公开(公告)号：US06396116B1

公开(公告)日：2002-05-28

申请号：US09513797

申请日：2000-02-25

申请人： Michael G. Kelly ,  James-Yu Chang ,  Gary Dean Sasser ,  Andrew Arthur Hunter ,  Cheng-Cheng Chang

发明人： Michael G. Kelly ,  James-Yu Chang ,  Gary Dean Sasser ,  Andrew Arthur Hunter ,  Cheng-Cheng Chang

IPC分类号： H01L27148

CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L27/14636 ,  H01L31/02325 ,  H01L2224/48091 ,  H01L2924/09701 ,  H01L2924/16195 ,  H01L2924/00014

摘要： An optical device packaging technique involves an optical sensor that is formed on a first substrate and flip chip bonded to a second substrate. The second substrate includes a through hole or a transparent section that is aligned with the optical sensor in order to allow light to contact the optical sensor. An embodiment of an optical device structure includes an optical sensor, a first substrate, a second substrate, and a circuit board. The optical sensor is formed on or within the first substrate and the individual sensors or pixels of the optical sensor are electrically connected to contact pads that are exposed on the first substrate. The first substrate is flip chip bonded to the second substrate. The second substrate is flip chip bonded to a circuit board. Another embodiment of an optical device structure includes an optical sensor, a first substrate, and a circuit board as the second substrate. In the embodiment, contact pads of the first substrate are flip chip bonded to contact pads of the circuit board with conductive balls. The connection between the first substrate and the circuit board provides the electrical connection between the optical sensor and the circuit board.

摘要翻译： 光学器件封装技术涉及形成在第一衬底上的光学传感器和与第二衬底结合的倒装芯片。 第二基板包括与光学传感器对准的通孔或透明部分，以允许光接触光学传感器。 光学装置结构的实施例包括光学传感器，第一基板，第二基板和电路板。 光学传感器形成在第一基板上或内部，并且光学传感器的各个传感器或像素电连接到暴露在第一基板上的接触焊盘。 第一衬底被倒装芯片接合到第二衬底。 第二基板被倒装芯片接合到电路板上。 光学装置结构的另一实施例包括光学传感器，第一基板和作为第二基板的电路板。 在本实施例中，第一基板的接触焊盘与导电球倒装芯片接合到电路板的接触焊盘。 第一基板和电路板之间的连接提供光学传感器和电路板之间的电连接。

公开(公告)号：US07088397B1

公开(公告)日：2006-08-08

申请号：US09715794

申请日：2000-11-16

申请人： Andrew Arthur Hunter ,  James-Yu Chang ,  Park-Kee Yu ,  Ray Schuder

发明人： Andrew Arthur Hunter ,  James-Yu Chang ,  Park-Kee Yu ,  Ray Schuder

IPC分类号： H04N5/225

CPC分类号： H04N5/2253 ,  G02B7/022 ,  H04N5/2254

摘要： A digital image capture system includes an image sensor, a package structure for holding the image sensor, and electrical connectors for creating electrical connections between the image sensor and a circuit board. The package structure includes attachment features that enable an optics system to be securely attached to the package structure after the package structure has been soldered to the circuit board In an embodiment, the attachment features align the optics system with the image sensor without having to power up the image sensor. An embodiment of the attachment features includes mechanical attachment features, such as clip arms and/or clip receivers. In an embodiment, the optics system includes attachment features that are complementary to the attachment features of the package structure. The package structure and optics system may additionally include complementary contact surfaces that create a light-tight connection between the optics system and the package structure.

摘要翻译： 数字图像捕获系统包括图像传感器，用于保持图像传感器的封装结构以及用于在图像传感器和电路板之间建立电连接的电连接器。 封装结构包括附件特征，其使光学系统能够在封装结构被焊接到电路板之后牢固地附接到封装结构。在一个实施例中，附接特征将光学系统与图像传感器对准，而不必上电 图像传感器。 附接特征的实施例包括机械附接特征，例如夹臂和/或夹子接收器。 在一个实施例中，光学系统包括与封装结构的附接特征互补的附接特征。 封装结构和光学系统可以另外包括在光学系统和封装结构之间产生不透光连接的互补接触表面。

公开(公告)号：US06683298B1

公开(公告)日：2004-01-27

申请号：US09717185

申请日：2000-11-20

申请人： Andrew Arthur Hunter ,  Ray Schuder ,  Park-Kee Yu ,  James-Yu Chang

发明人： Andrew Arthur Hunter ,  Ray Schuder ,  Park-Kee Yu ,  James-Yu Chang

IPC分类号： H01J502

CPC分类号： G02B7/022 ,  H01L31/02325 ,  H04N5/2253 ,  H04N5/2254

摘要： A digital image capture system includes an image sensor package and a powered lens element that is attached to the image sensor package. The image sensor package includes an image sensor, a package structure for holding the image sensor, and electrical connectors for creating electrical connection between the image sensor and a circuit board. The package structure and the powered lens element include complementary surfaces that enable the powered lens element to be attached to the image sensor package. Preferably, the powered lens element is glued to the package structure to create a sealed environment for the image sensor. In an embodiment, a temporary protective cover is attached to the powered lens element to protect the powered lens element during attachment of the image sensor package to the circuit board. In an embodiment of the digital image capture system, an additional powered lens element is attached to the powered lens element to create a composite lens element. In an embodiment of the digital image capture system, the powered lens element includes an opaque surface that prevents unwanted light from contacting the image sensor. An advantage of the digital image capture system is that no additional lens mounting structures are required to attach a powered lens element to the image sensor package.

摘要翻译： 数字图像捕获系统包括附接到图像传感器封装的图像传感器封装和动力透镜元件。 图像传感器封装包括图像传感器，用于保持图像传感器的封装结构以及用于在图像传感器和电路板之间形成电连接的电连接器。 封装结构和动力透镜元件包括能够将动力透镜元件附接到图像传感器封装的互补表面。 优选地，动力透镜元件胶合到包装结构以为图像传感器创建密封环境。 在一个实施例中，临时保护盖附接到动力透镜元件，以在将图像传感器封装件附接到电路板期间保护动力透镜元件。 在数字图像捕获系统的一个实施例中，附加的有源透镜元件附接到动力透镜元件以产生复合透镜元件。 在数字图像捕获系统的实施例中，动力透镜元件包括防止不需要的光接触图像传感器的不透明表面。 数字图像捕获系统的优点在于，不需要附加的透镜安装结构来将动力透镜元件附接到图像传感器封装。

公开(公告)号：US06492698B2

公开(公告)日：2002-12-10

申请号：US09739530

申请日：2000-12-15

申请人： Brian H. Kim ,  James-Yu Chang

发明人： Brian H. Kim ,  James-Yu Chang

IPC分类号： H01L3100

CPC分类号： H05K1/189 ,  G02B6/4201 ,  G02B6/4249 ,  G02B6/4292 ,  H01L23/5387 ,  H01L31/0203 ,  H01L31/024 ,  H01L2924/0002 ,  H05K3/0061 ,  H05K2201/2009 ,  H01L2924/00

摘要： Packaging for components of an optical module. The packaging includes a flexible circuit coupled to two stiffeners. The packaging has a first sub-assembly with the first stiffener for receiving a first component. The packaging also has a second sub-assembly with the second stiffener for receiving a second component and for coupling to an external circuit. The packaging has a flexible portion with a first end for coupling to the first sub-assembly and a second end for coupling to the second sub-assembly. The flexible portion allows the first sub-assembly to be oriented with respect to the second sub-assembly to form an angle that is greater than zero degrees and less than 180 degrees.

摘要翻译： 包装光学模块的组件。 该包装包括耦合到两个加强件的柔性电路。 包装具有第一子组件，第一子组件具有用于接收第一组件的第一加强件。 该包装还具有第二子组件，第二加强件用于接收第二部件并用于耦合到外部电路。 该包装具有柔性部分，其具有用于联接到第一子组件的第一端和用于联接到第二子组件的第二端。 柔性部分允许第一子组件相对于第二子组件定向以形成大于零度且小于180度的角度。