公开(公告)号：US6076017A

公开(公告)日：2000-06-13

申请号：US22321

申请日：1998-02-11

申请人： William J. Taylor ,  John D. Wright ,  Joseph F. Lessar ,  Gary F. LaBree

发明人： William J. Taylor ,  John D. Wright ,  Joseph F. Lessar ,  Gary F. LaBree

IPC分类号： A61N1/375 ,  H01M2/06 ,  H01M2/10 ,  H01M2/30 ,  H01M6/16

CPC分类号： H01M2/065 ,  A61N1/3752 ,  H01M6/16 ,  H01M2/1022 ,  H01M2/1066 ,  H01M2/30

摘要： A centerless grinding method of finishing feedthrough pins and corresponding devices for use in implantable medical devices and for components such as batteries in implantable medical devices is disclosed. The method provides certain advantages, including the elimination of longitudinal anomalies in drawn wire to thereby improve the hermeticity of implantable medical devices. In one of the preferred methods, the surface of an over-size medical grade wire having a known anomaly depth is centerless ground using an abrasive wheel and suitable coolant to a layer past which those anomalies disappear.

摘要翻译： 公开了一种用于可植入医疗装置和诸如可植入医疗装置中的电池的部件的整流穿通销和相应装置的无心磨削方法。 该方法提供了一些优点，包括消除拉丝中的纵向异常，从而提高可植入医疗装置的气密性。 在优选的方法之一中，具有已知异常深度的超大尺寸医用级线材的表面是使用砂轮和适当的冷却剂进行无心磨削，通过这些异常消失的层。

公开(公告)号：US5871513A

公开(公告)日：1999-02-16

申请号：US846772

申请日：1997-04-30

申请人： William J. Taylor ,  John D. Wright ,  Joseph F. Lessar ,  Gary F. LaBree

发明人： William J. Taylor ,  John D. Wright ,  Joseph F. Lessar ,  Gary F. LaBree

IPC分类号： A61N1/375 ,  H01M2/06 ,  H01M2/10 ,  H01M2/30 ,  H01M6/16 ,  A61N1/378

CPC分类号： H01M2/065 ,  A61N1/3752 ,  H01M6/16 ,  H01M2/1022 ,  H01M2/1066 ,  H01M2/30

摘要： The present invention relates to centerless grinding methods and corresponding devices such as feedthroughs for implantable medical devices and for batteries for implantable medical devices. The present invention provides certain advantages, including the elimination of longitudinal anomalies in drawn wire and increasing the reliability of implantable medical devices. In a method of the present invention, the surface of an over-size medical grade wire having a known anomaly depth is centerless ground to a depth past which those anomalies disappear. Centerless grinding of the present invention may be accomplished using an abrasive wheel and suitable coolant.

摘要翻译： 本发明涉及无心磨削方法和相应的装置，例如用于可植入医疗装置的馈通装置和用于可植入医疗装置的电池。 本发明提供了一些优点，包括消除拉丝中的纵向异常并增加可植入医疗装置的可靠性。 在本发明的方法中，具有已知异常深度的超大尺寸医用级线的表面是无心磨削至经过这些异常消失的深度。 可以使用砂轮和合适的冷却剂来实现本发明的无心磨削。

公开(公告)号：US5851222A

公开(公告)日：1998-12-22

申请号：US23015

申请日：1998-02-11

申请人： William J. Taylor ,  John D. Wright ,  Joseph F. Lessar ,  Gary F. LaBree

发明人： William J. Taylor ,  John D. Wright ,  Joseph F. Lessar ,  Gary F. LaBree

IPC分类号： A61N1/375 ,  H01M2/06 ,  H01M2/10 ,  H01M2/30 ,  H01M6/16

CPC分类号： H01M2/065 ,  A61N1/3752 ,  H01M6/16 ,  H01M2/1022 ,  H01M2/1066 ,  H01M2/30

摘要： The present invention relates to centerless grinding methods and corresponding devices such as feedthroughs for implantable medical devices and for batteries for implantable medical devices. The present invention provides certain advantages, including the elimination of longitudinal anomalies in drawn wire and increasing the reliability of implantable medical devices. In a method of the present invention, the surface of an over-size medical grade wire having a known anomaly depth is centerless ground to a depth past which those anomalies disappear. Centerless grinding of the present invention may be accomplished using an abrasive wheel and suitable coolant.

摘要翻译： 本发明涉及无心磨削方法和相应的装置，例如用于可植入医疗装置的馈通装置和用于可植入医疗装置的电池。 本发明提供了一些优点，包括消除拉丝中的纵向异常并增加可植入医疗装置的可靠性。 在本发明的方法中，具有已知的异常深度的超大尺寸医用级线的表面是无心磨削到这些异常消失的深度。 可以使用砂轮和合适的冷却剂来实现本发明的无心磨削。