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    Jet soldering system and method
    2.
    发明授权
    Jet soldering system and method 失效
    射流焊接系统及方法

    公开(公告)号：US5894985A

    公开(公告)日：1999-04-20

    申请号：US719117

    申请日：1996-09-24

    申请人： Melissa E. Orme-Marmarelis ,  Eric Phillip Muntz

    发明人： Melissa E. Orme-Marmarelis ,  Eric Phillip Muntz

    IPC分类号： B23K3/06 ,  B23K37/06

    CPC分类号： B23K3/0607 ,  B22F2009/0836

    摘要： An apparatus for depositing a selected pattern of solder onto a substrate on which electronic components are to be mounted. The apparatus includes a substrate support, a replaceable solder cartridge, and a solder ejector. The replaceable solder cartridge defines a cavity for containing solder and has an orifice for ejecting a continuous stream of molten solder. The solder ejector has a mechanism for retaining the replaceable solder cartridge during solder deposition and is positioned relative to the substrate support to deposit molten solder ejected from the orifice of the replaceable solder cartridge onto the substrate.

    摘要翻译： 一种用于将选择的焊料图案沉积到其上将要安装电子部件的基板上的装置。 该装置包括基板支撑件，可替换的焊料盒和焊料喷射器。 可替换的焊料盒限定用于容纳焊料的空腔，并且具有用于喷射熔融焊料的连续流的孔。 焊料喷射器具有用于在焊料沉积期间保持可替换的焊料盒并且相对于衬底支撑件定位的机构，以将从可更换的焊料盒的孔喷出的熔融焊料沉积到衬底上。

    Jet soldering system and method
    3.
    发明授权
    Jet soldering system and method 失效
    射流焊接系统及方法

    公开(公告)号：US06276589B1

    公开(公告)日：2001-08-21

    申请号：US08724034

    申请日：1996-09-23

    申请人： Hal G. Watts, Jr. ,  Melissa E. Orme-Marmarelis ,  Eric Phillip Muntz ,  Gerald C. Pham-Van-Diep ,  Robert F. Smith, Jr. ,  Robert J. Balog ,  Gary T. Freeman

    发明人： Hal G. Watts, Jr. ,  Melissa E. Orme-Marmarelis ,  Eric Phillip Muntz ,  Gerald C. Pham-Van-Diep ,  Robert F. Smith, Jr. ,  Robert J. Balog ,  Gary T. Freeman

    IPC分类号： B23K306

    CPC分类号： H05K3/3457 ,  B22F2009/0836 ,  B23K3/0607 ,  B23K3/0623 ,  B23K2101/40 ,  H05K2203/013

    摘要： An apparatus for depositing a selected pattern of solder onto a substrate comprising a substrate support, a solder ejector, and an orifice defining structure. The substrate support has structure for bearing a substrate on which one or more electronic components are to be mounted. The solder ejector has a housing that defines a cavity for containing molten solder. The orifice defining structure includes a flat disk having an orifice defined therethrough for producing a stream of molten solder and a disk support structure that supports the disk around the orifice and is replaceably coupled to the cavity-defining structure. Also disclosed is an apparatus that deposits a selected pattern of solder onto a substrate and includes a substrate support, a solder ejector that directs solder droplets to desired positions on the support, and an ejector aligner that adjusts the orientation of the solder ejector in two angular dimensions to enable adjustment of the trajectory of the stream of molten solder droplets.

    摘要翻译： 一种用于将选择的焊料图案沉积到包括衬底支撑件，焊料喷射器和孔口限定结构的衬底上的装置。 衬底支撑件具有用于承载要在其上安装一个或多个电子部件的衬底的结构。 焊料喷射器具有限定用于容纳熔融焊料的空腔的壳体。 孔口限定结构包括具有限定在其中的孔口的扁平盘，用于产生熔融焊料流;以及圆盘支撑结构，其支撑围绕孔口的盘，并且可更换地联接到空腔限定结构。 还公开了一种将选择的焊料图案沉积到衬底上并且包括衬底支撑件的焊接喷射器，将焊膏引导到支撑件上的期望位置的喷射器对准器，其将焊料喷射器的取向调整为两个角度 能够调节熔融焊料液滴流的轨迹的尺寸。

    Jet soldering system and method
    5.
    发明授权
    Jet soldering system and method 失效
    射流焊接系统及方法

    公开(公告)号：US5894980A

    公开(公告)日：1999-04-20

    申请号：US718607

    申请日：1996-09-23

    申请人： Melissa E. Orme-Marmarelis ,  Eric Phillip Muntz

    发明人： Melissa E. Orme-Marmarelis ,  Eric Phillip Muntz

    IPC分类号： B23K3/06 ,  B23K37/06

    CPC分类号： B23K3/0623 ,  B22F2009/0836 ,  B22F2999/00 ,  B23K2201/42

    摘要： An apparatus for depositing a selected pattern of solder onto a substrate comprising: a substrate support having structure for bearing a substrate on which one or more electronic components are to be mounted; a solder ejector that defines a cavity for containing molten solder and an orifice for ejecting a stream of molten solder; a heater for heating the solder to a temperature above the melting point of solder; a vibrator coupled to the solder ejector to form droplets in the stream at the desired frequency for deposition onto the substrate; and a cooler, adapted to receive a coolant, disposed between the heater and the vibrator to maintain the temperature of the vibrator below that which would detrimentally affect the performance of the vibrator.

    摘要翻译： 一种用于将选择的焊料图案沉积到衬底上的装置，包括：具有用于承载要在其上安装一个或多个电子部件的衬底的结构的衬底支撑件; 焊料喷射器，其限定用于容纳熔融焊料的空腔和用于喷射熔融焊料流的孔口; 用于将焊料加热到高于焊料熔点的温度的加热器; 耦合到所述焊料喷射器的振动器，以在所述流中以期望的频率形成液滴以沉积到所述衬底上; 以及设置在加热器和振动器之间的适于接收冷却剂的冷却器，以将振动器的温度保持在低于不利地影响振动器性能的温度。