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1.发明授权Snap install EMI shields with protrusions and electrically-conductive members for attachment to substrates 失效快速安装具有突起的EMI屏蔽件和用于附接到基板的导电构件公开(公告)号：US07534968B2
公开(公告)日：2009-05-19
申请号：US11735811
申请日：2007-04-16
IPC分类号： H05K9/00
CPC分类号： H05K9/0032
摘要： Various embodiments provide EMI shields for substrates having at least one electrical component disposed thereon. In one embodiment, an EMI shield generally includes a cover having first and second protrusions and at least one electrically-conductive member disposed along an inner side of the cover. The electrically-conductive member may be compressed generally between the substrate and the cover when the substrate is captured generally between the electrically-conductive member and the first protrusion. In addition, a compressive clamping force may be generated by the engagement of the first protrusion with the substrate and the compression of the electrically-conductive member. This compressive clamping force may mechanically retain the cover to the substrate, and also compress the electrically-conductive member against at least one electrically-conductive surface disposed on the substrate, to establish electrical conductivity therebetween that is sufficient for EMI shielding performance.
摘要翻译： 各种实施例为其上布置有至少一个电气部件的基板提供EMI屏蔽。 在一个实施例中，EMI屏蔽件通常包括具有第一和第二突起的盖和沿盖的内侧布置的至少一个导电构件。 当基板被大体上在导电构件和第一突起之间被捕获时，导电构件可以大致地压缩在基板和盖之间。 此外，可以通过第一突起与基板的接合和导电构件的压缩来产生压缩夹紧力。 这种压缩夹紧力可以机械地将盖子保持在基板上，并且还将导电构件压靠在设置在基板上的至少一个导电表面上，以在它们之间建立电导率，其对于EMI屏蔽性能是足够的。
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公开(公告)号：USD549231S1
公开(公告)日：2007-08-21
申请号：US29244956
申请日：2005-12-16
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公开(公告)号：US07903431B2
公开(公告)日：2011-03-08
申请号：US11763157
申请日：2007-06-14
IPC分类号： H05K9/00
CPC分类号： H05K9/0032
摘要： A shielding apparatus is disclosed suitable for use in providing electromagnetic interference shielding for an electrical component on a substrate. The shielding apparatus includes a frame that is at least partially drawn in construction and is configured for installation to the substrate. Side walls of the frame generally surround the electrical component, and a cover is attachable to the frame for substantially covering the electrical component. The cover includes an upper surface having an inverted embossment formed therein, and a cover member extending generally downwardly from the upper surface adjacent the inverted embossment. The inverted embossment and cover member define a guide for guiding and receiving at least part of the frame into the guide when the cover is attached to the frame. The guide is configured to help facilitate and generally hold the cover in electrical contact with the frame when the cover is attached to the frame.
摘要翻译： 公开了一种适用于为基板上的电气部件提供电磁干扰屏蔽的屏蔽装置。 屏蔽装置包括至少部分地在结构上绘制并被构造成用于安装到基板的框架。 框架的侧壁通常围绕电气部件，并且盖子可附接到框架以基本上覆盖电气部件。 所述盖包括其上形成有倒置的压纹的上表面，以及从所述上表面大致向下延伸的盖构件，所述盖构件邻近所述倒置的压花。 倒置的压花和盖构件限定了一个引导件，用于当盖子附接到框架时将框架的至少一部分引导和接纳到引导件中。 该引导件构造成当盖子附接到框架时有助于便于和大体上保持盖子与框架电接触。
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公开(公告)号：US07262369B1
公开(公告)日：2007-08-28
申请号：US11431847
申请日：2006-05-10
CPC分类号： H05K7/20445 , H01L23/04 , H01L23/552 , H01L24/32 , H01L2224/73253 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01074 , H01L2924/01082 , H01L2924/12041 , H01L2924/12044 , H01L2924/14 , H05K9/0026 , H05K9/003 , H01L2924/00
摘要： According to various aspects of the present disclosure, exemplary embodiments are provided of EMI shielding apparatus capable of providing board level EMI shielding for one or more electronic components while also providing dissipation of heat generated by the one or more electronic components. In one particular embodiment, an apparatus generally includes a board level shield having at least one resiliently compressible EMI gasket disposed along at least a portion of the board level shield. At least one thermally-conductive compliant material is disposed relative to an inner surface of the board level shield and to the one or more electrical components. The at least one thermally-conductive material can form a thermally-conducting heat path from the one or more electrical components to the board level shield.
摘要翻译： 根据本公开的各个方面，提供了EMI屏蔽装置的示例性实施例，其能够为一个或多个电子部件提供电路板级EMI屏蔽，同时还提供由一个或多个电子部件产生的热量的耗散。 在一个特定实施例中，装置通常包括具有沿着板级屏蔽件的至少一部分布置的至少一个可弹性压缩的EMI垫片的电路板级屏蔽。 至少一个导热柔性材料相对于板级屏蔽的内表面和一个或多个电部件设置。 所述至少一种导热材料可以形成从所述一个或多个电气部件到所述电路板级屏蔽件的导热热路径。
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公开(公告)号：USD548738S1
公开(公告)日：2007-08-14
申请号：US29244955
申请日：2005-12-16
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6.发明授权EMI shielding and thermal management assemblies including frames and covers with multi-position latching 有权EMI屏蔽和热管理组件，包括具有多位锁定的框架和盖公开(公告)号：US07623360B2
公开(公告)日：2009-11-24
申请号：US11440618
申请日：2006-05-25
IPC分类号： H05K9/00
CPC分类号： H05K9/0032
摘要： According to various aspects of the present disclosure, exemplary embodiments are of assemblies capable of providing board level EMI shielding and heat dissipation of one or more electrical components. Other aspects relate to components of such assemblies. Further aspects relate to methods of using EMI shielding and thermal management assemblies. Additional aspects relate to methods of making EMI shielding and thermal management assemblies, and methods of making the components thereof.
摘要翻译： 根据本公开的各个方面，示例性实施例是能够提供一个或多个电气部件的板级EMI屏蔽和散热的组件。 其他方面涉及这种组件的部件。 其他方面涉及使用EMI屏蔽和热管理组件的方法。 另外的方面涉及制造EMI屏蔽和热管理组件的方法，以及制造其组件的方法。
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公开(公告)号：US20120276791A1
公开(公告)日：2012-11-01
申请号：US13546712
申请日：2012-07-11
IPC分类号： H01R13/02
CPC分类号： H01R13/2464 , H01R12/714 , H01R43/16
摘要： According to various aspects, exemplary embodiments are provided of electrical contacts, which may be used for establishing an electrical pathway between first and second electrically conductive surfaces. In an exemplary embodiment, an electrical contact may include an electrically conductive base member and at least one resilient contact member. The at least one resilient contact member may have a configuration at least partially defined by a laser cut in or into the electrically conductive base member. The at least one resilient contact member may also be formed so as to protrude outwardly from the electrically conductive base member.
摘要翻译： 根据各个方面，提供了电触点的示例性实施例，其可以用于在第一和第二导电表面之间建立电路径。 在示例性实施例中，电触点可以包括导电基底构件和至少一个弹性接触构件。 所述至少一个弹性接触构件可以具有至少部分地通过在导电基底构件中切入的激光而限定的构造。 所述至少一个弹性接触构件也可以形成为从导电基底部件向外突出。
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公开(公告)号：US20080310139A1
公开(公告)日：2008-12-18
申请号：US11763157
申请日：2007-06-14
IPC分类号： H05K9/00
CPC分类号： H05K9/0032
摘要： A shielding apparatus is disclosed suitable for use in providing electromagnetic interference shielding for an electrical component on a substrate. The shielding apparatus includes a frame that is at least partially drawn in construction and is configured for installation to the substrate. Side walls of the frame generally surround the electrical component, and a cover is attachable to the frame for substantially covering the electrical component. The cover includes an upper surface having an inverted embossment formed therein, and a cover member extending generally downwardly from the upper surface adjacent the inverted embossment. The inverted embossment and cover member define a guide for guiding and receiving at least part of the frame into the guide when the cover is attached to the frame. The guide is configured to help facilitate and generally hold the cover in electrical contact with the frame when the cover is attached to the frame.
摘要翻译： 公开了一种适用于为基板上的电气部件提供电磁干扰屏蔽的屏蔽装置。 屏蔽装置包括至少部分地在结构上绘制并被构造成用于安装到基板的框架。 框架的侧壁通常围绕电气部件，并且盖子可附接到框架以基本上覆盖电气部件。 所述盖包括其上形成有倒置的压纹的上表面，以及从所述上表面大致向下延伸的盖构件，所述盖构件邻近所述倒置的压花。 倒置的压花和盖构件限定了一个引导件，用于当盖子附接到框架时将框架的至少一部分引导和接纳到引导件中。 该引导件构造成当盖子附接到框架时有助于便于和大体上保持盖子与框架电接触。
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9.发明申请SNAP INSTALL EMI SHIELDS WITH PROTRUSIONS AND ELECTRICALLY-CONDUCTIVE MEMBERS FOR ATTACHMENT TO SUBSTRATES 失效SNAP安装带有导电和电导体元件的EMI板，用于连接到基板公开(公告)号：US20080106884A1
公开(公告)日：2008-05-08
申请号：US11735811
申请日：2007-04-16
IPC分类号： H05K9/00
CPC分类号： H05K9/0032
摘要： Various embodiments provide EMI shields for substrates having at least one electrical component disposed thereon. In one embodiment, an EMI shield generally includes a cover having first and second protrusions and at least one electrically-conductive member disposed along an inner side of the cover. The electrically-conductive member may be compressed generally between the substrate and the cover when the substrate is captured generally between the electrically-conductive member and the first protrusion. In addition, a compressive clamping force may be generated by the engagement of the first protrusion with the substrate and the compression of the electrically-conductive member. This compressive clamping force may mechanically retain the cover to the substrate, and also compress the electrically-conductive member against at least one electrically-conductive surface disposed on the substrate, to establish electrical conductivity therebetween that is sufficient for EMI shielding performance.
摘要翻译： 各种实施例为其上布置有至少一个电气部件的基板提供EMI屏蔽。 在一个实施例中，EMI屏蔽件通常包括具有第一和第二突起的盖和沿盖的内侧布置的至少一个导电构件。 当基板被大体上在导电构件和第一突起之间被捕获时，导电构件可以大致地压缩在基板和盖之间。 此外，可以通过第一突起与基板的接合和导电构件的压缩来产生压缩夹紧力。 这种压缩夹紧力可以机械地将盖子保持在基板上，并且还将导电构件压靠在设置在基板上的至少一个导电表面上，以在其间形成足够的EMI屏蔽性能的导电性。
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公开(公告)号：USD549706S1
公开(公告)日：2007-08-28
申请号：US29244957
申请日：2005-12-16
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