公开(公告)号：US20130235544A1

公开(公告)日：2013-09-12

申请号：US13416404

申请日：2012-03-09

Applicant: James L. Tucker ,  Gary Roosevelt ,  Kenneth H. Heffner ,  James Hobbs

Inventor： James L. Tucker ,  Gary Roosevelt ,  Kenneth H. Heffner ,  James Hobbs

IPC: H05K1/18 ,  H05K3/36 ,  H05K1/11

CPC classification number: H01L23/481 ,  H01L23/49833 ,  H01L23/585 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/1461 ,  H01L2924/15192 ,  H01L2924/15311 ,  Y10T29/49126 ,  H01L2924/00

Abstract: In some examples, an integrated circuit system includes a plurality of integrated circuit layers. At least one of the integrated circuit layers includes an integrated circuit die, which may not include any through-silicon vias that provide a pathway to an adjacent integrated circuit layer, and an interposer portion, which includes electrically conductive through-vias. The interposer portion may facilitate communication of the integrated circuit die with other integrated circuit layers of the integrated circuit system. In some examples, the stacked integrated circuit system may include more than one integrated circuit die, which may be in the same integrated circuit layer as at least one other integrated circuit die, or may be in a different integrated circuit layer.

Abstract translation: 在一些示例中，集成电路系统包括多个集成电路层。 集成电路层中的至少一个包括集成电路管芯，其可以不包括提供到相邻集成电路层的通路的任何穿硅通孔，以及包括导电通孔的插入器部分。 插入器部分可以促进集成电路管芯与集成电路系统的其它集成电路层的通信。 在一些示例中，堆叠集成电路系统可以包括多于一个集成电路管芯，其可以与至少一个其它集成电路管芯在同一集成电路层中，或者可以在不同的集成电路层中。

公开(公告)号：US09947609B2

公开(公告)日：2018-04-17

申请号：US13416404

申请日：2012-03-09

Applicant: James L. Tucker ,  Gary Roosevelt ,  Kenneth H. Heffner ,  James Hobbs

Inventor： James L. Tucker ,  Gary Roosevelt ,  Kenneth H. Heffner ,  James Hobbs

IPC: H01L23/48 ,  H01L23/58 ,  H01L23/498

CPC classification number: H01L23/481 ,  H01L23/49833 ,  H01L23/585 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/1461 ,  H01L2924/15192 ,  H01L2924/15311 ,  Y10T29/49126 ,  H01L2924/00

Abstract: In some examples, an integrated circuit system includes a plurality of integrated circuit layers. At least one of the integrated circuit layers includes an integrated circuit die, which may not include any through-silicon vias that provide a pathway to an adjacent integrated circuit layer, and an interposer portion, which includes electrically conductive through-vias. The interposer portion may facilitate communication of the integrated circuit die with other integrated circuit layers of the integrated circuit system. In some examples, the stacked integrated circuit system may include more than one integrated circuit die, which may be in the same integrated circuit layer as at least one other integrated circuit die, or may be in a different integrated circuit layer.