公开(公告)号：US6158650A

公开(公告)日：2000-12-12

申请号：US409925

申请日：1999-09-30

Applicant: Andrew Vincent Holzmann

Inventor： Andrew Vincent Holzmann

IPC: B23K1/00 ,  B23K3/06 ,  B23K35/02 ,  B23K35/14 ,  H05K3/12 ,  H05K3/34 ,  B23K31/02

CPC classification number: B23K1/0016 ,  B23K3/0638 ,  B23K35/0222 ,  H05K3/1225 ,  H05K3/3484 ,  B23K2201/40 ,  B23K2201/42 ,  H05K2201/09727 ,  H05K2203/0278 ,  H05K2203/043 ,  H05K2203/0557 ,  H05K2203/0574 ,  H05K2203/058 ,  H05K3/3452

Abstract: Methods by which low melting point solder for reflow connection of components is formed on select fine and coarse pitch contacts of a printed circuit board simultaneously. A template with openings to select fine pitch circuit board contacts is placed in contact with fine pitch contacts. The fine and coarse pitch contacts of the board are exposed through holes in a stencil characterized in its ability to withstand solder reflow temperatures, not be wettable by solder, and have a coefficient of thermal expansion relatively matching the printed circuit board. Low temperature solder paste is screen deposited into the stencil openings. The solder paste retained by the template and stencil pattern is shaped during reflow to selectively form on the underlying contacts of the printed circuit board. Thereafter the board is subjected to previously practiced depositions of flux in preparation for fine and coarse pitch component placement and ensuing solder reflow. An alternate practice of the invention involves a method for controlling the volume of solder on select electrically conducting contacts of a substrate. A shaped solder deposit formed by a method which comprises: positioning a template in intimate contact with a substrate for shaping the side wall and height of a solder deposit; depositing solder paste within the confines of said template; heating said deposited solder paste to drive off volatile components and soften solder; and cooling the thus deposited solder to form the shaped solder deposit within said template. The shaped solder deposit formed by the above process.

Abstract translation: 同时在印刷电路板的选择的精细和粗略的音调触点上形成用于部件回流连接的低熔点焊料的方法。 具有选择细间距电路板触点的开口的模板放置成与细间距触点接触。 板的细和粗节距接触通过模板中的孔露出，其特征在于其能够承受焊料回流温度，不能被焊料润湿，并且具有与印刷电路板相对匹配的热膨胀系数。 低温焊膏被屏幕沉积在模板孔中。 由模板和模板图案保持的焊膏在回流期间成形，以选择性地形成在印刷电路板的下面的触点上。 此后，对板进行先前实践的助焊剂沉积，以准备精细和粗略的沥青组分放置并随后进行回流焊。 本发明的替代实施例涉及一种用于控制衬底的选定导电触点上的焊料体积的方法。 通过一种方法形成的成形焊料沉积物，该方法包括：将模板定位成与衬底紧密接触以使侧壁成形和焊料沉积物的高度; 在所述模板的范围内沉积焊膏; 加热所述沉积的焊膏以驱除挥发性组分并软化焊料; 并冷却由此沉积的焊料以在所述模板内形成成形的焊料沉积物。 通过上述方法形成的成形焊料沉积物。

公开(公告)号：US6123250A

公开(公告)日：2000-09-26

申请号：US313230

申请日：1999-05-17

Applicant: Franciscus Johannes De Klein ,  Rolf Arthur Den Dopper

Inventor： Franciscus Johannes De Klein ,  Rolf Arthur Den Dopper

IPC: B23K1/012 ,  B23K31/02 ,  B23K35/38

CPC classification number: B23K1/012 ,  B23K2201/42

Abstract: The invention relates to an oven for reflow soldering objects such as printed circuit boards. A temperature differential is established between the top and bottom surfaces of the board to allow gases liberated from solder paste within through-holes to escape, thereby preventing the formation of voids. The oven provides a flow of gas at a first temperature from an upper gas supplying means to the top side of the board. A flow of gas at a second temperature is directed at the bottom side of the board by a lower gas supplying means. According to one aspect of the invention, a portion of the gas supplied by the upper gas supplying means is captured by the lower gas supply means and is heated or cooled to the second temperature. According to another aspect of the invention, a number of pairs of independantly controllable upper and lower gas supplying means are arranged along a conveyor to provide a temperature profile to perform reflow soldering.

Abstract translation: 本发明涉及一种用于回流焊接诸如印刷电路板的物体的烤箱。 在板的顶表面和底表面之间建立温度差，以允许从通孔内的焊膏释放的气体逸出，从而防止形成空隙。 烘箱在第一温度从上部供气装置向板的顶侧提供气体流。 第二温度下的气体流通过下部气体供给装置被引导到板的底侧。 根据本发明的一个方面，由上部气体供给装置供应的气体的一部分被下部气体供给装置捕获，并被加热或冷却至第二温度。 根据本发明的另一方面，沿着输送机布置了多对可独立控制的上下气体供给装置，以提供温度曲线以执行回流焊接。

公开(公告)号：US6087596A

公开(公告)日：2000-07-11

申请号：US985227

申请日：1997-12-04

Applicant: Dangrong Ronald Liu

Inventor： Dangrong Ronald Liu

IPC: B23K1/008 ,  H05K3/34 ,  H05K3/40 ,  H05K1/16

CPC classification number: B23K1/008 ,  H05K3/3442 ,  B23K2201/42 ,  H05K2201/1028 ,  H05K2201/10636 ,  H05K3/4015 ,  Y02P70/611 ,  Y02P70/613

Abstract: A printed circuit board 50 with reinforced solder joints and having a substrate 11 having mounting pads 14 arranged thereon and a surface mount component 13 having terminations 12, wherein the component 13 is disposed on the substrate 11 with each termination 12 being registered atop a respective mounting pad 14. A solder joint 10 connects each termination 12 with its respective mounting pad 14, and a thin metallic member 30 is disposed within each solder joint 10 between each termination 12 and its respective mounting pad 14. Metallic member 30 is space from both the mounting pad ant the termination and is the same size as the mounting pad or smaller.

Abstract translation: 具有加强焊接点的印刷电路板50和具有布置在其上的安装焊盘14的基板11和具有端子12的表面安装部件13，其中部件13设置在基板11上，每个端接件12被登记在相应的安装件 焊接接头10将每个终端12与其相应的安装焊盘14连接，并且在每个端接件12和其相应的安装焊盘14之间的每个焊接接头10内设置一个薄金属部件30.金属部件30是两个 安装垫与端接件相同，尺寸与安装垫相同或更小。

公开(公告)号：US6070783A

公开(公告)日：2000-06-06

申请号：US63711

申请日：1998-04-21

Applicant: Shinichi Nakazato

Inventor： Shinichi Nakazato

IPC: B23P21/00 ,  B23K3/06 ,  H01L21/00 ,  H01L21/60 ,  H01L21/68 ,  H05K3/34 ,  H05K3/00

CPC classification number: B23K3/0623 ,  H01L21/67144 ,  H01L21/681 ,  B23K2201/42 ,  H05K3/3478

Abstract: An apparatus and a method for attaching conductive balls by which the tact time necessary for the positional recognition of a substrate before the conductive balls are attached onto a substrate can be greatly reduced. A first camera and a second camera are moved together a suction head. After the suction head picks up the conductive balls in a conductive ball supply section, the suction head is moved to a position above a flux supply section so that flux can be attached to the conductive balls 10, and concurrently the first camera recognizes a positional recognition mark on a substrate. Then, during when the suction head is moved to a position above the substrate, the second camera recognizes another positional recognition mark on the substrate. In accordance with the positional recognition conducted above, the suction head is positioned accurately with respect to the substrate, and then the conductive balls are attached onto the electrodes on the substrate.

Abstract translation: 可以大大减少用于安装导电球的装置和方法，通过该导电球将导电球附着到基底之前基底的位置识别所需的触觉时间可以大大降低。 第一相机和第二相机一起移动吸头。 在吸头拾取导电球供给部中的导电球之后，吸引头移动到通量供给部上方的位置，使得通量可以附着在导电球10上，同时第一相机识别位置识别 标记在基板上。 然后，当吸头移动到基板上方的位置时，第二相机识别基板上的另一位置识别标记。 根据上述位置识别，将吸头相对于基板准确地定位，然后将导电球附着在基板上的电极上。

公开(公告)号：US6019271A

公开(公告)日：2000-02-01

申请号：US893714

申请日：1997-07-11

Applicant: Brian John Hayden ,  Cuong Van Pham ,  Rosa Lynda Nuno ,  Mark Stephen Topping

Inventor： Brian John Hayden ,  Cuong Van Pham ,  Rosa Lynda Nuno ,  Mark Stephen Topping

IPC: B23K20/10 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40 ,  B23K1/06 ,  B23K31/02 ,  B32B31/16 ,  H05K1/16

CPC classification number: H05K3/361 ,  B23K20/103 ,  B23K2201/38 ,  B23K2201/42 ,  H05K2201/10356 ,  H05K2203/0285 ,  H05K2203/1189 ,  H05K3/328 ,  H05K3/4084

Abstract: A method for bonding together at least two conductive members 20, wherein each member includes at least one metallic 22 having a respective bonding area 24. At least one member has a deposition of metallic bonding material 26 attached to each respective conductor proximate each bonding area, and at least one member has a plastic element 28 attached thereto proximate each respective bonding area. The members 20 are positioned in a predetermined orientation, clamped together between an ultrasonic horn and anvil arrangement, with pressure and orthogonal ultrasonic energy being applied thereto so that each plastic element 28 is heated, which in turn melts the bonding material 26. Any plastic element material between the conductors is squeezed away therefrom and the respective conductors 22 are brought into proximity with each other so that a molten joint of bonding material physically contacts each respective conductor. The members are then held together until each joint solidifies, and then the horn and/or anvil are retracted.

Abstract translation: 一种用于将至少两个导电构件20结合在一起的方法，其中每个构件包括具有相应接合区域24的至少一个金属22.至少一个构件在每个接合区域附近附着到每个相应导体上的金属接合材料26的沉积， 并且至少一个构件具有附接到每个相应接合区域的塑料元件28。 构件20定位在预定取向上，夹在超声波喇叭和砧座之间，压力和正交的超声能量被施加到其上，使得每个塑料元件28被加热，这再次熔化接合材料26.任何塑料元件 导体之间的材料被挤压掉，各导体22彼此接近，使得接合材料的熔融接头物理地接触每个相应的导体。 然后将构件保持在一起直到每个接头固化，然后将喇叭和/或砧座缩回。

公开(公告)号：US6012713A

公开(公告)日：2000-01-11

申请号：US220106

申请日：1998-12-23

Applicant: James Gleason ,  Hassan Nemat

Inventor： James Gleason ,  Hassan Nemat

IPC: B23K3/08 ,  H05K3/12 ,  H05K13/00 ,  B23Q1/00

CPC classification number: B23K3/08 ,  H05K13/0069 ,  H05K3/1216 ,  B23K2201/42

Abstract: An apparatus comprising a pallet for holding a printed circuit board during the solder stenciling process wherein the printed circuit board is held by means of one or more lever arms cut from the pallet material so that pressure is exerted by the arm or arms against the printed circuit board by compression or through tension by the addition of a pin to the lever arm.

Abstract translation: 一种装置，包括在焊锡模版过程中用于保持印刷电路板的托盘，其中印刷电路板通过从托盘材料切割的一个或多个杠杆臂来保持，使得臂或臂抵靠印刷电路施加压力 通过在杠杆臂上添加一个销来压缩或通过张力。

公开(公告)号：US06010340A

公开(公告)日：2000-01-04

申请号：US34940

申请日：1998-03-04

Applicant: Jeffrey S. Campbell ,  Robert W. Nesky

Inventor： Jeffrey S. Campbell ,  Robert W. Nesky

IPC: B23K1/00 ,  B23K3/06 ,  H01R12/00 ,  H01R12/04 ,  H05K3/32 ,  H05K7/10 ,  H01R9/09

CPC classification number: B23K3/0607 ,  B23K1/0008 ,  B23K3/0623 ,  H05K3/325 ,  H05K7/1061 ,  B23K2201/40 ,  B23K2201/42 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/13019

Abstract: A socket connector system for forming a separable electrical contact between a first circuit substrate and a second circuit substrate. A dendrite interposer is disposed between the first circuit substrate and the second circuit substrate. A solder body is disposed between the first circuit substrate and the dendrite interposer. The solder body may include one of several types of solder columns or a solder ball. The solder body has a contact end which engages the dendrite interposer. The contact end has a void. An area of the contact end engages the dendrite interposer when compressive forces are exerted on the first circuit substrate and the second circuit substrate. This provides for all areas of a plurality of contact ends to engage and form reliable electrical contacts with the contact pads.

公开(公告)号：US5936048A

公开(公告)日：1999-08-10

申请号：US102876

申请日：1998-06-24

Applicant: Tetsuya Oishi ,  Kazuo Sugazaki ,  Jin Suzuki

Inventor： Tetsuya Oishi ,  Kazuo Sugazaki ,  Jin Suzuki

IPC: C08F8/00 ,  C08F8/08 ,  C08F8/28 ,  C08F8/30 ,  C08G12/00 ,  C08G59/06 ,  C08G61/00 ,  C08G63/91 ,  C08G65/48 ,  C08G69/48 ,  C08K5/00 ,  C08L23/26 ,  C08L63/00 ,  C08L67/02 ,  C08L71/12 ,  H05K3/34 ,  C08G59/14 ,  C08K3/32 ,  C08K5/49

CPC classification number: C08L71/126 ,  C08F8/00 ,  C08F8/08 ,  C08F8/28 ,  C08F8/30 ,  C08F8/40 ,  C08G12/00 ,  C08G59/063 ,  C08G61/00 ,  C08G63/914 ,  C08G65/485 ,  C08G69/48 ,  C08K5/0066 ,  C08L23/26 ,  C08L63/00 ,  C08L67/02 ,  B23K2201/42 ,  H05K2201/10734 ,  H05K2203/081 ,  H05K2203/087 ,  H05K2203/1105 ,  H05K2203/176 ,  H05K3/3436 ,  H05K3/3494

Abstract: There are herein disclosed a method for preparing a modified resin which comprises thermal/reaction by the use of a norbornenyl group-containing compound typified by norbornenecarboguanamine or its derivative, a method for preparing an epoxy-modified resin which comprises the step of reacting the above-mentioned modified resin and an epoxide, a flame-retarding method, a thermal stabilization method, a compatibilizing method and a surface modification method which comprise utilizing the modified resin, as well as a coating resin composition and an adhesive resin composition containing the modified resin.According to the preparation methods of the present invention, the deterioration of a material scarcely occurs, and a functional group which is excellent in flame retardancy, thermal stability, compatibility and the like can be introduced to the resins. By the utilization of these techniques, there can be obtained a flame-retardant material having a good char formability, a thermally stable material whose molded articles can inhibit heat deterioration, a material excellent in miscibility between different kinds of resins, a surface-modified material which is excellent in adhesion and coating properties and the like.

Abstract translation: 本文公开了一种制备改性树脂的方法，该改性树脂包括通过使用以降冰片烯基组合物为代表的降冰片烯基组合物或其衍生物的热/反应，一种环氧改性树脂的制备方法，该方法包括使上述 所述改性树脂和环氧化物，阻燃方法，热稳定化方法，相容化方法和表面改性方法，包括使用改性树脂，以及涂料树脂组合物和含有改性树脂的粘合剂树脂组合物 。 根据本发明的制备方法，几乎​​不发生材料的劣化，并且可以将具有优异的阻燃性，热稳定性，相容性等的官能团引入到树脂中。 通过利用这些技术，可以获得具有良好的成型性的阻燃材料，其成型制品可以抑制热劣化的热稳定材料，不同种类的树脂之间的混溶性优异的材料，表面改性材料 其粘合性和涂布性等优异。

公开(公告)号：US5928440A

公开(公告)日：1999-07-27

申请号：US513397

申请日：1995-08-10

Applicant: Takeo Kuramoto ,  Masataka Watabe ,  Satoshi Noda ,  Takashi Shoji ,  Takekazu Sakai

Inventor： Takeo Kuramoto ,  Masataka Watabe ,  Satoshi Noda ,  Takashi Shoji ,  Takekazu Sakai

IPC: B23K3/06 ,  B23K35/02 ,  B23K35/36 ,  H01L23/495 ,  H05K3/28 ,  H05K3/34 ,  B23K35/24

CPC classification number: H05K3/282 ,  B23K3/0607 ,  B23K3/0623 ,  B23K35/0244 ,  B23K35/3613 ,  B23K35/3615 ,  H01L23/49582 ,  H05K3/3484 ,  B23K2201/40 ,  B23K2201/42 ,  H01L2924/0002 ,  H05K2201/10984 ,  H05K2203/0425 ,  H05K2203/043 ,  H05K2203/0522 ,  H05K2203/0557 ,  H05K2203/0591 ,  H05K2203/124 ,  Y10T428/12556

Abstract: A method of forming a solder film on a metallic surface such as a pad of a metallic circuit of a printed circuit board and a lead frame of electronic parts, which is capable of forming a precise and fine pattern and which comprises selectively imparting tackiness to only a predetermined part of the metallic surface by means of a tacky layer-forming solution, adhering a powdered solder to the resulting tacky part, and then melting the solder by heating to thereby form a solder film.

Abstract translation: 在诸如印刷电路板的金属电路板的焊盘和电子部件的引线框架的金属表面上形成焊料膜的方法，其能够形成精确和精细的图案，并且包括仅选择性地赋予粘合性 通过粘性层形成溶液将金属表面的预定部分粘附到所得粘性部分上，然后通过加热熔化焊料从而形成焊料膜。

公开(公告)号：US5911356A

公开(公告)日：1999-06-15

申请号：US911458

申请日：1997-08-14

Applicant: Arata Tsurusaki

Inventor： Arata Tsurusaki

IPC: B23K1/008 ,  H05K3/00 ,  H05K3/34 ,  B23K31/02

CPC classification number: H05K3/3405 ,  B23K1/008 ,  B23K2201/42 ,  H05K2201/10371 ,  H05K3/0052 ,  Y10S174/34

Abstract: A method of attaching a lead part and a shield case for preventing a high-frequency signal from being leaked to a printed circuit board includes a solder coating step of coating solder so that the solder should cover the whole of an aperture provided through a printed circuit board into which a lead of the lead part is inserted and so that the solder should cover a part of an aperture provided through the printed circuit board into which an engagement portion of the shield case is inserted, a mounting step of inserting the lead of the lead part and the engagement portion of the shield case into the respective apertures to thereby mount the lead part and the shield case on the printed circuit board, and a soldering step of inserting the printed circuit board mounted with the lead part and the shield case into a reflowing furnace and melting the solder to thereby carry out soldering.

Abstract translation: 一种将引线部分和屏蔽壳体附接以防止高频信号泄漏到印刷电路板的方法包括：涂覆焊料的焊料涂覆步骤，使得焊料应覆盖通过印刷电路提供的整个孔 插入引线部分的引线的板，使得焊料应覆盖通过印刷电路板提供的孔的一部分，其中插入有屏蔽壳的接合部分的安装步骤， 导线部分和屏蔽壳体的接合部分分别插入相应的孔中，从而将引线部分和屏蔽壳体安装在印刷电路板上，以及焊接步骤，将安装有引线部分和屏蔽壳体的印刷电路板插入 回流炉并熔化焊料从而进行焊接。