公开(公告)号：US06430047B2

公开(公告)日：2002-08-06

申请号：US09412089

申请日：1999-10-04

申请人： Earl E. Wentzel ,  Brant R. Gourley ,  Gregory A. King ,  Paul F. Cisewski ,  Steven V. Stang ,  Gregory P. Micko ,  Brian J. Sandvold

发明人： Earl E. Wentzel ,  Brant R. Gourley ,  Gregory A. King ,  Paul F. Cisewski ,  Steven V. Stang ,  Gregory P. Micko ,  Brian J. Sandvold

IPC分类号： H05K720

CPC分类号： H05K1/0206 ,  G01R1/0408 ,  H05K3/28 ,  H05K3/305 ,  H05K3/42 ,  H05K2201/0209 ,  H05K2201/0959 ,  H05K2201/09918 ,  H05K2201/10674 ,  H05K2203/1394

摘要： A printed wiring board provides connection between a chip and a standard footprint layout of a test machine. An insulating substrate defines a chip receiving region having a plurality of chip connector pads on one side of the substrate for connection to bump contacts of custom integrated circuit chips. A plurality of layout connectors are in a layout connection region of the board and arranged in the standard footprint layout. Circuit traces provide electrical connection between the chip connectors and the layout connectors, and a solder stop on the substrate extends over the circuit traces between the chip receiving region and the layout connection region. A plurality of plated apertures extend through the substrate in the chip receiving region to a thermally conductive heat sink opposite the chip connectors. In use, a chip is mounted to the board in the chip receiving region and connected to the chip connectors to rigidly mount the chip to the board. A thermally conductive paste extends through the apertures to thermally connect the chip to the heat sink. The solder stop prevents solder connecting the chip to the chip connectors from wicking along the traces thereby preventing deformation of the bump contacts.

摘要翻译： 印刷电路板提供了芯片与测试机的标准贴装布局之间的连接。 绝缘衬底限定了在衬底的一侧具有多个芯片连接器焊盘的芯片接收区域，用于连接到定制的集成电路芯片的凸点触点。 多个布局连接器位于板的布局连接区域中并且以标准布局布局布置。 电路迹线提供芯片连接器和布局连接器之间的电连接，并且衬底上的焊料停止在芯片接收区域和布局连接区域之间的电路迹线上延伸。 多个电镀孔径穿过芯片接收区域中的衬底延伸到与芯片连接器相对的导热散热器。 在使用中，将芯片安装在芯片接收区域中的板上并连接到芯片连接器以将芯片刚性地安装到板上。 导热膏通过孔延伸，以将芯片热连接到散热器。 焊料阻止器阻止焊接芯片与芯片连接器的连接器沿着迹线芯吸，从而防止凸点触点的变形。

公开(公告)号：US08047650B2

公开(公告)日：2011-11-01

申请号：US12635489

申请日：2009-12-10

申请人： Martin A Mainster ,  Alan J Lang ,  Michael D Lowery ,  Jason C Pearson ,  Max A Weaver ,  Jean C Fleischer ,  Gregory A King

发明人： Martin A Mainster ,  Alan J Lang ,  Michael D Lowery ,  Jason C Pearson ,  Max A Weaver ,  Jean C Fleischer ,  Gregory A King

IPC分类号： G02C7/04 ,  G02C7/10 ,  A61F2/16

CPC分类号： G02C7/108 ,  A61F2/1659

摘要： Ophthalmic devices are provided having a violet-light vertical cut-off filter abruptly absorbs light between the wave lengths of between approximately and 400 nm and 450 nm such that a curve when plotted as percent transmission versus wavelength has the shape as depicted in FIG. 2. In one embodiment the ophthalmic devices are made from acrylates and the light absorbing compound is an Eastman Yellow 035 MA dye.

摘要翻译： 提供具有紫光垂直截止滤光片的眼科装置在约400nm至450nm之间的波长之间突然吸收光，使得当透射率相对于波长的百分比绘制时的曲线具有如图3所示的形状。 在一个实施方案中，眼用装置由丙烯酸酯制成，光吸收化合物是Eastman Yellow 035MA染料。

公开(公告)号：US08292428B2

公开(公告)日：2012-10-23

申请号：US13243455

申请日：2011-09-23

申请人： Martin A Mainster ,  Alan J Lang ,  Michael D Lowery ,  Jason C Pearson ,  Max A Weaver ,  Jean C Fleischer ,  Gregory A King

发明人： Martin A Mainster ,  Alan J Lang ,  Michael D Lowery ,  Jason C Pearson ,  Max A Weaver ,  Jean C Fleischer ,  Gregory A King

IPC分类号： G02C7/04 ,  A61F2/16

CPC分类号： G02C7/108 ,  A61F2/1659

摘要： Ophthalmic devices are provided having a violet-light vertical cut-off filter abruptly absorbs light between the wave lengths of between approximately and 400 nm and 450 nm such that a curve when plotted as percent transmission versus wavelength has the shape as depicted in FIG. 2. In one embodiment the ophthalmic devices are made from acrylates and the light absorbing compound is an Eastman Yellow 035 MA dye.

摘要翻译： 提供具有紫光垂直截止滤光片的眼科装置在约400nm至450nm之间的波长之间突然吸收光，使得当透射率相对于波长的百分比绘制时的曲线具有如图3所示的形状。 在一个实施方案中，眼用装置由丙烯酸酯制成，光吸收化合物是Eastman Yellow 035MA染料。