公开(公告)号：US20050082257A1

公开(公告)日：2005-04-21

申请号：US10487745

申请日：2002-09-09

Applicant: Gust Bierings ,  Bjarni Bjarnason ,  Goran Frennesson ,  Jenny Sjoberg

Inventor： Gust Bierings ,  Bjarni Bjarnason ,  Goran Frennesson ,  Jenny Sjoberg

IPC: C25F3/02 ,  C25F7/00 ,  H05K3/07 ,  C23F1/00

CPC classification number: H05K3/07 ,  C25F3/02 ,  C25F7/00

Abstract: Etching of copper on a card is achieved by applying an electrical voltage between a cathode (102) and the card (42), the card (42) thereby forming an anode. The cathode (102) and the card (42) are immersed in an electrolyte comprising a first component, which may be reduced from a first state in the form of an ion having a metal atom with a first positive oxidation number to a second state in the form of an ion having said metal atom with a second positive oxidation number, which is less than said first positive oxidation number. A first redox potential in the electrolyte for reduction from the first to the second state is larger than a second redox potential in the electrolyte for reduction of divalent copper ions to metallic copper. During the etching metallic copper on the card is oxidised and transferred into positively charged copper ions while the first component is reduced from its first state to its second state. The quality of the etched structures on the card is improved since no metallic copper is precipitated on the cathode.

Abstract translation: 通过在阴极（102）和卡（42）之间施加电压，卡（42）从而形成阳极来实现卡上铜的蚀刻。 将阴极（102）和卡（42）浸入包含第一组分的电解质中，该第一组分可以从具有第一正氧化数的金属原子的离子形式的第一状态还原为第二状态 具有第二正氧化数的具有所述金属原子的离子的形式，其小于所述第一正氧化数。 用于从第一状态到第二状态还原的电解质中的第一氧化还原电位大于用于还原二价铜离子至金属铜的电解质中的第二氧化还原电位。 在蚀刻期间，卡上的金属铜被氧化并转移到带正电荷的铜离子中，同时第一组分从其第一状态减少到其第二状态。 卡上蚀刻结构的质量得到改善，因为阴极上没有金属铜沉淀。

公开(公告)号：US20070166557A1

公开(公告)日：2007-07-19

申请号：US11597570

申请日：2005-05-27

Applicant: Matthias Keil ,  Goran Frennesson ,  Marc Beck ,  Babak Heidari

Inventor： Matthias Keil ,  Goran Frennesson ,  Marc Beck ,  Babak Heidari

IPC: B22C3/00 ,  B32B15/04

CPC classification number: B05D1/60 ,  B05D1/185 ,  B29C33/56 ,  B82Y10/00 ,  B82Y30/00 ,  B82Y40/00 ,  G03F7/0002 ,  G03F7/0017 ,  Y10T428/31678

Abstract: The invention relates to a novel metal mold having anti-adhesive properties comprising a base metal mold and an anti-adhesive layer comprising a fluorinated alkyl phosphoric acid derivative or a fluorinated alkyl poly-phosphoric acid derivative, including a phosphorous atom and an alkyl chain. The anti-adhesive layer is bonded directly onto a surface of the base metal mold. The base metal mold may be e.g. Nickel, and said fluorinated alkyl phosphoric acid derivative or said fluorinated alkyl poly-phosphoric acid derivative may be selected from the group consisting of phosphonic acids, phosphonic acids, phosphonates and phosphonate salts, phosphonates and phosphonate salts, or their respective oligomers, such that the phosphorous atom is coupled directly to the alkyl chain, such that the phosphorous atom is coupled directly to the alkyl chain.

Abstract translation: 本发明涉及一种具有抗粘性的新型金属模具，其特征在于包括贱金属模和包含磷原子和烷基链的氟化烷基磷酸衍生物或氟化烷基聚磷酸衍生物的防粘层。 抗粘剂层直接粘结在母模金属模的表面上。 贱金属模可以是例如。 镍和所述氟化烷基磷酸衍生物或所述氟代烷基聚磷酸衍生物可以选自膦酸，膦酸，膦酸酯和膦酸盐，膦酸盐和膦酸盐或它们各自的低聚物，使得 磷原子直接与烷基链结合，使得磷原子直接与烷基链结合。