公开(公告)号：US5661647A

公开(公告)日：1997-08-26

申请号：US473411

申请日：1995-06-07

Applicant: Robert D. Washburn ,  Robert F. McClanahan ,  Andrew A. Shapiro ,  Ramona G. Pond ,  Gerald P. Chernicky ,  William J. Council ,  Earl H. Martin

Inventor： Robert D. Washburn ,  Robert F. McClanahan ,  Andrew A. Shapiro ,  Ramona G. Pond ,  Gerald P. Chernicky ,  William J. Council ,  Earl H. Martin

IPC: H02M3/00 ,  H03F3/19 ,  H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/16 ,  H05K1/18 ,  H05K3/40 ,  H02M1/00 ,  B32B9/00

CPC classification number: H02M3/00 ,  H03F3/19 ,  H05K1/0206 ,  H05K1/16 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/162 ,  H05K1/165 ,  H05K1/183 ,  H05K2201/0209 ,  H05K2201/09054 ,  H05K3/0061 ,  H05K3/4053 ,  Y10T428/24926

Abstract: Electronic VHF/UHF power conversion circuitry is manufactured using the benefits of low temperature co-fired ceramic substrates to provide interconnection between the discrete components of the power conversion circuit, and integrate various non-semiconductor devices into the body of the low temperature co-fired ceramic structure, such as resistors, capacitors, inductors and transformers. Use of a low temperature co-fired ceramic structure as a substrate on and within which VHF/UHF power conversion circuitry is formed allows selection of various conductive and resistive inks to precisely form interconnection circuitry and selected non-semiconductor components which improves the stability and reduces the cost of VHF/UHF power conversion circuits.

Abstract translation: 使用低温共烧陶瓷基板的优点制造电子VHF / UHF功率转换电路，以提供功率转换电路的分立组件之间的互连，并将各种非半导体器件集成到低温共烧的体内 陶瓷结构，如电阻，电容，电感和变压器。 使用低温共烧陶瓷结构作为其上形成VHF / UHF功率转换电路的基板，可以选择各种导电和电阻油墨，以精确地形成互连电路和选择的非半导体部件，从而提高稳定性和降低 VHF / UHF功率转换电路的成本。

公开(公告)号：US5435733A

公开(公告)日：1995-07-25

申请号：US152342

申请日：1993-11-12

Applicant: Gerald P. Chernicky ,  Christopher M. Schreiber ,  Alan L. Kovacs ,  Bao Q. Le ,  Haim Feigenbaum

Inventor： Gerald P. Chernicky ,  Christopher M. Schreiber ,  Alan L. Kovacs ,  Bao Q. Le ,  Haim Feigenbaum

IPC: H05K3/32 ,  H01L21/60

CPC classification number: H05K3/325 ,  H01L2224/48091 ,  H01L2924/30107 ,  H01L2924/3011

Abstract: A Multi-Chip-Module or MCM (66) is mounted on a supporting motherboard (64). A plurality of first contact pads (99) are formed on the module (66) adjacent to its peripheral edge for interconnection with microelectronic components (70,72,74,76,78) mounted on the module (66). Second contact pads (94) are formed on the motherboard (64) adjacent to respective first contact pads (99). A flexible cable (96) includes controlled impedance microstrip or stripline conductor (98) with first and second gold dots (100,102) at their ends. A frame (104) resiliently presses the first and second gold dots (100, 102) into connection with respective first and second contacts (99,94) for interconnection thereof. The components (70, 72,74,76,78) on the module (66) can be hermetically sealed by a cover (80), and the module (66) and cable (96) can be hermetically sealed by a first resilient ring (112) which is compressed between the frame (104) and the cover (80), and a second resilient ring (114) which is compressed between the frame (104) and the motherboard (64). Alternatively, the cover (80) and the first ring (112) can be replaced by a cover (104a) which is integral with a frame (104'). An alternative connector (136) includes a flexible cable (146) which extends around an edge of a frame (144) to enable vertical stacking of MCMs (164) and/or backplanes (138) in any combination.

Abstract translation: 多芯片模块或MCM（66）安装在支撑主板（64）上。 多个第一接触焊盘（99）在与其外围边缘相邻的模块（66）上形成，用于与安装在模块（66）上的微电子部件（70,72,74,76,78）互连。 第二接触焊盘（94）形成在与相应的第一接触焊盘（99）相邻的母板（64）上。 柔性电缆（96）包括在其端部具有第一和第二金点（100,102）的受控阻抗微带线或带状线导体（98）。 框架（104）将第一和第二金点（100,102）弹性地按压以与相应的第一和第二触点（99,94）连接，用于互连。 模块（66）上的组件（70,72,74,76,78）可以被盖（80）气密地密封，并且模块（66）和电缆（96）可以被第一弹性环气密地密封 被压缩在框架（104）和盖（80）之间的第二弹性环（112）和压缩在框架（104）和母板（64）之间的第二弹性环（114）。 或者，盖（80）和第一环（112）可以由与框架（104'）成一体的盖（104a）代替。 替代连接器（136）包括围绕框架（144）的边缘延伸的柔性电缆（146），以实现任何组合的MCM（164）和/或背板（138）的垂直堆叠。