公开(公告)号：US07010837B2

公开(公告)日：2006-03-14

申请号：US10410433

申请日：2003-04-09

申请人： Eiichi Takata ,  Yasuji Yamamoto ,  Genji Inuidani ,  Michio Kadota

发明人： Eiichi Takata ,  Yasuji Yamamoto ,  Genji Inuidani ,  Michio Kadota

IPC分类号： H04R17/00 ,  C23C14/00

CPC分类号： H03H3/08 ,  H01L41/29 ,  H03H9/64 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156

摘要： A method for manufacturing an electronic component includes the steps of forming an electrode layer including α-tungsten on a substrate at a substrate temperature of about 100° C. to about 300° C. by a sputtering process, processing the electrode layer so as to have a desired shape, and heat-treating the electrode layer. An electronic component includes a substrate and an electrode layer that is disposed on the substrate directly or indirectly, includes α-tungsten, and has a specific resistance of about 15 μΩ.cm or less and a warpage of about 120 μm or less. A surface acoustic wave filter includes a piezoelectric substrate and an electrode layer, disposed on the piezoelectric substrate, including α-tungsten.

摘要翻译： 一种制造电子部件的方法包括以下步骤：通过溅射工艺在基板温度为约100℃至约300℃的基板上形成包括α-钨的电极层，处理电极层，以便 具有所需的形状，并对该电极层进行热处理。 电子部件包括直接或间接地设置在基板上的基板和电极层，包括α-钨，并且具有约15μm或更小的电阻率和约120μm或更小的翘曲。 表面声波滤波器包括压电基片和设置在压电基片上的包括α-钨的电极层。