公开(公告)号：US06858280B2

公开(公告)日：2005-02-22

申请号：US10377085

申请日：2003-02-26

申请人： Mark S. Allen ,  Gary S. Willen ,  Robert A. Mohling

发明人： Mark S. Allen ,  Gary S. Willen ,  Robert A. Mohling

IPC分类号： E04B1/74 ,  E04B1/80 ,  F16L59/065 ,  F17C13/00 ,  B32B1/02

CPC分类号： E04B1/803 ,  E04B2001/748 ,  F16L59/065 ,  F17C13/001 ,  F17C2203/0329 ,  F17C2203/0341 ,  F17C2203/0345 ,  F17C2203/0358 ,  F17C2203/0391 ,  F17C2221/011 ,  F17C2221/012 ,  F17C2221/014 ,  F17C2221/016 ,  F17C2221/017 ,  F17C2221/033 ,  F17C2223/0161 ,  F17C2223/033 ,  F17C2270/0186 ,  Y02A30/242 ,  Y02B80/12 ,  Y02E60/321 ,  Y10T428/1393 ,  Y10T428/231

摘要： A new insulation system is provided that contains microspheres. This insulation system can be used to provide insulated panels and clamshells, and to insulate annular spaces around objects used to transfer, store, or transport cryogens and other temperature-sensitive materials. This insulation system provides better performance with reduced maintenance than current insulation systems.

摘要翻译： 提供了一种新的包含微球的绝缘系统。 该绝缘系统可用于提供绝缘板和蛤壳，并隔离用于转移，存储或运输低温液体和其他温度敏感材料的物体周围的环形空间。 该绝缘系统比目前的绝缘系统提供更好的维护保养。

公开(公告)号：US06679315B2

公开(公告)日：2004-01-20

申请号：US10047871

申请日：2002-01-14

申请人： Michael R. Cosley ,  Richard L. Fischer ,  Jack H. Thiesen ,  Gary S. Willen

发明人： Michael R. Cosley ,  Richard L. Fischer ,  Jack H. Thiesen ,  Gary S. Willen

IPC分类号： F28F700

CPC分类号： F28F3/12 ,  F25B39/022 ,  F25B41/067 ,  F28D2021/0029 ,  F28D2021/0071 ,  F28F3/02 ,  F28F2260/02 ,  H01L23/473 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/0209 ,  H01L2924/00

摘要： A microscale chip cooling system for a heat dissipating item, such as Intel's Pentium brand microprocessor. The system includes a 40 millimeter by 40 millimeter thermally insulated housing including a base and a cover. The system also includes a thermally conductive evaporator. The evaporator is adapted to be attached to a heat source such as the microprocessor. The cover includes inlet and outlet ports and the base includes a capillary passage. A refrigerant or heat transferring fluid is pumped or past through the passage before making a sudden expansion in an expansion zone just before passing to an evaporator chamber. Pool and flow boiling and forced convection may occur in the evaporator chamber as heat is transferred from the microprocessor through the thermally conductive evaporator to the refrigerant. The refrigerant then returns to a compressor to repeat the cycle. The system is extremely small and very efficient.

摘要翻译： 用于散热物品的微型芯片冷却系统，如英特尔奔腾品牌微处理器。 该系统包括一个40毫米×40毫米的绝热外壳，包括底座和盖子。 该系统还包括导热蒸发器。 蒸发器适于附接到诸如微处理器的热源。 盖子包括入口和出口，底座包括毛细通道。 在通过蒸发器室之前在膨胀区中突然膨胀之前，将制冷剂或传热流体泵送或通过通道。 当热量从微处理器通过导热蒸发器传递到制冷剂时，会在蒸发室中发生池和流动沸腾和强制对流。 然后制冷剂返回到压缩机重复循环。 该系统非常小，效率非常高。

公开(公告)号：US06595006B2

公开(公告)日：2003-07-22

申请号：US10074366

申请日：2002-02-12

申请人： Jack H. Thiesen ,  Gary S. Willen ,  Robert A. Mohling

发明人： Jack H. Thiesen ,  Gary S. Willen ,  Robert A. Mohling

IPC分类号： F25B900

CPC分类号： H02N1/006 ,  F01K25/08 ,  F02B75/34 ,  F02G1/043 ,  F02G2244/50 ,  F02G2250/31 ,  F04B19/006 ,  F25B9/06 ,  F25B9/14 ,  F25B2400/15

摘要： The present invention discloses a miniature thermodynamic device that can be constructed using standard micro-fabrication techniques. The device can be used to provide cooling, generate power, compress gases, pump fluids and reduce pressure below ambient (operate as a vacuum pump). Embodiments of the invention relating to the production of a cooling effect and the generation of electrical power, change the thermodynamic state of the system by extracting energy from a pressurized fluid. Energy extraction is attained using an expansion process, which is as nearly isentropic as possible for the appropriately chosen fluid. An isentropic expansion occurs when a compressed gas does work to expand, and in the disclosed embodiments, the gas does work by overcoming either an electrostatic or a magnetic force.