Method of manufacturing dummy gates of a different material as insulation between adjacent devices
    2.
    发明授权
    Method of manufacturing dummy gates of a different material as insulation between adjacent devices 有权
    制造不同材料的虚拟栅极作为相邻器件之间绝缘的方法

    公开(公告)号:US09059308B2

    公开(公告)日:2015-06-16

    申请号:US13564792

    申请日:2012-08-02

    摘要: Embodiments of the present invention include a semiconductor structure including two transistor structures separated by a dummy gate of a different material and methods for forming said structure. Embodiments including forming sacrificial gates on a semiconductor substrate, forming spacers on the sacrificial gates, forming source/drain regions adjacent to two sacrificial gates separated by a third sacrificial gate, and replacing the third sacrificial gate with an insulating material. The insulating material replacing the third sacrificial gate may serve as a dummy gate to electrically isolate nearby source/drain regions. Embodiments further include forming sacrificial gates on a semiconductor substrate, forming spacers on the sacrificial gates, forming source/drain regions adjacent to two sacrificial gates separated by a third sacrificial gate, and replacing the two sacrificial gates with metal gates while leaving the third sacrificial gate in place to serve as a dummy gate.

    摘要翻译: 本发明的实施例包括由不同材料的虚拟栅极隔开的两个晶体管结构的半导体结构和用于形成所述结构的方法。 实施例包括在半导体衬底上形成牺牲栅极,在牺牲栅上形成间隔物,形成与由第三牺牲栅极隔开的两个牺牲栅极相邻的源/漏区,以及用绝缘材料代替第三牺牲栅。 替代第三牺牲栅极的绝缘材料可以用作虚拟栅极以电隔离附近的源极/漏极区域。 实施例还包括在半导体衬底上形成牺牲栅极,在牺牲栅极上形成间隔物,形成与由第三牺牲栅极隔开的两个牺牲栅极相邻的源极/漏极区域,并且在离开第三牺牲栅极的同时用金属栅极替换两个牺牲栅极 到位作为虚拟门。

    Method of Manufacturing Dummy Gates of a Different Material as Insulation between Adjacent Devices
    3.
    发明申请
    Method of Manufacturing Dummy Gates of a Different Material as Insulation between Adjacent Devices 有权
    制造不同材料的虚拟门的方法作为相邻设备之间的绝缘

    公开(公告)号:US20140035045A1

    公开(公告)日:2014-02-06

    申请号:US13564792

    申请日:2012-08-02

    IPC分类号: H01L27/088 H01L21/336

    摘要: Embodiments of the present invention include a semiconductor structure including two transistor structures separated by a dummy gate of a different material and methods for forming said structure. Embodiments including forming sacrificial gates on a semiconductor substrate, forming spacers on the sacrificial gates, forming source/drain regions adjacent to two sacrificial gates separated by a third sacrificial gate, and replacing the third sacrificial gate with an insulating material. The insulating material replacing the third sacrificial gate may serve as a dummy gate to electrically isolate nearby source/drain regions. Embodiments further include forming sacrificial gates on a semiconductor substrate, forming spacers on the sacrificial gates, forming source/drain regions adjacent to two sacrificial gates separated by a third sacrificial gate, and replacing the two sacrificial gates with metal gates while leaving the third sacrificial gate in place to serve as a dummy gate.

    摘要翻译: 本发明的实施例包括由不同材料的虚拟栅极隔开的两个晶体管结构的半导体结构和用于形成所述结构的方法。 实施例包括在半导体衬底上形成牺牲栅极,在牺牲栅上形成间隔物,形成与由第三牺牲栅极隔开的两个牺牲栅极相邻的源/漏区,以及用绝缘材料代替第三牺牲栅。 替代第三牺牲栅极的绝缘材料可以用作虚拟栅极以电隔离附近的源极/漏极区域。 实施例还包括在半导体衬底上形成牺牲栅极,在牺牲栅极上形成间隔物,形成与由第三牺牲栅极隔开的两个牺牲栅极相邻的源极/漏极区域,并且在离开第三牺牲栅极的同时用金属栅极替换两个牺牲栅极 到位作为虚拟门。