate and the individual sensors or pixels of the optical sensor are electrically connected to contact pads that are exposed on the first substrate. The first substrate is flip chip bonded to the second substrate. The second substrate is flip chip bonded to a circuit board. Another embodiment of an optical device structure includes an optical sensor, a first substrate, and a circuit board as the second substrate. In the embodiment, contact pads of the first substrate are flip chip bonded to contact pads of the circuit board with conductive balls. The connection between the first substrate and the circuit board provides the electrical connection between the optical sensor and the circuit board.
摘要翻译： 光学器件封装技术涉及形成在第一衬底上的光学传感器和与第二衬底结合的倒装芯片。 第二基板包括与光学传感器对准的通孔或透明部分，以允许光接触光学传感器。 光学装置结构的实施例包括光学传感器，第一基板，第二基板和电路板。 光学传感器形成在第一基板上或内部，并且光学传感器的各个传感器或像素电连接到暴露在第一基板上的接触焊盘。 第一衬底被倒装芯片接合到第二衬底。 第二基板被倒装芯片接合到电路板上。 光学装置结构的另一实施例包括光学传感器，第一基板和作为第二基板的电路板。 在本实施例中，第一基板的接触焊盘与导电球倒装芯片接合到电路板的接触焊盘。 第一基板和电路板之间的连接提供光学传感器和电路板之间的电连接。
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公开(公告)号：US07837399B2
公开(公告)日：2010-11-23
申请号：US12348767
申请日：2009-01-05
申请人： Chris Togami , Gary Dean Sasser , Kai F Ng
发明人： Chris Togami , Gary Dean Sasser , Kai F Ng
CPC分类号： G02B6/4292 , G02B6/4204 , G02B6/4246 , G02B6/4277 , H05K9/0058
摘要： In one example embodiment, an optoelectronic module comprises a body, a signal ground, and an OSA. The body is connected to chassis ground and defines a cavity within which one or more components are disposed. The optical subassembly is disposed in the body cavity, has one or more components connected to signal ground, and comprises a header assembly, a housing, and one or more containment structures. The header assembly houses one or more components that generate EMI emissions and includes an optical aperture. The housing includes a port and a barrel. The port defines a fiber receptacle and the barrel defines a cavity that at least partially receives the header assembly. The containment structure(s) at least partially contain the EMI emissions within the OSA.
摘要翻译： 在一个示例实施例中，光电子模块包括主体，信号接地和OSA。 主体连接到机架接地并限定一个空腔，一个或多个部件设置在该空腔内。 光学子组件设置在体腔中，具有连接到信号地面的一个或多个部件，并且包括头部组件，壳体和一个或多个容纳结构。 头部组件容纳一个或多个产生EMI发射并且包括光学孔的部件。 外壳包括一个端口和一个桶。 端口限定纤维容器，并且筒限定了至少部分地容纳头部组件的空腔。 遏制结构至少部分地包含OSA内的EMI发射。
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公开(公告)号：US07594766B1
公开(公告)日：2009-09-29
申请号：US10715576
申请日：2003-11-17
CPC分类号： G02B6/4246 , G02B6/4261
摘要： An integrated array for optoelectronic components in an optical communications system is disclosed. The integrated array incorporates a plurality of optoelectronic modules, such as optical transceivers, in a compact, integrated geometry for positioning within an optical device, such as an optical switch or router. In one embodiment, the integrated array includes a component structure comprised of a plurality of optical transceiver sub-modules, each having dual optical ports. The component structure is integrated as a single structure to minimize the spacing between each transceiver sub-module. This in turn increases the optical port density of the integrated array. The integrated array is received by a cage that is attached to a host board within the optical device. A latching mechanism is included to selectively secure the integrated array within the cage.
摘要翻译： 公开了一种用于光通信系统中的光电子部件的集成阵列。 集成阵列以紧凑的集成几何形式结合有多个光电模块，例如光收发器，用于定位在诸如光开关或路由器之类的光学装置内。 在一个实施例中，集成阵列包括由多个光收发器子模块组成的组件结构，每个子模块具有双光口。 组件结构集成为单个结构，以最小化每个收发器子模块之间的间距。 这又增加了集成阵列的光口密度。 集成阵列由附接到光学装置内的主板的笼子接收。 包括锁定机构以选择性地将集成阵列固定在保持架内。
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公开(公告)号：US20080298041A1
公开(公告)日：2008-12-04
申请号：US12130843
申请日：2008-05-30
IPC分类号： H05K9/00
CPC分类号： G02B6/4246
摘要： In one example embodiment, an electromagnetic radiation (EMR) shield includes a central portion, an opening defined in the central portion, a wing attached to and extending outward from the central portion, and a protrusion defined in the wing. The perimeter of the EMR shield is approximately the same size and shape as that of a portion of an associated optical subassembly (OSA).
摘要翻译： 在一个示例性实施例中，电磁辐射（EMR）屏蔽包括中心部分，限定在中心部分中的开口，附接到中心部分并从中心部分向外延伸的翼部，以及限定在机翼中的突起。 EMR屏蔽的周长与相关光学子组件（OSA）的一部分大致相同的尺寸和形状。
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公开(公告)号：US07350984B1
公开(公告)日：2008-04-01
申请号：US10716149
申请日：2003-11-17
CPC分类号： G02B6/4292 , G02B6/4201 , G02B6/4246 , G02B6/4261 , G02B6/4277 , G02B6/4284 , H01R12/716 , H01R13/6658
摘要： An array system that enables compact positioning of optoelectronic modules, such as optical transceiver modules, within an optical device is disclosed. The array system increases the optical port density of the modules within the optical device, which can comprise an optical switch, an optical router, or the like. In one embodiment, the array system includes a host board and a plurality of daughter cards that connect with the host board edge-on in a perpendicular orientation. A cage is mounted to each daughter card, and an optical transceiver module is received into each cage to electrically connect with a connector receptacle that is positioned on the daughter card. A connectorized optical fiber can be connected to the optical ports of the transceiver using a release sleeve that enables engagement and disengagement of the optical fiber without difficulty despite the increased port density.
摘要翻译： 公开了一种能够使光电子模块（例如光收发器模块）在光学装置内紧凑定位的阵列系统。 阵列系统增加了光学装置内的模块的光端口密度，光学装置可以包括光学开关，光学路由器等。 在一个实施例中，阵列系统包括主板和多个子卡，其以垂直取向与主板边缘连接。 笼子安装到每个子卡上，并且光收发器模块被接收到每个笼中以与位于子卡上的连接器插座电连接。 连接的光纤可以使用释放套筒连接到收发器的光学端口，即使端口密度增加也能够轻松地接合和分离光纤。
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公开(公告)号：US08172469B2
公开(公告)日：2012-05-08
申请号：US12952107
申请日：2010-11-22
申请人： Chris Togami , Gary Dean Sasser , Kai F Ng
发明人： Chris Togami , Gary Dean Sasser , Kai F Ng
CPC分类号： G02B6/4292 , G02B6/4204 , G02B6/4246 , G02B6/4277 , H05K9/0058
摘要： In one example embodiment, an optoelectronic module comprises a body, a signal ground, and an OSA. The body is connected to chassis ground and defines a cavity within which one or more components are disposed. The optical subassembly is disposed in the body cavity, has one or more components connected to signal ground, and comprises a header assembly, a housing, and one or more containment structures. The header assembly houses one or more components that generate EMI emissions and includes an optical aperture. The housing includes a port and a barrel. The port defines a fiber receptacle and the barrel defines a cavity that at least partially receives the header assembly. The containment structure(s) at least partially contain the EMI emissions within the OSA.
摘要翻译： 在一个示例实施例中，光电子模块包括主体，信号接地和OSA。 主体连接到机架接地并限定一个空腔，一个或多个部件设置在该空腔内。 光学子组件设置在体腔中，具有连接到信号地面的一个或多个部件，并且包括头部组件，壳体和一个或多个容纳结构。 头部组件容纳一个或多个产生EMI发射并且包括光学孔的部件。 外壳包括一个端口和一个桶。 端口限定纤维容器，并且筒限定了至少部分地容纳头部组件的空腔。 遏制结构至少部分地包含OSA内的EMI发射。
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