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    METHOD AND SYSTEM FOR REMOVING PCBs FROM SYNTHETIC RESIN MATERIALS
    6.
    发明申请
    METHOD AND SYSTEM FOR REMOVING PCBs FROM SYNTHETIC RESIN MATERIALS 审中-公开
    从合成树脂材料中去除PCB的方法和系统

    公开(公告)号：US20100236580A1

    公开(公告)日：2010-09-23

    申请号：US12599974

    申请日：2008-05-13

    申请人： Gary M. Delaurentiis

    发明人： Gary M. Delaurentiis

    IPC分类号： B08B3/00

    CPC分类号： B08B3/04 ,  B08B3/08 ,  B08B3/14

    摘要： A system that removes PCBs from synthetic resins in an environmentally safe and economical manner. The system includes a solvent wash subsystem (10) including a first tank (44) to expose the resin particles to a solvent for a first predetermined period of time. In the solvent tank (44), the solvent contacts the resin particles, removing the PCBs. Thereafter, a separator is provided to separate the solvent from the resin particles after removal from the first tank (44). The system also includes a carbon dioxide subsystem (34) where, after separation, the resin particles are exposed to carbon dioxide in a vessel for a second predetermined period of time. Exposure to the carbon dioxide substantially removes any residual solvent and trace amounts of PCBs remaining on the resin particles. In various embodiments, the first predetermined period of time and the second predetermined period of time are selected so that the PCBs on the resin particles are reduced to a predetermined acceptable level, for example, 2.8 million parts per million or less. Exposure to the solvent and the carbon dioxide can be either performed (i) in one continuous cycle for the first period of time and the second period of time respectively; or (ii) in a number of successive cycles, where the sum of the exposure times of the cycles equals the first and second periods of time respectively.

    摘要翻译： 一种以环保和经济的方式从合成树脂中除去PCB的系统。 该系统包括溶剂洗涤子系统（10），其包括第一罐（44），以将树脂颗粒暴露于第一预定时间段内的溶剂。 在溶剂罐（44）中，溶剂与树脂颗粒接触，去除PCB。 此后，提供分离器，从第一罐（44）中取出之后将溶剂与树脂颗粒分离。 该系统还包括二氧化碳子系统（34），其中在分离之后树脂颗粒在容器中暴露于二氧化碳持续第二预定时间段。 暴露于二氧化碳基本上除去残留在树脂颗粒上的残余溶剂和痕量的PCB。 在各种实施例中，选择第一预定时间段和第二预定时间段，使得树脂颗粒上的PCB减少到预定的可接受水平，例如，每百万个百万分之几或更少。 暴露于溶剂和二氧化碳可以（i）分别在一个连续循环中进行第一个时间段和第二个时间段; 或（ii）在多个连续循环中，其中循环的曝光时间之和分别等于第一和第二时间段。