公开(公告)号：US07125176B1

公开(公告)日：2006-10-24

申请号：US10674374

申请日：2003-09-30

申请人： John W. Stafford ,  George G. Grouch ,  Irka Zazulak

发明人： John W. Stafford ,  George G. Grouch ,  Irka Zazulak

IPC分类号： G02B6/30 ,  G02B6/36

CPC分类号： G02B6/4246 ,  G02B6/4214 ,  G02B6/423 ,  H05K1/0274 ,  H05K1/056 ,  H05K3/4641 ,  H05K2201/068 ,  H05K2201/09745

摘要： High speed high data interconnect apparatus includes a stiffening plate with optical fiber mounting groove defined on a surface thereof. The apparatus further includes a length of optical fiber mounted in the groove on the surface of the stiffening plate in a longitudinally extending direction generally parallel to the surface of the stiffening plate. A reflecting surface is positioned adjacent one, or both, of the opposed ends of the optical fiber to direct light at an angle of approximately ninety degrees to the optical path. A printed circuit board laminate is used to encase the stiffening plate and the optical fiber and includes a light via for the passage of light reflected by the reflecting surface. Bond pads are formed on a surface of the printed circuit board laminate adjacent the light via for the electrical connection of a light element, e.g. a VCSEL or photodiode, in communication with the light via.

摘要翻译： 高速高数据互连装置包括在其表面上限定有光纤安装槽的加强板。 该装置还包括一段长度的光纤，其沿纵向延伸的方向安装在加强板的表面上的凹槽中，该方向大致平行于加强板的表面。 反射表面邻近光纤的相对端的一个或两个定位，以将光以与光路近似九十度的角度引导。 印刷电路板层叠体用于包围加强板和光纤，并且包括用于使由反射表面反射的光通过的光通孔。 接合焊盘形成在邻近光通孔的印刷电路板层压体的表面上，用于光元件的电连接，例如， 与光通孔连通的VCSEL或光电二极管。