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公开(公告)号:US06276589B1
公开(公告)日:2001-08-21
申请号:US08724034
申请日:1996-09-23
申请人: Hal G. Watts, Jr. , Melissa E. Orme-Marmarelis , Eric Phillip Muntz , Gerald C. Pham-Van-Diep , Robert F. Smith, Jr. , Robert J. Balog , Gary T. Freeman
发明人: Hal G. Watts, Jr. , Melissa E. Orme-Marmarelis , Eric Phillip Muntz , Gerald C. Pham-Van-Diep , Robert F. Smith, Jr. , Robert J. Balog , Gary T. Freeman
IPC分类号: B23K306
CPC分类号: H05K3/3457 , B22F2009/0836 , B23K3/0607 , B23K3/0623 , B23K2101/40 , H05K2203/013
摘要: An apparatus for depositing a selected pattern of solder onto a substrate comprising a substrate support, a solder ejector, and an orifice defining structure. The substrate support has structure for bearing a substrate on which one or more electronic components are to be mounted. The solder ejector has a housing that defines a cavity for containing molten solder. The orifice defining structure includes a flat disk having an orifice defined therethrough for producing a stream of molten solder and a disk support structure that supports the disk around the orifice and is replaceably coupled to the cavity-defining structure. Also disclosed is an apparatus that deposits a selected pattern of solder onto a substrate and includes a substrate support, a solder ejector that directs solder droplets to desired positions on the support, and an ejector aligner that adjusts the orientation of the solder ejector in two angular dimensions to enable adjustment of the trajectory of the stream of molten solder droplets.
摘要翻译: 一种用于将选择的焊料图案沉积到包括衬底支撑件,焊料喷射器和孔口限定结构的衬底上的装置。 衬底支撑件具有用于承载要在其上安装一个或多个电子部件的衬底的结构。 焊料喷射器具有限定用于容纳熔融焊料的空腔的壳体。 孔口限定结构包括具有限定在其中的孔口的扁平盘,用于产生熔融焊料流;以及圆盘支撑结构,其支撑围绕孔口的盘,并且可更换地联接到空腔限定结构。 还公开了一种将选择的焊料图案沉积到衬底上并且包括衬底支撑件的焊接喷射器,将焊膏引导到支撑件上的期望位置的喷射器对准器,其将焊料喷射器的取向调整为两个角度 能够调节熔融焊料液滴流的轨迹的尺寸。
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公开(公告)号:US06264090B1
公开(公告)日:2001-07-24
申请号:US09246229
申请日:1999-02-08
IPC分类号: B23K3102
CPC分类号: H05K3/3457 , B22F2009/0836 , B23K3/0607 , B23K3/0623 , B23K2101/40 , B23K2101/42 , H05K3/1241 , H05K3/125 , H05K2203/013
摘要: Depositing a selected pattern of solder droplets onto a substrate on which one or more electronic components are to be mounted, the substrate being mounted on a substrate support and moved relative to a solder ejector along a scan axis, the droplets being deflected along a fan axis that is transverse to the scan axis by selectively applying a charge and passing the charged droplets through an electric field.
摘要翻译: 将选定的焊点图案沉积到要安装一个或多个电子部件的基板上,将基板安装在基板支撑件上并沿着扫描轴线相对于焊料喷射器移动,液滴沿风扇轴线偏转 通过选择性地施加电荷并使带电的液滴通过电场而横向于扫描轴。
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公开(公告)号:US5938102A
公开(公告)日:1999-08-17
申请号:US583641
申请日:1996-01-05
CPC分类号: H05K3/3457 , B23K3/0607 , B23K3/0623 , B22F2009/0836 , B23K2201/40 , B23K2201/42 , H05K2203/013 , H05K3/1241 , H05K3/125
摘要: Depositing a selected pattern of solder droplets onto a substrate on which one or more electronic components are to be mounted, the substrate being mounted on a substrate support and moved relative to a solder ejector along a scan axis, the droplets being deflected along a fan axis that is transverse to the scan axis by selectively applying a charge and passing the charged droplets through an electric field.
摘要翻译: 将选定的焊点图案沉积到要安装一个或多个电子部件的基板上,将基板安装在基板支撑件上并沿着扫描轴线相对于焊料喷射器移动,液滴沿风扇轴线偏转 通过选择性地施加电荷并使带电的液滴通过电场而横向于扫描轴。
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公开(公告)号:US06955120B2
公开(公告)日:2005-10-18
申请号:US10402418
申请日:2003-03-28
申请人: Gerald C. Pham-Van-Diep , Patsy Anthony Mattero , Randy Leon Peckham , Gary Freeman , Joseph A. Perault , Richard Willshere
发明人: Gerald C. Pham-Van-Diep , Patsy Anthony Mattero , Randy Leon Peckham , Gary Freeman , Joseph A. Perault , Richard Willshere
IPC分类号: B41F15/42 , G01N33/487 , H05K3/12 , B41L27/00
CPC分类号: H05K3/1233 , B41F15/42 , B41P2215/132 , H05K2203/0126 , H05K2203/0139
摘要: A printer includes a print head for dispensing viscous material, such as solder paste. The print head defines a chamber and includes at least one source port and a dispensing slot. Within the chamber, a flexible membrane segregates the chamber into a dispensing region and an activation region. Viscous material flows from a supply mounted to the source port, into the dispensing region and out the slot. A displacement mechanism is positioned to displace the flexible membrane to reduce the volume of dispensing region and to thereby dispense viscous material through the slot. The print head also includes a removable envelope through which the viscous material flows and contacts as it passes through the envelope.
摘要翻译: 打印机包括用于分配粘性材料的打印头,例如焊膏。 打印头限定一个室,并且包括至少一个源端口和分配槽。 在腔室内,柔性膜将腔室分离成分配区域和激活区域。 粘性材料从安装到源端口的电源流入分配区域并从插槽中流出。 位移机构被定位成移动柔性膜以减小分配区域的体积,从而通过狭槽分配粘性材料。 打印头还包括可移除的信封,粘性材料在其通过信封时流过并接触。
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公开(公告)号:US06260741B1
公开(公告)日:2001-07-17
申请号:US09253631
申请日:1999-02-19
IPC分类号: B22D4100
CPC分类号: H01L21/6715 , B05B1/02 , B05B17/0607 , B23K3/0607 , B23K2101/42
摘要: An apparatus for dispensing a fluid includes a dispensing chamber coupled to a dispensing orifice and a fluid reservoir. The dispensing chamber is coupled to a transducer which is adapted to change the volume of the dispensing chamber in response to a signal applied to the transducer. The signal is characterized by 1) an initial rise time RT1 during which an increasing amplitude signal is applied to the transducer to gradually expand the dispensing chamber from a first volume at a first amplitude to a second volume at a second amplitude; 2) a fall time FT during which a decreasing amplitude signal is applied to the transducer to contract or compress the dispensing chamber rapidly (relative to the initial rise time RT1) to a third volume at third amplitude; 3) a final rise time RT2 during which an increasing amplitude signal is applied to the transducer to gradually expand the dispensing chamber to a fourth volume at a fourth amplitude. Preferably, the first volume is less than the second volume, the second volume is substantially greater than the third volume, the third volume is less than the fourth volume, and the first volume is same as the fourth volume and both are equal to the nominal volume of the dispensing chamber. In addition, the fall time is substantially smaller than both the initial rise time and the final rise time. In the preferred embodiment, the waveform amplitude is negatively offset by its center (or nominal) to peak amplitude.
摘要翻译: 用于分配流体的装置包括联接到分配孔和流体储存器的分配室。 分配腔室耦合到换能器,该换能器适于响应于施加到换能器的信号而改变分配室的体积。 该信号的特征在于1)初始上升时间RT1,在此期间增加幅度信号被施加到换能器以使分配室从第一振幅的第一体积以第二幅度逐渐扩大到第二体积; 2)下降时间FT,其中减小的振幅信号被施加到换能器以将分配室迅速地(相对于初始上升时间RT1)收缩或压缩到第三振幅的第三体积; 3)最终上升时间RT2,在此期间增加幅度信号被施加到换能器,以便以第四幅度逐渐地将分配室扩展到第四体积。 优选地,第一容积小于第二容积,第二容积基本上大于第三容积,第三容积小于第四容积,第一容积与第四容积相同,并且两者均等于标称值 分配腔体积。 此外,下降时间显着小于初始上升时间和最终上升时间。 在优选实施例中,波形振幅由其中心(或标称)到峰值振幅负偏移。
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公开(公告)号:US06186192B1
公开(公告)日:2001-02-13
申请号:US08908195
申请日:1997-08-07
申请人: Melissa E. Orme-Marmarelis , Eric Phillip Muntz , Gerald C. Pham-Van-Diep , Robert F. Smith, Jr.
发明人: Melissa E. Orme-Marmarelis , Eric Phillip Muntz , Gerald C. Pham-Van-Diep , Robert F. Smith, Jr.
IPC分类号: B65B104
CPC分类号: B23K3/0623 , B23K2101/40
摘要: An apparatus for filling filtered solder into replaceable solder cartridges for use in a system for depositing a selected pattern of solder onto a substrate on which electronic components are to be mounted. The apparatus includes a cartridge support, an environmentally-controlled chamber, a solder receptacle, a heater, a molten solder flow conduit, and a separator.
摘要翻译: 一种用于将过滤的焊料填充到可更换的焊料盒中的装置,用于将选择的焊料图案沉积到其上将要安装电子部件的基板上的系统中。 该装置包括盒支架,环境控制室,焊料容器,加热器,熔融焊料流动管道和分离器。
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7.
公开(公告)号:US06571701B1
公开(公告)日:2003-06-03
申请号:US09849699
申请日:2001-05-04
IPC分类号: B41L1318
CPC分类号: H05K3/1233 , B23K3/0607 , B41F31/03 , H05K3/3484 , H05K2203/0126
摘要: A printer includes a dispensing head for dispensing viscous material, such as solder paste. The dispensing head defines a chamber and includes at least one source port and a dispensing slot, wherein the viscous material flows from a supply mounted to the source port, into the chamber and out the dispensing slot. Within the chamber, a stirring mechanism is mounted. The stirring mechanism is coupled to a drive mechanism that displaces the stirring mechanism through the chamber, thereby stirring the viscous material. The stirring mechanism is particularly effective in preventing or reducing compaction of solder paste within the chamber.
摘要翻译: 打印机包括用于分配粘性材料的分配头,例如焊膏。 分配头限定一个室,并且包括至少一个源端口和分配槽,其中粘性材料从安装到源端口的电源流入室并且从分配槽流出。 在室内安装搅拌机构。 搅拌机构联接到驱动机构,该驱动机构通过室移动搅拌机构,从而搅拌粘性材料。 搅拌机构特别有效地防止或减少室内焊膏的压实。
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