公开(公告)号：US20140064546A1

公开(公告)日：2014-03-06

申请号：US13954223

申请日：2013-07-30

申请人： John B. Szczech ,  Gregory B. Servis ,  Peter Van Kessel ,  Peter V. Loeppert

发明人： John B. Szczech ,  Gregory B. Servis ,  Peter Van Kessel ,  Peter V. Loeppert

IPC分类号： H04R1/04

CPC分类号： H04R1/04 ,  H01L2224/48095 ,  H01L2224/48464 ,  H01L2224/73265 ,  H04R1/021 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003

摘要： A microphone assembly includes a cover, a substrate, at least one wall disposed and between and attached to the cover and the substrate, an acoustic transducer acoustically sealed to the lid, and an interposer. The interposer and the acoustic transducer are electrically connected without using the lid as an electrical conduit. The transducer and interposer are disposed one above the other and the transducer is supported by the interposer or by a pedestal.

摘要翻译： 麦克风组件包括盖，衬底，布置在盖子和基板之间并且附接到盖子和基板的至少一个壁，声学地密封到盖子上的声学传感器和插入器。 内插器和声换能器电连接，而不用盖作为电导管。 换能器和插入件彼此上下放置，并且换能器由插入器或基座支撑。